22
Totally search
Search Results
23
Totally search
-
Hall B3, Taihu International Expo Center, Wuxi, China2024 Chairman Forum on Semiconductor Manufacturing and MaterialsWith the continuous expansion of the global semiconductor market and the emergence of emerging technologies, the field of semiconductor manufacturing and materials is facing unprecedented opportunities and challenges. On the one hand, the rapid development of emerging technologies such as artificial intelligence, the Internet of Things and 5G communication has brought huge market demand to the semiconductor industry; on the other hand, the slowdown of Moore's law has put forward higher requirements for semiconductor manufacturing and material technology, which requires continuous innovation to break through technological bottlenecks. Against this background, the "2024 Semiconductor Manufacturing and Materials Chairman Forum" is held to gather industry elites, plan industrial development, and promote technological innovation and industrial upgrading.
Guest：
DaquanYuchairman, Xiamen sky Semiconductor Technology Co., Ltd
Liu XianbingChairman and General Manager of Suzhou Kema Materials Technology Co., Ltd
Libbert PengVice President, Anji Microelectronics Technology (Shanghai) Co., Ltd
JianglongHanChairman and General manager, Jiangsu Huahai Chengke New Material Co.,LTD
Li WeiShanghai Silicon Industry Group Co., Ltd. - Executive Vice President and Secretary of the Board of Directors
Jun HouChairman, Zhejiang Aufirst Material Technology Co., Ltd.
G.P ZhangChairman, Shenzhen Samcien Semiconductor Materials Co., Ltd.
Shen QiChairman, Jiangsu Yoke Technology Co.,Ltd -
Hall B3, Taihu International Expo Center, Wuxi, China2024 Forum on New Devices and New Processes Driving Innovation in New Materials and New EquipmentAt present, the global scientific and technological competition is increasingly fierce, and new technologies in semiconductors, new energy, intelligent manufacturing and other fields are emerging one after another, putting forward higher requirements for devices, processes, materials and equipment. The emergence of new devices not only improves the performance and efficiency of products, but also provides the possibility of the application of new technologies; the breakthrough of new processes has promoted the improvement of manufacturing level, reduced production costs, and improved production efficiency; the research and development of new materials provides more options for the innovative design of products, satisfying different fields Demand; and the birth of new equipment has further accelerated the transformation and industrialization of scientific and technological achievements.
Guest：
Pengfei JiangVice president, Shanghai Sinyang Semiconductor MateriaLs Co., Ltd.
Guo YiwuSecretary General of Shanghai Integrated Circuit Industry Association
Bing LiuSVP, Shanghai Institute of IC Materials
Lifeng ChenSenior Director, Infineon
Herman LeeSenior VP, Business Development Center, Xinlian Microelectronics Company Limited
Ni XiaofengSr. Director, Tokyo Electron (Shanghai) Limited
SHEN JingDepartment Manager, HORIBA
Lily FengSr.Director, SEMI -
Hall B3, Taihu International Expo Center, Wuxi, China2024 Forum on Investment and Financing in Semiconductor Equipment and Core ComponentsIn today's rapidly changing science and technology, semiconductor equipment and core components, as the foundation and core of the semiconductor industry, are directly related to the competitiveness and future direction of the whole industry. With the gradual recovery of the global semiconductor market and the continuous innovation of technology, the field of semiconductor equipment and core components is ushering in unprecedented development opportunities and challenges.
Guest：
Ji ZongliangFounder Partner of Jihua Capital
Nie XiangChairman of Qingdao Sifang Sirui Intelligent Technology Co., Ltd
Adson SuPresident, Hongyang Semi-Equipment Inc.
Juby LinGnenral Manager, Feejoy Technology(ShangHai)Co.,Ltd.
Yang YangExecutive Deputy GM & CTO, Attach Point Intelligent Equipment Ltd.
Xiaoyong GuCEO, Linkwise Technology (Suzhou)Co., Ltd. -
Hall B6, Taihu International Expo Center, Wuxi, ChinaChina Electronic Special Equipment Industry Association Semiconductor Equipment Annual MeetingSince its establishment, the Annual Conference of Semiconductor Equipment of China Electronic Special Equipment Industry Association has been committed to building an efficient and professional communication platform, bringing together industry elites, experts, scholars and enterprise representatives around the world to jointly discuss the latest trends, technological innovation, market opportunities and challenges in the field of semiconductor equipment. Click the question. Through the successful holding of the annual meeting, it has not only promoted in-depth exchanges and cooperation inside and outside the industry, but also promoted the sustainable and healthy development of the semiconductor equipment industry.
Guest：
Li JinxiangVice Secretary General of China Electronics Special Equipment Industry Association - Huada Semiconductor Co., Ltd. - Shanghai Jita Semiconductor Co., Ltd. - Director - Chief Engineer
Xu KaidongChairman and CEO of Jiangsu Luwen Instrument Co., Ltd
Chen XinyiTuojing Chuangyi (Shenyang) Semiconductor Equipment Co., Ltd. - Deputy General Manager
Fly zhangR&D Deputy GM, Suzhou iWISEETEC Co.,Ltd
Li ChangzheTorrance Semiconductor Equipment (Qidong) Co., Ltd. - Deputy General Manager
Jin CunzhongExecutive Deputy Secretary General of China Electronics Special Equipment Industry Association
Wang YanqingPioneer Holding Group Co., Ltd. - Wuxi Pioneer Group - Chairman
Nie XiangChairman of Qingdao Sifang Sirui Intelligent Technology Co., Ltd -
Hall A1, Taihu International Expo Center, Wuxi, China2024 Forum on Advanced Packaging Technology and Equipment-Materials Collaborative DevelopmentAt present, the global semiconductor industry is undergoing rapid change. As an important link in the semiconductor industry chain, the development of advanced packaging technology is directly related to the competitiveness of the whole industry. With the wide application of emerging technologies such as 5G, artificial intelligence and the Internet of Things, the demand for semiconductor products continues to grow, and the requirements for packaging technology are also increasing. Therefore, strengthening the coordinated development of advanced packaging technology and equipment materials, and promoting technological innovation and industrial upgrading, has become an important task of the semiconductor industry.
Guest：
He YunboChairman of Guangdong Ada Intelligent Equipment Co., Ltd
Zhou YunDirector of Precision Cutting Division of Shenzhen Tengsheng Precision Equipment Co., Ltd
Desmond HorDeputy General Manager ,Jiangsu Leadlap Semiconductor Technology Co.Ltd
Ben ZhouSales Director, SUSS MicroTec (Shanghai) Ltd.
Devin LiuGeneral Manager, Shenzhen Dream Launch Semiconductor Equipment Co., Ltd.