The Innovation Conference on CPO(Co-Packaged Optics) and Heterogeneous Integration Technology

The Innovation Conference on CPO(Co-Packaged Optics) and Heterogeneous Integration Technology

The conference brings together experts from top scientific research institutions, technical elites from leading enterprises, and industry pioneers. It focuses on in-depth discussions around core topics including CPO packaging process optimization, heterogeneous material integration technology innovation, and collaborative design of optoelectronic devices and chips.
 
Through keynote speeches, the latest research results are shared; through thematic seminars, mass production challenges are analyzed; and through industry-academia-research dialogues, technology transformation is promoted. The conference aims to build an efficient communication platform, accelerate technological innovation and industrial application, assist China in achieving technological breakthroughs in the field of high-speed interconnection, and seize the global commanding heights of optoelectronic integration technology.

I​​​​​​ME​

Friday, September 5th,9:30-16:25

Venue

Hall A1, Taihu International Expo Center, Wuxi, China

THEME The Innovation Conference on CPO(Co-Packaged Optics) and Heterogeneous Integration Technology
The Innovation Conference on CPO(Co-Packaged Optics) and Heterogeneous Integration Technology
Meeting time Friday, September 5th,9:30-16:25
Meeting address Hall A1, Taihu International Expo Center, Wuxi, China
  • Perspectives on Semiconductor Industry Development Driven by AI Applications
  • Progress in advanced Packaging technology
  • Development Trends and Challenges of 2.5D/3D Advanced Packaging Technologies for CPO Optical Engines
  • Co-packaged optics for high speed optical interconnect at AIDC
  • The new trends of CPO/OIO in intelligent computing networks
  • Electro-Optical Co-Design and Advanced Packaging for High-Speed Co-Packaged Optical Interconnects
  • Lunch Break and Exhibition Viewing
  • Silicon-based Photonic-Electronic Integration Advanced Packaging Technologies for High-Computing-Power Applications
  • AI-Driven High-Speed Optical Module Packaging Tech Trends
  • Challenges and Solutions for Co-Packaged Optics Manufacturing Test
  • PLP Technology for Glass Core Application of CPO
  • How can glass substrates reshape the future of chip packaging?
  • The 3rd Generation of FOPLP for Integration of CPO
  • Unlocking AI Computing Opportunities via Optoelectronic Integration