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Hall B1, Taihu International Expo Center, Wuxi, ChinaSemiconductor Equipment and Core Components Supporting New Progress ForumThe R&D level of semiconductor equipment and core components is an important indicator to measure the capability of semiconductor manufacturing processes, which is related to the competitiveness and future development trends of the entire industry. Guests at this forum will conduct in-depth discussions on the current status of the coordinated development of equipment, core components, and process capabilities, as well as the interaction between them.
Guest：
Zhao WeijiangVice President, Nissin Allis Ion Equipment (Shanghai) Co., Ltd.
ZhouYibinDeputy General Manager, Firsquare Environmental Technology (Jiangsu) Co.,Ltd.
Dr.Lu HailiangCTO，Jiangsu JITRI SKS Technologies Co., Ltd.
Tick CaiTechnical director, Hwatsing Technology Co.,Ltd.
Lauren CuiProject General Manager, Nasikey Semiconductor Co., Ltd.
Norman HuangVice President,Chongqing Xinlian Microelectronics Co., Ltd.
Liansheng CaoVice President,Amber Intelligence Semiconductor Equipment (shanghai) Company
Lujie QuSenior Technical Advisor of Shenzhen Cronus Technology Co., Ltd. & Director of Guangdong Semiconductor Ultra Precision Motion Platform Engineering & Technology Research Center
Shenyang CaoTechnical Marketing Engineer, ASMPT SEMI Equipment (Shanghai) Co.,Ltd.
QUEQIAOYINGtechnical support manager, Feature-Tec (Shanghai) Advanced Materials
Max XuSales Director,, Panther Technology (Shenzhen) Co., Ltd.
Shi SuningProduct Manager, SUSS MicroTec SE
Zhu PeiwenChairman & General Manager of Jiangsu Shenzhou Semiconductor Technology Co., Ltd.
Baohua WangProduct Manager，GENTEC (SHANGHAI) CORPORATION
JohnSales Director, DATIKIN TSINQYAN ADVANCED TECHNOLOGIES(HUIZHOU)CO.,LTD.
WangXuesongDevelopment Director, Jiangsu OKFLON Precision Manufacturing Co.,Ltd.
Sunny LouFounder&Co-Chairman and President，ZHE JIANG ETERNAL AUTOMATION SCI-TEC Co., Ltd.
ChenQingSupply Chain President, Beijing NAURA Microelectronics Equipment Co.,Ltd.
Xinyi ChenR&D VP, Piotech, Inc
Lawrence FongChairman, Mutual Benefit Semiconductor （Shenzhen）Co., Ltd. -
Hall A3, Taihu International Expo Center, Wuxi, China2025Forum on Green Factory and ESG Development
Guest：
Steven LiGM, Truth Semi Group
Guohai YinVice Chairman, Truth Semi Group
Shuailong MaoWater Utilities Manager, Wuxi Xinzhuo Huguang Semiconductor Co., Ltd.
Dingxian TangProduct manager, LEO GROUP PUMP CO.,LTD.
Jason DONGSustainability Business Lead, Rockwell Automation(China)Company Limited
Davis LiGM of EC Division, Wolong Electric Group
Sil YangESG Engineer, SGS -
Worldhotel Grand Juna Hotel, Wuxi, ChinaCSEAC 2025 Fengmi IC Elite Lecture
Guest：
EdwardSales Director, Nanjing ZhongAn Semiconductor Equipment Co., Ltd.
Jacky Sun
Seddy ChuMarketing VP，Nanjing ZhongAn Semiconductor Equipment Co., Ltd.
Alfred GuDirector，Dongguan Ziitek Electronical Material Technology Co.,Ltd
Dr. Shih,San BaoFounder，FoGuang Superconducting Future Academy
Dr. FengshuanglongChongqing Institute of Green and Intelligent Technology , Chinese Academy of Sciences
Dr. YU-HAO PANSuzhou IV Technologies Co.,Ltd
Dr. Edison GuoAcademy of Energy, Material and Environmental Sustainability, NCHU -
Hall A3, Taihu International Expo Center, Wuxi, ChinaForum on the Interaction of Manufacturing Processes and Semiconductor Equipment Industry Chain DevelopmentThis forum showcases cutting-edge semiconductor equipment and process technologies, highlighting the synergistic relationship between "each generation of equipment, materials, and processes leading to a new generation of products." We aim to establish a collaborative "process-equipment-materials" triangle model. Our speakers, primarily from industry technology and marketing departments, will present equipment solutions based on advanced processes such as EUV lithography and atomic layer deposition (ALD). The presentations will also cover new features of semiconductor production lines, as well as next-generation semiconductor design concepts and intelligent equipment.
Guest：
Dazhang PeiSenior Executive of the China Electronic Production Equipment Industry
Zhang TingDirector, GTA semiconductor company
Hua JindongDeputy Chief Engineer of East China Region, China Electronics System Engineering No.2 Construction Co., Ltd.
Kevin TsaiGM of the Equipment Manufacturing Division, Zhejiang Houji Technology Co. Ltd
Jacky LinCEO&CTO, HONGHU (SuZhou) Semiconductor Technology Co.,LTD.
Dr.ZHU LIEPINGCTO, Toray Bluestar Membrane Co.,Ltd
Chen FeibiaoProduct Director, SHW Technologies (Shanghai) Co., Ltd.
Jun ZhengCEO, Matrixtime Robotics Co.,Ltd.
Donald TsaiAutomation Engineering Division Deputy Director, Nexchip Semiconductor Corporation
Dr. Liu BinCTO, IKAS Holdings (Beijing) Co., Ltd. -
Hall A4, Taihu International Expo Center, Wuxi, ChinaFengmi Human Resources Tour · Integration of Industry, Education and Chips -- Enterprise Human Resources Promotion ConferenceThis forum will build a platform integrating industry, academia, research and application through university research achievements exhibitions, policy briefings and enterprise presentations. Among them, the on-site policy and enterprise presentation area will invite government representatives to elaborate on the support policies for the semiconductor industry, and also invite more than ten enterprises including Advanced Micro-Fabrication Equipment Inc. (AMEC) to give presentations, sharing their cultural concepts and releasing talent demand profiles. Welcome more talents to join this integration of industry and education!
Guest：
Wilson HeGroup Vice President, Human Resources, Advanced Micro-Fabrication Equipment Inc. China
Lu YingDirector of the Talent Reserve Base of the Integrated Circuit Branch of China Semiconductor Industry Association
Yu XiekangVice Chairman of the National Integrated Circuit Packaging and Testing Industry Chain Technology Innovation Strategic Alliance, Executive Vice Chairman of the Integrated Circuit Subcommittee of the China Semiconductor Industry Association
Hao ZhiqiangDirector of the Education and Examination Center of the Ministry of Industry and Information Technology
Wang ZhengDirector, Beijing NAURA Microelectronics Equipment Co.,Ltd
Shenzhen SiCARRIER Industry Machines Co., Ltd.Shenzhen SiCARRIER Industry Machines Co., Ltd.
Andrew WeiAsia PMM Director, COMET
Dean SunAsia PMM TA, COMET
Ding YongSecretary-General of Zhejiang Semiconductor Industry Association,Professor of Zhejiang University
TinaHR Director, Sanhe Tongfei Refrigeration Co., Ltd.
Wu BingDeputy Manager, Wuhan Huakang Century Clean Technology Co., Ltd.
Zhang ManManHR Manager, Shanghai Hirokawa Technology Co.,Ltd.
NancyDeputy General Manager, BEIJING YESEMI PRECISION SEMICONDUCTOR CO.,LTD
Russell LiHRBP Supervisor, Hangzhou Cobetter Filtration Equipment Co.,Ltd
Lin LouHuman Resources, Zhejiang Micro-magnetic precision Technology Co.,Ltd.
Ding YangHR Manager, Suzhou Baicon Sensor Technology Co., Ltd.
Cherry ZhouHR Manager, Pioneer Semiconductor Research Co., Ltd.
Lujie QuSenior Technical Consultant, Shenzhen Cronus Technology Co., Ltd. -
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Hall A6, Taihu International Expo Center, Wuxi, ChinaSeminar on Thin-Film Deposition Technology, Processes and EquipmentAs advanced processes continue to evolve, thin films are becoming increasingly ultra-thin, uniform, defect-free and highly consistent. Advanced technologies such as ALD have become essential, with domestically produced thin-film deposition equipment now seeing widespread application in mature processes; however, breakthroughs in equipment for advanced processes still need to be accelerated. Key topics: (1) Demand for thin-film materials in advanced processes and innovation directions for deposition technologies (2) Technological iteration and performance upgrades of PVD/CVD/ALD equipment (3) Process control and yield management for thin-film deposition on large-size wafers (4) Applications of domestically produced thin-film deposition equipment in advanced packaging and power devices (5) Integrated innovation across equipment, materials and processes, and the development of supply chain security
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Hall B4, Taihu International Expo Center, Wuxi, ChinaSeminar on the Advanced Process Cleaning Technology and EquipmentGlobal bonding technology is evolving towards lower temperatures, higher precision, greater reliability and larger dimensions. Domestic bonding equipment is being used reliably in low- to mid-range packaging, whilst breakthroughs in advanced bonding equipment and processes are urgently needed. Key topics: (1) New requirements for bonding technology in advanced packaging (Chip-let/3D stacking) (2) Breakthroughs and industrialization of wafer-level bonding and hybrid bonding technologies (3) Design, manufacturing and commissioning techniques for high-precision bonding equipment (4) Solutions for improving bonding process yield and reliability verification (5) Practical applications of domestic bonding equipment in advanced packaging production lines
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Hall B4, Taihu International Expo Center, Wuxi, ChinaSeminar on Measurement Technology and EquipmentAs processes continue to shrink, measurement technology is evolving towards nano-scale, non-destructive, high-speed in-line inspection. Whilst domestic measurement equipment has achieved breakthroughs in certain areas, high-end in-line measurement and 3D measurement still rely on imports. Key Topics: (1) Upgraded standards and accuracy requirements for advanced process measurement technologies (2) Technological innovations in optical measurement, electron beam measurement and 3D measurement (3) Integration of in-line measurement with process control to enhance manufacturing efficiency (4) Applications of domestically produced measurement equipment in wafer fabrication and packaging/testing (5) Trends towards AI-driven and intelligent measurement equipment