The 17th Integrated Circuit Packaging and Testing Industry Chain Innovation and Development Forum and Yangtze River Delta Integrated Circuit Advanced Packaging Development Conference

Ye Tianchun graduated from Fudan University in 1986 with a degree in Semiconductor Microelectronics. He is the former Director and a Research Fellow at the Institute of Microelectronics of the Chinese Academy of Sciences (CAS). As one of the leading figures in China's integrated circuit (IC) manufacturing field, he has long been engaged in frontline innovative research with outstanding achievements.He is a recipient of the "Special Government Allowance from the State Council" and has been awarded numerous prestigious honors, including:three National Technology Invention Awards(Second Class),one CAS Outstanding Scientific and Technological Achievement Prize,one National Science and Technology Progress Award(Second Class),seven Provincial/Ministerial-Level Science and Technology Awards.With 121 authorized invention patents and over 130 academic papers published in top-tier national and international journals, he has also mentored more than 50 master's and doctoral students. In 2019, he was elected as an Academician of the International Eurasian Academy of Sciences.

In 2008, he was appointed by the State Council as the Chief Technology Officer of the National Science and Technology Major Project "Ultra-Large-Scale Integrated Circuit Manufacturing Equipment and Complete Process" (02 Special Project). In 2017, he served as the Deputy Director-General and Secretary-General of the China Integrated Circuit Innovation Alliance. In 2020, he was elected as the Chairman of the Integrated Circuit Branch of the China Semiconductor Industry Association .

Dr. Simon Yang is the CEO of YMTC, brings YMTC to new heights in 3D NAND industry. As an experienced executive in the semiconductor industry for over 30 years, Simon has served as the CEO of XMC, COO/CTO of SMIC, and CTO/SVP of GlobalFoundry, took full responsibility for fab operation and technical development. Before that he was with Portland Technology Development group in Intel for more than 10 years, led remarkable technical innovation projects.

Simon got his Bachelor Degree from Shanghai University of Science & Technology, Master Degree and Doctor Degree from Rensselaer Polytechnic Institute. He holds more than 40 patents and published over 30 articles.

Shouyi Yin, Professor and Vice Dean of the School of Integrated Circuits at Tsinghua University. He was a IEEE Fellow, and a recipient of The National Science Fund for Distinguished Young Scholar. His research areas include: Reconfigurable Computing, Computing-in-Memory architecture, and AI chip design. He has published more than 100 papers in top journals and international conferences, such as ISSCC, VLSI, ISCA, MICRO, HPCA, IEEE JSSC, TPDS, TCSVT, TVLSI, TCAS-I/II, etc. He has Published two monographs. He has received Second Prize of China’s State Technological Invention Award, First Prize of Science and Technology Advancement Award of The Chinese Institute of Electronics, First Prize of Technological Invention Award of the Ministry of Education, etc.

Secretary-General of the China Automotive Chip Industry Innovation Strategic Alliance.He holds a bachelor's and master's degree in Industrial Engineering and Precision Instrumentation from Tsinghua University, as well as a Ph.D. in Mechanical Engineering from the University of Illinois at Urbana-Champaign (UIUC), USA. With long-term dedication to the R&D of new energy vehicle technologies and strategic research and management in the industry, he is an expert in power batteries, powertrain platforms, and vehicle integration and control.His accolades include the Outstanding Young Manufacturing Engineer Award from the Society of Manufacturing Engineers (SME), the Outstanding Young Manufacturing Leadership Award from the Society of Automotive Engineers (SAE), the First Prize of China Automotive Industry Science and Technology Award, and the First Prize of Beijing Science and Technology Award, among others.He has served in various key roles, including as an expert member of the National New Energy Key Research Program, a Beijing Municipal Specially Appointed Expert, an expert reviewer for Beijing Senior Professional Title Evaluation, and a high-level leading talent in Zhongguancun.

As the CTO of NCAP engaged in research on 3D heterogeneous integration technology of microelectronics and optoelectronics. As the project and research leader, he has undertaken multiple national-level major projects, published over 70 academic papers, and received the National Science and Technology Progress Award and the Science Promotion and Development Award from the Chinese Academy of Sciences.

Mr. Liu Weiping has been working hard in the field of EDA and integrated circuit design for more than 30 years. He is a witness of the famous “Panda” EDA tool development project. In 2009, Mr. Liu led a team to establish Empyrean Technology，which continue to improve technology level and core competitiveness of China’s EDA. Mr. Liu has been successively employed as a member of the National ICCAD Expert Committee, a member of the National Software Expert Committee of Ministry of Industry and Information Technology, a member of the National 863 Integrated Circuit Design Expert Group, etc. He has achieved First and Third Class Prizes of The State Scientific and Technological Progress Award，which is repeatedly affirmed.

Ph.D., Postdoctoral Fellow at Rutgers, The State University of New Jersey, Doctoral Supervisor, Second-Class Professor, and Chief Scientist of Huatian Technology.

Graduated from Tsinghua University in 1989 with a major in Semiconductor Device Physics, and obtained a master's degree from Xidian University in 1992 and a Ph.D. from Xi’an Jiaotong University in 1998. Since 1992, he has been engaged in teaching and research in the field of microelectronics at Xidian University. From 2005 to 2023, he served as Vice Dean and Dean of the School of Microelectronics at Xidian University.Currently, he holds the following positions: Deputy Director of the National Key Laboratory of Wide Bandgap Semiconductor Devices and Integrated Technology、Member of the Standing Committee of the Shaanxi Provincial People’s Congress、Deputy Chair of the Shaanxi Provincial Committee of the Revolutionary Committee of the Chinese Kuomintang (RCCK)

have been engaged in the design of new architectures and system - on - a - chip for a long time. I am the core proponent of Software - Defined Interconnect (SDI) and Software - Defined System - on - Wafer (SDSoW). One achievement was selected for the "13th Five - Year Plan" Scientific and Technological Achievements Exhibition, one for the "Top Ten Scientific and Technological Developments in China", and one for the "Top Ten Scientific and Technological Developments in National Defense". Over 100 technical invention patents have been authorized, over 90 academic papers have been published. I have won 1 National Science and Technology Progress Second Prize, 1 Tianjin Special Prize, and 3 provincial - ministerial first prizes.

Dr. Hong Xie is the Vice President of Tongfu Microelectronics and the General Manager of the Group Engineering Center. Dr. Xie earned his Bachelor's and Master's degrees from Tsinghua University and a Ph.D. in Mechanical Engineering from the University of Colorado Boulder, USA. With 28 years of experience in the packaging industry, Dr. Xie has held various technical and managerial positions at Intel, FCI, Tongfu Microelectronics, and Goer Microelectronics. He has led and participated in the development and production of a wide range of packaging technologies and products, covering applications such as CPUs, memory, communications, and consumer electronics. Dr. Xie is a Senior Member of IEEE and holds 35 U.S. patents and over 10 Chinese patents. He has published more than 10 technical papers in IEEE and ASME journals.

National-Level Young Talent,Associate Professor and Doctoral Supervisor, College of Computer Science and Technology, Zhejiang University.Research Focus on Neuromorphic Computing Chips, Neural Processing Units (NPUs), System-on-Chip (SoC) Design.Key Achievements:Led the development of the Darwin series brain-inspired computing chips;Awarded the 2020 World Internet Conference Leading Scientific Achievement;Recognized in the 2021 "Science and Technology Innovation China" Pioneer Technologies list (Electronics & Information category);Principal Investigator for multiple national and provincial research programs, including:National Natural Science Foundation of China (Key Regional Innovation Program, General Program, Youth Program),Key R&D Project of the Ministry of Science and Technology;Innovation Special Zone Project of the Military Science and Technology Commission;Zhejiang Province's "Pioneer" R&D Initiative;Published 20+ papers in top-tier journals/conferences (IEEE TVLSI, TCAD, TCDS, IJCAI, etc.);Holds 30+ authorized invention patents

Guo Chao, a PhD from Tsinghua University and VP of iSABers Group, has over a decade of experience in advanced manufacturing R & D and industrialization. He has led or been a key contributor to 3 National Key R & D Projects of the Ministry of Science and Technology, and is the first inventor of dozens of authorized national invention patents.

Daquan Yu is a Distinguished Professor at Xiamen University and the Chairman of Xiamen Sky Semiconductor Technology Co., Ltd. He earned his Bachelor's degree in 1999 and Ph.D. in 2004 from Dalian University of Technology. He has conducted research and development in advanced packaging technologies at the City University of Hong Kong, Fraunhofer IZM in Germany, the Institute of Microelectronics (IME) in Singapore, and the Institute of Microelectronics of the Chinese Academy of Sciences. He previously served as the Dean of the Packaging Technology Research Institute at Huatian Technology.Dr. Yu has led major national science and technology projects under the "02 Major Special Program" and has published over 200 academic papers. His notable awards include:Second Prize of the Beijing Science and Technology Progress Award (2018);Third Prize of the Jiangsu Science and Technology Progress Award (2019);First Prize of the National Science and Technology Progress Award (2020)

Chen Chuan, Ph.D., Associate Research. His research interests include thermal management of IC, thermal-mechanical reliability, and multi-physics field simulation design, etc. He has presided over more than 10 projects, such as the NSFC Youth Program, the Cultivation Project of Major Program of the NSFC, and the topic of Key Program of Beijing NSF. He has also carried out cooperation with Huawei, STIC, Hygon, Honor, AKMMV, etc. He has published more than 30 papers in top journals and IEEE international conferences, and has applied for more than 30 invention patents, among which more than 10 have been authorized.

Senior expert in semiconductor packaging and automotive electronics, holding a Bachelor’s degree from HIT and Master degree from HUST, With nearly 20 years of industry experience, he has worked at globally renowned semiconductor IDM companies as well as leading domestic packaging firms, specializing in memory packaging, automotive electronics application technologies, and market research. Leveraging deep expertise in packaging technologies, automotive-grade chip development, and market strategy analysis, he combines strong technical R&D capabilities with commercial insight, consistently driving innovation and industrial applications in semiconductor packaging technologies.

Libbert Peng, Vice President, Product Management/Product Development

Mr. Libbert Peng has received his Master Degree from East China University of Science and Technology in 2002, and IMBA from HongKong University-Fudan University in 2016. He has more than 20years experience in semiconductor field, successively served at SMIC and Anji Microelectronics Technology (Shanghai) Co. LTD