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The essence of competition in the semiconductor industry is talent competition, with a talent gap of at least 100000 people in China

2024.01.24 | Exhibtion news

Registration Open! Over 1000 Exhibitors to Gather at the Semiconductor Equipment Annual Conference – See You in Wuxi This September

2025.05.29 | Exhibtion news

CSEAC 2025 Sponsorship Opportunities — Put Your Brand in the Spotlight

2025.07.24 | Exhibtion news

CSEAC 2025 | September 4–6, 2025 | Wuxi Taihu International Expo Center Join China’s Leading Semiconductor Equipment & Materials Exhibition

2025.07.24 | Exhibtion news

CSEAC 2025 | September 4–6, 2025 | Wuxi Taihu International Expo Center Join China’s Leading Semiconductor Equipment & Materials Exhibition

2025.08.05 | Exhibtion news

CSEAC 2025 Booth Design Contest Countdown Begins!

2025.08.08 | Exhibtion news

Fengmi Talent Action · Industry-Education Integration

2025.08.12 | Exhibtion news

2025.08.23 | Exhibtion news

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Thursday, September 4th, 9:30-12:00

Hall A5, Taihu International Expo Center, Wuxi, China
Intelligent Sensing for the Future of Chips - Collaborative Innovation Forum on High-Precision Sensing Technology for Semiconductor Equipment

In semiconductor manufacturing, high-precision sensing technology directly determines the process stability of equipment and product yield. The perception and feedback of its control system on environmental parameters, working condition parameters, and material physical and chemical properties are extremely important. This forum brings together experts and scholars from semiconductor equipment manufacturers, sensor manufacturing enterprises, and research institutions to share the latest scientific research achievements and practical application cases, and jointly explore how to empower industrial upgrading through technological innovation.
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Jianrong Zhang 5other guests
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Guest：

Jianrong Zhang

Sale manager of Shanghai Xinzhou Technology Co.,Ltd.

He Mingsheng

Sales Director of FITOK(wuhan) Incorporated

Lin Jing

Semiconductor business leader of Tucsen Photonics Co.,Ltd.

Hideki Masuyama

General Manager of LOK-FiT Co.,Ltd.

Lei Wang

Deputy General Manager of Suzhou Baicon Sensor Technology Co.,Ltd.
Thursday, September 4th,09:30-17:00

Hall B1, Taihu International Expo Center, Wuxi, China
Forum on Power and Compound Semiconductor Industry Development

In modern fields such as energy, transportation, and communications, power semiconductors and compound semiconductors play an important and irreplaceable role. Currently, China has established a relatively complete and independently controllable industrial chain in this field, but it still faces various problems and dilemmas that need to be solved urgently. This forum focuses on the concomitant development of power and compound semiconductors with the digital economy system, as well as the potential development opportunities for compound semiconductor materials and equipment in new application scenarios in the future.
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+15

He Xiaoning 15other guests
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Guest：

He Xiaoning

Executive Vice Chairman and Secretary General of Shaanxi Semiconductor Industry Association

Shiqun Li

President of the Compound Semiconductor Industry Division, Beijing NAURA Microelectronics Equipment Co.,Ltd.

MA RONG YAO

General manager, China Resources(chongqing )Microelectronics Limited

Gilbert Zhou

President, AccoPower Semiconductor Co.,Ltd.

Ding Guohua

President, Suzhou Convert Semiconductor Co.,Ltd.

Mr.Su DONG

Vice President, Jiangsu Leuven Instruments Co., Ltd.

Zhang Tao

Advanced packaging technology expert, HUAYI MICROELECTRONICS CO.,LTD.

Pan Liu

Associate Professor，Fudan University

Zhou Hong

Professor, Xidian University

Tangjun

vice general manager, CEC compound Semiconductor Co.,Ltd.

Chen Xianglong

Deputy General Manager,Qingdao SRI Intellectual Technology Co.,Ltd.

Huang wei

Professor, Jiang Nan University

YANAN.PANG

Wide Bandgap Power Semicond, SHANGHAI PRISEMI ELECTRONICS CO.,LTD.

Nan Jiang

CEO, Wuxi Powersemilab Co.,Ltd.

Ma Zhiyong

Professor, Beijing Xinchuang Zhiyuan Intellectual Property Consulting Service Co.,Ltd.
Thursday, September 4th,09:30-17:00

Hall B3, Taihu International Expo Center, Wuxi, China
Forum on Global Semiconductor Industry Chain Innovation and Development

The current global distribution pattern of the semiconductor industry is characterized by the coexistence of multipolarity and regionalization, with a wide-ranging industrial chain layout. Different countries and regions possess differentiated advantages in various links of the industrial chain. This forum will invite experts, scholars, and enterprise representatives from domestic and foreign research institutions and enterprises as speakers, aiming to help participants understand the advantages of domestic industrial clusters. It is expected that through this forum, we can jointly promote the transfer of technological innovation achievements between regions, advance the "dual circulation" development pattern, and enhance the resilience of regional industrial chains. Meanwhile, it will facilitate learning, exchanges, and cooperation among enterprises from different regions, explore opportunities in global layout, and inject new impetus into the prosperity of the global semiconductor industry.
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+20

Chen Xianbing 20other guests
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Guest：

Chen Xianbing

JSG Japan Co.,Ltd, General Manager

Sunil G Acharya

VP, Semiconductor Fabless accelerator Lab

Xu Yujie

Deputy General Manager, Hitachi High-Tech (Shanghai) Co.,Ltd.

Chen Xiang

Deputy Director of Semiconductor Materials Sales Department & General Manager of Beijing Branch, Resonac (China)

Ma Qinghai

General Mananger, SMC Automation China Co.,Ltd.

Satoru Oyama

CEO, Grossberg LLC

Vin Zhou

Engineering Manager, VAT Vacuum Valves (Shanghai) Co.,Ltd.

Snow Xue

Senior BD Manager, Broadcom

CJ Lee

Executive Director, EXACTA INTERGRATED ENGINEERING SDN BHD

Andrew Chan Yik Hong

Executive Director, Malaysia Semiconductor Industry Association

Wenbing Kang

Technical Advisor, ATD Japan Ltd.

Dr. Seungcheol Oh

CTO, TYST

Chen Dengyun

CTO, RORZE IAS Inc.

Andy Song

Sr. Offering Specialist, Honeywell Sensing Solutions

Thomas Tong

Senior process manager, BTU International Inc.

Berthold Ocker

Director of Business Unit Semiconductor, Singulus Technologies AG

Lou Hutter

CEO, Lou Hutter Consulting LLC

Nahmon Lee

CEO, TYST

Andrew Yin

CTO，SEMC Semiconductor Equipment (Taizhou) Co.,Ltd.

Charlie Sun

General Manager, Lezi Xinchuang Automation Equipment (Shanghai) Co.,Ltd.
Friday, September 5th, 09:00-16:30

Plum Blossom Hall, Wuxi Juna Grand Hotel
The 17th Integrated Circuit Packaging and Testing Industry Chain Innovation and Development Forum and Yangtze River Delta Integrated Circuit Advanced Packaging Development Conference
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+15

Ye Tianchun 15other guests
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Guest：

Ye Tianchun

Vice Chairman and Secretary-General of the China Integrated Circuit Innovation Alliance

Dr. Simon YANG

Chairman of ICLEAGUE & XMC, Deputy Chairman of Yangtze Memory Technologies Co.,Ltd. (YMTC)

Shouyi Yin

Vice Dean of the School of Integrated Circuits at Tsinghua University

Chengyin Yuan

Secretary-General, China Automotive Chip Industry Innovation Strategic Alliance

Dr. Liu Fengman

Vice President of National Center for Advanced Packaging Co.,Ltd.(NCAP China)

Liu Weiping

Chairman of Beijing Empyrean Technology Co.,Ltd.

Yuming Zhang

Chief Scientist, Huatian Technology

LIU Qinrang

Vice-dircetor, National Digital Swithing System Engineering & Technology R&D Center

Dr. Hong Xie

CVP, TF Microelectronics

De Ma

Associate Professor and Doctoral Supervisor, College of Computer Science and Technology, Zhejiang University

Chao Guo

Deputy general manager of iSABers Group Co., Ltd.

DaquanYu

Chairman, Xiamen Sky Semiconductor Technology Co.,Ltd.

Chen Chuan

Associate Research, INSTITUTE OF MICROELECTRONICS OF CHINESE ACADEMY OF SCIENCES

Li Taylor

Senior Manager, JCET

Libbert Peng

Vice President of Anji Microelectronics Technology (Shanghai) CO.,LTD.
Friday, September 5th,9:30-16:25

Hall A1, Taihu International Expo Center, Wuxi, China

The Innovation Conference on CPO(Co-Packaged Optics) and Heterogeneous Integration Technology

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TIME: Friday, September 5th, 09:30-16:30 Venue: Hall B3, Taihu International Expo Center, Wuxi, China

Hall B3, Taihu International Expo Center, Wuxi, China

Forum on Optical Chip Industry Chain Collaborative Development

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+12

Xu Dongmei 12other guests

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Guest：

Xu Dongmei

Deputy Secretary General of China Semiconductor Industry Association, and Secretary General of its Sealing and Testing Branch

Shu Qin

Secretary-General, Jiang Su Semiconductor Industry Association

Jessie Pan

Secretary-General, Guangdong Integrated Circuit Industry Association

Ralph Zhang

Marketing Director, CanSemi Technology Inc.

Xinlun Cai

President, Liobate

Siyuan Yu

Professor of Sun Yat-sen University & Deputy Director, Administration Center of Guangzhou Innovation Center of Optoelectronics and Microelectronics (GICOM) & Fellow of OPTICA

Canxiong Lai

Senior engineer of China Electronic Product Reliability and Environmental Testing Research Institute

VR Cao

Managing Partner of Vastbloom Capital & Founder of Inside the Electronics Industry

Yan Cai

Director of Shanghai Industrial μTechnology Research Institute & Researcher of Shanghai Institute of Microsystem and Information Technology

Yu Xie

Chairman, Shenzhen Yotta Image Automation Technology Co.,Ltd.

Qiang Hu

Deputy Director, Semiconductor Technology Research Department, Ji Hua Laboratory

Wang Shun

Associate Professor of Guangdong University of Technology
Friday, September 5th,09:20-17:00

Hall B1, Taihu International Expo Center, Wuxi, China
Forum on Semiconductor Packaging and Testing Advanced Technology and Supporting Industry Chain Integration Development

This forum has gathered corporate guests from the materials and equipment sectors of semiconductor manufacturing and packaging/testing, as well as experts and scholars from organizations such as innovation alliances and industry associations. It introduces the characteristics of new materials and equipment driven by new applications and new processes brought about by product iteration, along with the underlying logical chain, focusing on demonstrating the vitality that innovation has brought to the semiconductor industry.
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+14

Zhikuang Cai 14other guests
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Guest：

Zhikuang Cai

Director of Science and Technology Department, Nanjing University of Posts and Telecommunications

Wang Chengqian

Research Fellow, China Key System & Integrated Circuit Co.,Ltd.

Jian Zhang

Senior Director, Tongfu Microelectronics Co.,Ltd.

Jessica Zhou

President of Academy, Energy Intelligent Equipment (Wuxi) Co.,Ltd.

Huaguang Bao

Professor,Nanjing University of Science and Technology

SHAO HONG

Senior Director of Marketing and Sales, CR Micro FBG

Kaihong Zhang

General Manager, CMC electronics CO.,LTD.

Kai Pei

Deputy general manager, Dalian Creditchem Semiconductor Materials Co.,Ltd.

Ye Lezhi

PHD & Deputy Secretary-General of ChinaElectronic Special Equipment Industry Association

Jiulin Shen

Research and Development Manager, Huatian Technology (Kunshan) Electronics Co., Ltd.

Jeff

General Manager, Jiangsu NEXIC Technology Co.,Ltd.

Li Yang

manager of the R&D department, Wuxi Zhongwei Hi-Tech Electronics Co.,Ltd.

Wang Ronghua

Vice President, RUNXIN MICROELECTRONICS (DALIAN)CO.,LTD.

Professor Yang Daoguo

Guilin University of Electronic Technology
September 5th,09:20-11:40

Hall A5, Taihu International Expo Center, Wuxi, China
Forum on Innovation and Development of Semiconductor Measurement and Test Equipment

Semiconductor metrology and testing constitute a critical link in ensuring the quality and production efficiency of semiconductor products. This forum brings together experts, scholars, and technical personnel from the industry to jointly explore the latest technological advancements, market trends, and application prospects of semiconductor metrology and testing equipment.
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+8

Lu Jian 8other guests
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Guest：

Lu Jian

Vice Chief Engineer, the 58th Research Institute of China Electronics Technology Group Corporation(CETC）

Jiangang Han

Senior Account Manager, cyber TECHNOLOGIES GmbH

Seddy Chu

Marketing VP, Nanjing ZhongAn Semiconductor Equipment Co.,Ltd.

Coast Yan

Deputy Head of Suzhou TZTEK Technology Co.,Ltd.

ZhangChaoqian

Product Director, Beijing Electronics Inspection and Metrology Equipment Co.,Ltd.

Richard NIE

General Manager of the Business Division, Yuwei Semiconductor Technology Co.,Ltd.

Ge Liang

Business Development Director of Advantest (China) Co.,Ltd.

Sicheng Zhao

Product Director of Herch Opto Electronic Technology Co.,Ltd.
Friday, September 5th,13:30-17:00

Hall A5, Taihu International Expo Center, Wuxi, China
Forum on Investment and Financing in Semiconductor Equipment and Core Components

Semiconductor equipment and core components both fall into the category of heavy assets, requiring substantial capital investment in the early stages of manufacturing. Investors also play a significant role in the development of the industry. This forum invites guests to conduct in-depth discussions on the evolution of investment and financing trends in the field of semiconductor equipment and components in recent years, and to analyze the strategic synergy between investment activities and the development of manufacturing capabilities.
View details
+15

Ji Zongliang 15other guests
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Guest：

Ji Zongliang

Founder, Jihua Capital

Tang Deming

CEO, Avant Semiconductor Equipment Company,LTD

Fang Wenqiang

Senior Post Sales Process Director, Shanghai Bangxin Semi Technology Co.,Ltd.

Mason

Director of Customer center, Huaxin(Jiaxing) Intelligent Manufacturing Co.,Ltd.

Denny Yu

Vice President of Marketing, Suzhou iWISEETEC Co.,Ltd.

Li Chunhua

GM, CAPT Semiconductor Technology Co.,Ltd.

Fisher Liu

Founding Partner of Shanghai Wisdom Capital Co.,Ltd.

TINGWEN CHEN

Vice President, Shanghai Jinqiao Lin-gang Comprehensive Zone Investment & Development Co.,Ltd.

LI WEIMIN

CTO&Vice Chairman, Jiangsu Leadmicro Nano-Technology Co.,Ltd.

Wang Jun

Chairman of mtm capital

Zhu Peiwen

Chairman & General Manager of Jiangsu Shenzhou Semiconductor Technology Co.,Ltd.

Zhang Peng

Partner, TEDA Venture Capital Corporation Limited

ZhaoXiang Wang

Chairman, Shanghai Bangxin Semiconductor Technology Co.,Ltd.

ZHANG HUI

General Manager, Beijing Yesemi Precision Semiconductor Co.,Ltd.

Paul Xu

Senior Executive Director, GUOTAI HAITONG SECURITIES CO.,LTD.

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