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The essence of competition in the semiconductor industry is talent competition, with a talent gap of at least 100000 people in China

2024.01.24 | Exhibtion news

Registration Open! Over 1000 Exhibitors to Gather at the Semiconductor Equipment Annual Conference – See You in Wuxi This September

2025.05.29 | Exhibtion news

CSEAC 2025 Sponsorship Opportunities — Put Your Brand in the Spotlight

2025.07.24 | Exhibtion news

CSEAC 2025 | September 4–6, 2025 | Wuxi Taihu International Expo Center Join China’s Leading Semiconductor Equipment & Materials Exhibition

2025.07.24 | Exhibtion news

CSEAC 2025 | September 4–6, 2025 | Wuxi Taihu International Expo Center Join China’s Leading Semiconductor Equipment & Materials Exhibition

2025.08.05 | Exhibtion news

CSEAC 2025 Booth Design Contest Countdown Begins!

2025.08.08 | Exhibtion news

Fengmi Talent Action · Industry-Education Integration

2025.08.12 | Exhibtion news

2025.08.23 | Exhibtion news

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Monday, August 31st, 09:30-12:00

Hall A5, Taihu International Expo Center, Wuxi, China

Seminar on the Development of Artificial Intelligence and Electronic Manufacturing Equipment

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Monday, August 31st, 13:30-17:15

Hall A5, Taihu International Expo Center, Wuxi, China

Global Semiconductor CEO Forum

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Monday, August 31st, 09:30-12:00

Hall B5, Taihu International Expo Center, Wuxi, China

Forum on New Devices and Processes Driving Innovation and Development of New Materials and Equipment

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Tuesday, September 1st, 09:30-12:00

Hall B5, Taihu International Expo Center, Wuxi, China

New Product and Technology Launch

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Tuesday, September 1st, 09:30-17:15

Hall B4, Taihu International Expo Center, Wuxi, China

Forum on the Platformization of Semiconductor Equipment and Synergy among Core Parts

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Tuesday, September 1st, 13:30-17:15

Hall B5, Taihu International Expo Center, Wuxi, China

Challenges of Industrial Robots in Smart Manufacturing

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Tuesday, September 1st, 09:30-17:15

Hall A4, Taihu International Expo Center, Wuxi, China

Human Resources: Thematic Roadshow on the Commercialization of University-Industry-Research Collaboration

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Tuesday, September 1st, 09:30-12:00

Wuxi International Conference Center,Wuxi, China

The 18th Integrated Circuit Packaging and Testing Industry Chain Innovation and Development Forum (CIPA 2026)

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Wednesday, September 2nd, 09:30-12:00

Hall A6, Taihu International Expo Center, Wuxi, China

Forum on the Collaborative R&D in Advanced Packaging Technologies for the AI Era

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