Forum on Global Semiconductor Industry Chain Innovation and Development

2002 Received a master's degree in Physical Electronics from Fudan University

2002-2004 served as a process engineer in the Lithography Engineering Department of Grace Semiconductor

2004 joined the Semiconductor Systems Division of Hitachi High-Tech (Shanghai) Co., Ltd. and was responsible for the application of Metrology and Inspection equipment. He has successively held the positions of senior engineer, manager and deputy general manager.

Mr. Chen Xiang currently works as the deputy general manager of the semiconductor materials sales department at Resonac(China) Corporation and concurrently serves as the general manager of the Beijing branch. He is mainly responsible for the marketing of semiconductor wafer materials and packaging materials in the Chinese market and also manages the marketing of wiring board materials in the North China market. Prior to this, he worked as a process engineer manager at STATS ChipPAC (Shanghai) Co., Ltd.

Ma Qinghai, senior economist, SMC global director, general manager of SMC China; as an early entrepreneur of SMC China, he participated in and presided over the establishment of a research and development center and four modern manufacturing plants in Beijing. In recent years, he replanned the business blueprint of SMC China Asia Pacific, reorganized the marketing system of SMC China, and comprehensively promoted the SMC BCP (Business Continuity Plan) plan, SDGS business, energy saving & CO2 reduction business, and created a high-end equipment and core parts supporting enterprise with a value of tens of billions.

Sales&Marketing in Tokyo Electron, General manager in Fujitsu Semiconductor. Semiconductor senior analyst in Gartner and Omdia for 12 years, Securities analyst in ABN AMRO and Lehman Brothers for 8 years.

Vin Zhou, Engineering Head of VAT China. With 20 years’ experience in vacuum and semiconductor industry, now leads engineering team support customization projects in local pan-semiconductor customers; and promotes VAT R&D’s launch.

Snow has over twenty years of experience on optical communication industry. Currently, he works at Optical system division of Broadcom as senior BD manager, focusing at CPO and optical solution promotion in China market. Before that, He has worked at Intel and Finiar for many years to take charge of the marketing promotion and technical support for traditional and Siph transceiver

Andrew Chan Yik Hong is the Executive Director of the Malaysia Semiconductor Industry Association (MSIA). MSIA is the voice of the Malaysia semiconductor and electronics industry. Andrew leads MSIA’s strategic direction, policy advocacy, industry development, and international engagement. MSIA currently represents over 300 member companies from 20 countries, spanning the full semiconductor value chain.

Andrew plays a pivotal role in positioning Malaysia within the global semiconductor landscape. He serves on several high-level national platforms, including PEMUDAH, the National Strategic Semiconductor Task Force, and TalentCorp’s MyMahir Future Skills Talent Council for the semiconductor sector. He also chairs the Semiconductor Working Group under Malaysia’s National Standards Committee, where he champions cross-sector collaboration and technical leadership.

Graduated from Nagoya Institute of technology on 1990. Then worked on display and semiconductor manufacturing materials for about 30 years for RD, mass production, global product manager and quality assurance. Now focusing on electroic chemicals supply chain and platform development

Seungcheol Oh is CTO at TYST, focusing on functional and plasma-resistant ceramic coatings for semiconductor components using aerosol deposition and sputtering.

CHEN Dengyun， PhD of Analytical Chemistry, Xiamen University; Industry Expert of Xiamen University (Semiconductor); Senior Engineer; worked in Agilent Technoligies 13 years as G. China Spectroscopy Products (SPSD) Manager; 2 years in PerkinElmer as Inorganic Product Line Leader(APAC); with >30years experiences in ICPMS technologies; Second Editor and Major Author of <Application Examples of Modern ICP-MS>; Currently working in Rorze-IAS Inc. as Service Representative & Technical Director in China.

Thomas Tong holds a Bachelor of Technology degree in Manufacturing Technology from the National University of Singapore and has over 30 years of experience in electronics manufacturing. He spent 12 years in SMT process roles at multinational companies like Apple and 3COM, followed by 7 years at Indium as Technical and Sales Manager focusing on soldering materials. He also has over 10 years of experience in thermal processing applications with companies such as Despatch and BTU. Currently, he is the Process Technology Manager at BTU International, developing advanced thermal solutions for the SMT and semiconductor packaging industries.

Berthold Ocker studied physics at Goethe University Frankfurt. In 1991, he began his career in the development of production systems using vacuum deposition technology. Since 1995, his work has focused on spintronic applications. In 2001, he joined Singulus, where he headed the semiconductor development department until 2015. In 2015, he was promoted to the director of the Business Unit Semiconductor.

Lou spent 29 years at Texas Instruments, retiring in 2007. As Director of TI’s Mixed-Signal Technology Development organization, he was responsible for worldwide analog, power, RF SiGe, and mixed-signal technology development, design enablement, production ramps, and transfers that supported every business unit in the company. He was elected a TI Fellow in 1995. In 2008, he joined DB HiTek, in Seoul, S. Korea, as Senior Vice President and General Manager of the newly created Analog Foundry Business Unit. During his tenure there, he established DB HiTek as a leading analog/power foundry. Since 2012, he is the CEO of Lou Hutter Consulting LLC, assisting foundries, IDMs, fabless design houses, and material suppliers in the areas of analog/power technology, design enablement, organizational management, and business development. From 2013-16, he worked extensively to try to establish India’s first high-volume production wafer fab, Cricket Semiconductor, focusing on analog/power technologies. Lou has 50 U.S. patents, has published over 35 journal articles, has co-authored 1 book entitled Silicon Analog Components, now in its 2nd edition, and a newly released 5-book self-study series. He has an MSEE from MIT, and resides in Lisbon, Portugal.

Andrew Chan Yik Hong is the Executive Director of the Malaysia Semiconductor Industry Association (MSIA). MSIA is the voice of the Malaysia semiconductor and electronics industry. Andrew leads MSIA’s strategic direction, policy advocacy, industry development, and international engagement. MSIA currently represents over 300 member companies from 20 countries, spanning the full semiconductor value chain.

Andrew plays a pivotal role in positioning Malaysia within the global semiconductor landscape. He serves on several high-level national platforms, including PEMUDAH, the National Strategic Semiconductor Task Force, and TalentCorp’s MyMahir Future Skills Talent Council for the semiconductor sector. He also chairs the Semiconductor Working Group under Malaysia’s National Standards Committee, where he champions cross-sector collaboration and technical leadership.

Namhoon Lee is CEO at TYST, focusing on functional and plasma-resistant ceramic coatings for semiconductor components using aerosol deposition and sputtering.