Forum on Semiconductor Packaging and Testing Advanced Technology and Supporting Industry Chain Integration Development

Forum on Semiconductor Packaging and Testing Advanced Technology and Supporting Industry Chain Integration Development

This forum has gathered corporate guests from the materials and equipment sectors of semiconductor manufacturing and packaging/testing, as well as experts and scholars from organizations such as innovation alliances and industry associations. It introduces the characteristics of new materials and equipment driven by new applications and new processes brought about by product iteration, along with the underlying logical chain, focusing on demonstrating the vitality that innovation has brought to the semiconductor industry.

TIME：	Friday, September 5th,09:20-17:00
Venue:	Hall B1, Taihu International Expo Center, Wuxi, China
Theme	Forum on Semiconductor Packaging and Testing Advanced Technology and Supporting Industry Chain Integration Development

Forum on Semiconductor Packaging and Testing Advanced Technology and Supporting Industry Chain Integration Development

Meeting time	Friday, September 5th,09:20-17:00
Meeting address	Hall B1, Taihu International Expo Center, Wuxi, China

09:20 -09:25

speech‌

Wuxi Municipal Bureau of Industry and Information Technology
09:25 -09:30

speech‌

Dalian Municipal Bureau of Industry and Information Technology
09:30 -09:50

Insights into Chiplet Testing Technology

Zhikuang Cai

Director of Science and Technology Department, Nanjing University of Posts and Telecommunications
09:50 -10:10

Development Trends in Computing Power Integration in the AI Era

Wang Chengqian

Research Fellow, China Key System & Integrated Circuit Co.,Ltd.
10:10 -10:30

Integrated Circuit Testing Technology Roadmap and Equipment Localization

Jian Zhang

Senior Director, Tongfu Microelectronics Co.,Ltd.
10:30 -10:50

Equipment First in the Advanced Packaging Era: Building the Triple-Core Drive for High-End Packaging & Testing Equipment

Jessica Zhou

President of Academy, Energy Intelligent Equipment (Wuxi) Co.,Ltd.
10:50 -11:10

Multi-physics co-simulation for integrated chips

Dazhi Ding

Director、Professor, Nanjing University of Science and Technology
11:10 -11:30

Industry Fusion: The Next Wave of Wafer Manufacturing 2.0

SHAO HONG

Senior Director of Marketing and Sales, CR Micro FBG
11:30 -11:50

Test strategies under complex heterogeneous integration

Kaihong Zhang

General Manager, CMC electronics CO.,LTD.
11:50 -12:10

Research on Novel Materials for Advanced Semiconductor Packaging & Testing Processes

Kai Pei

Deputy general manager, Dalian Creditchem Semiconductor Materials Co.,Ltd.
12:10 -13:30

Lunch break and exhibition viewing
13:30 -13:50

Research on Key Technologies of Advanced Semiconductor Packaging and Testing Equipment

Ye Lezhi

PHD & Deputy Secretary-General of ChinaElectronic Special Equipment Industry Association
13:50 -14:10

Chiplet packaging powers the launch of the AI era

Eric

Research and Development Manager, Huatian Technology（Jiangsu）Electronics Co.,Ltd.
14:10 -14:30

Technological Development and Application Prospects of Power Devices

Jeff

General Manager, Jiangsu NEXIC Technology Co.,Ltd.
14:30 -14:50

High-density Interconnection Organic Substrates and Plastic Packaging Technology

Li Yang

manager of the R&D department, Wuxi Zhongwei Hi-Tech Electronics Co.,Ltd.
14:50 -15:10

The Development of GaN Power Devices and Packaging Challenges

Wang Ronghua

Vice President, RUNXIN MICROELECTRONICS (DALIAN)CO.,LTD.
15:10 -15:30

Advanced packaging and system integration technology for smart sensors

Professor Yang Daoguo

Guilin University of Electronic Technology
15:30 -17:00

Supply and demand matching link

Special Guests of the Conference

Secretary-general of Wuxi Institute of Integrated Circuits

Director of Science and Technology Department, Nanjing University of Posts and Telecommunications

Research Fellow, China Key System & Integrated Circuit Co.,Ltd.

Senior Director, Tongfu Microelectronics Co.,Ltd.

President of Academy, Energy Intelligent Equipment (Wuxi) Co.,Ltd.

Director、Professor, Nanjing University of Science and Technology

Senior Director of Marketing and Sales, CR Micro FBG

General Manager, CMC electronics CO.,LTD.

Deputy general manager, Dalian Creditchem Semiconductor Materials Co.,Ltd.

PHD & Deputy Secretary-General of ChinaElectronic Special Equipment Industry Association

Research and Development Manager, Huatian Technology（Jiangsu）Electronics Co.,Ltd.

General Manager, Jiangsu NEXIC Technology Co.,Ltd.

manager of the R&D department, Wuxi Zhongwei Hi-Tech Electronics Co.,Ltd.

Vice President, RUNXIN MICROELECTRONICS (DALIAN)CO.,LTD.

Professor Yang Daoguo

Guilin University of Electronic Technology

Next Agenda

September 5th,09:20-12:00

Forum on Innovation and Development of Semiconductor Measurement and Test Equipment

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