Forum on Power and Compound Semiconductor Industry Development

He Xiaoning, a doctoral graduate from Xi'an Jiaotong University, currently serves as a professor in the Department of Integrated Circuits at Xi'an Jiaotong University, the general manager of Shaanxi Semiconductor Leading Technology Center Co., Ltd., the executive director of the China Semiconductor Industry Association, the vice chairman of the China Semiconductor Industry Association Integrated Circuit Design Branch, the executive vice chairman and secretary-general of the Shaanxi Semiconductor Industry Association, and the deputy director of the National Engineering Center for Wide Bandgap Semiconductors. She has long been engaged in research on cutting-edge common technologies in semiconductors and their industrial applications. She has won multiple awards such as the first prize for technological inventions in Shaanxi Province and has been selected as a talent in Sanqin and Shaanxi Province for scientific and technological innovation and entrepreneurship.

Li Shiqun graduated in 2012 and then joined NAURA Microelectronics Equipment Co., Ltd. He has been engaged in market sales-related work for over 13 years and possesses extensive experience in semiconductor equipment sales.

Mr. Ma Rongyao, a master's graduate in microelectronics from the University of Electronic Science and Technology of China, has been dedicated to the technological development of power devices. He previously worked at MPS and possesses extensive experience and achievements in the research and development of integrated power devices, medium and low voltage discrete devices, and high voltage discrete devices. He has obtained dozens of patents for technology in the United States and China. Currently, he serves as the Vice President of the High Voltage Product Line in the Power Device Business

Gilbert Zhou, AccoPower President, Director, One of the core founders and director of AscenPower. He is a technical expert in the field of semiconductors and integrated circuits.Senior Engineer. He holds a master's degree in engineering, an MBA degree from Webster and Shanghai University of Finance, and is the founding president of Xi 'an Jiaotong University's microelectronics alumni association. He has been deeply involved in the field of semiconductor application technology for more than 30 years, and has rich experience. He often participates in speeches at industrial activities, and his unique opinions are widely recognized in the industry.

Ding Guohua, male, Han ethnicity, born in 1963 in Zhangjiagang, Jiangsu Province, is the Chairman of Suzhou Convert Semiconductor Co., Ltd. As a member of the Communist Party of China, he has been recognized as a National Leading Talent in Technology Entrepreneurship (under the National "Ten Thousand Talents Plan"), a Gusu Leading Talent, and an Outstanding Individual in Innovation and Entrepreneurship in Jiangsu Province.

He also holds several social roles, including serving as an expert for the Jiangsu Provincial Department of Industry and Information Technology, a part-time corporate mentor at Xidian University, and the Vice President of the Microelectronics Alumni Association of Xi'an Jiaotong University.

Zhang Tao, a senior packaging technology expert at Huayi Microelectronics Co., Ltd, has 12 years of experience in power semiconductor discrete device product development and project management. I have led the mass production and development of packaging platforms including ultra-thin chip packaging, 8-inch wafer Back Grinding and Back Metallization process(BGBM-CP), Cu clip bonding process, PPAK series, TOLL, TOLT, etc. In 2015, I won the second prize for scientific and technological progress in Tianshui City, Gansu Province for my ultra-thin chip packaging technology, and participated in the compilation of "Power Semiconductor Packaging Technology" (published in 2021). Previously awarded the title of Technology Innovation Model by Huatian Electronics Group. Currently serving as a mentor for the "Packaging Testing Class" of Fudan University's school enterprise cooperation enterprise and participating in graduate training.

Tang Jun, PhD, is a top talent in Ningbo City. He is currently the Vice General Manager of CEC compound Semiconductor Co.,Ltd.and an off campus master's supervisor at Huazhong University of Science and Technology. Engaged in long-term research and industrialization of third-generation semiconductor GaN and SiC epitaxial technology, participated in multiple national key research and development projects, and applied for more than 40 invention patents.

Chen Xianglong, Deputy General Manager of Qingdao SRI Intellectual Technology Co., Ltd. Since 2018, managing global sales and European R&D center.After the acquisition of Finnish Beneq by SRII, he successfully integrated domestic and international teams to achieve a comprehensive upgrade of ALD product lines. Since 2022, he has led the ALD and Ion Implantation sales teams to accelerate the development of the domestic semiconductor market. Under his leadership, SRII has rapidly grown into a leading global high-end semiconductor equipment manufacturer, serving more than500 customers across more than 40 countries and regions.

Yanan Pang has over ten years of experience in GaN research and development and has been deeply involved in the field of wide bandgap semiconductors. He is fully responsible for the wide bandgap semiconductor product line of Prisemi. He has led the development and successfully mass-produced a variety of GaN products covering low, medium and high voltage series, achieving large-scale production and stable shipment of products. The products he developed have leading performance and reliable quality, and have been highly recognized by core customers and achieved continuous repurchase.

Dr. Nan Jiang, graduated from Technical University of Chemnitz, Germany. He worked for Heraeus Electronics in Germany, participated in the R&D of advanced packaging materials; In 2019, he returned to China to establish Guangdong Nengxin Semiconductor .CO, Ltd. in Foshan; Later, he was appointed as an associate researcher at Hefei Comprehensive National Science Center, responsible for the construction of power device platforms; In 2023, Wuxi Powersemilab Co., Ltd. was founded to provide solutions for dynamic parameter tests and dynamic reliability tests of SiC devices.

1. In the context of intensifying global competition and technological rivalry, China's semiconductor equipment industry faces dual challenges of technological innovation breakthroughs and compliance risk management, with intellectual property disputes becoming increasingly prevalent both domestically and internationally. This presentation will examine three critical dimensions of IP protection and compliance management in semiconductor equipment development:(1)Patent offense-and-defense strategies and barrier construction for core technologies under asymmetric competitive conditions;(2)End-to-end IP compliance risks and their management mechanisms throughout business operations;(3)Key IP queries and response tactics during STAR Market listings and related financing activities.