Intelligent Sensing for the Future of Chips - Collaborative Innovation Forum on High-Precision Sensing Technology for Semiconductor Equipment

Graduated from Huaqiao University with a master's degree in Nonlinear Optics, with 12 years of experience in software and hardware system integration in the semiconductor industry, and has close cooperation with Leading semiconductor enterprises both domestically and internationally.

He Mingsheng， who works in the communication and semiconductor industries. I have worked at Huawei for more than 10 years and have been responsible for sales and service teams in semiconductor component companies for over 5 years. In recent years, he has led his team to work closely with leading domestic semiconductor enterprises to advance the replacement of domestic components, and certain progress has been made in this regard.

As Tucsen Photonics' Semiconductor Business Leader, she has 15 years of end-to-end experience in the imaging field, honed across R&D, technology, marketing, and sales. Proficient in product development principles and industry standards, with deep insights into customer needs. In recent years, has led the team to focus on the semiconductor metrology and inspection market, gaining in-depth understanding of industry pain points and domestic substitution pathways. The team provides high-line-frequency TDI cameras and deep-cooling scientific cameras to leading enterprises, overcoming multiple critical "bottleneck" technical challenges.

Mr. Hideki Masuyama is a pioneering figure in the field of UHP pressure sensors for semiconductors, recognized for both his technological contributions and global market development. He began his career at Nagano Keiki, where he played a key role in the R&D and standardization of Japan’s first-generation UHP pressure sensors. The products he led in development were the first to obtain SEMI F20 certification, marking a significant step in bringing Japanese UHP technology to the global stage. Currently serving as the President of LOK-FIT Co., Ltd., he is dedicated to advancing the third-generation semiconductor market by building localized clean and service systems, driving the standardization and large-scale adoption of UHP sensors in high-end global applications.

Currently serving as Deputy General Manager at BICCNS, previously worked at several Fortune 500 sensor companies, with 18 years of experience in the sensor industry. He has long focused on the deep integration of sensor design, manufacturing processes, and application scenarios, specializing in the development of high-reliability, high-precision sensor solutions. He is committed to providing customers with stable and reliable products as well as professional technical support.