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Hall A5, Taihu International Expo Center, Wuxi, ChinaForum on the Innovation in Packaging and Testing Equipment and MaterialsDrawing on the three major trends in the development of advanced packaging technologies—namely, packaging architecture innovations driven by AI and high-performance computing (such as chiplets, 2.5D/3D and hybrid bonding); heterogeneous integration and system-level synergy emerging as core pathways; and an equal emphasis on self-reliance within the industrial chain and global expansion—we will explore and demonstrate how the latest packaging equipment and key materials (such as substrates, interconnect materials and thermal management materials) support the mass production of higher-density, more reliable packaging structures.
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Hall A6, Wuxi International Conference Center,Wuxi, ChinaForum on the Supply Chain Security and Cross-Industry Collaboration in the Packaging and Testing MarketThis forum will explore how deep collaboration across the entire industrial chain can empower emerging applications such as data centers, smart vehicles and robotics. Discussions will focus on the current state of supply chain security within China’s packaging and testing industry, deeply identify the risks and challenges facing key segments, and examine targeted strategies to safeguard the supply chain. The event will also feature business matching activities.
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Hall A6, Taihu International Expo Center, Wuxi, China2026 Forum on the Development of Integrated Circuit Equipment, Materials and PartsThis year’s forum will focus on the current global landscape of the semiconductor packaging and testing industry and the state of China’s integrated circuit packaging and testing sector. It will explore strategies for enterprises across the upstream and downstream segments of the industry chain and supply chain to capitalise on the opportunities presented by the implementation of the 15th Five-Year Plan, as well as plans for collaborative innovation and development between industry, academia and research institutions. The event will also feature a plaque presentation ceremony for the current and rotating chairpersons.
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Hall B5, Taihu International Expo Center, Wuxi, China2026 (the 5th) Semiconductor Ecosystem Innovation ConferenceThis conference will focus on disruptive technologies and practical applications in the semiconductor sector, providing precise insights into new directions for the industry’s evolution. Centred on the need for the deep integration of innovation, industrial, financial and talent ecosystems, we will jointly explore pathways to achieving self-reliance in core technologies and new mechanisms for industrial collaboration, proactively addressing development bottlenecks and opening up new avenues for value growth.
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Hall A6, Taihu International Expo Center, Wuxi, China
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Hall A6, Taihu International Expo Center, Wuxi, China
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Hall B4, Taihu International Expo Center, Wuxi, China
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Hall B4, Taihu International Expo Center, Wuxi, China
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Hall A5, Taihu International Expo Center, Wuxi, China