Forum on Semiconductor Packaging and Testing Advanced Technology and Supporting Industry Chain Integration Development

Forum on Semiconductor Packaging and Testing Advanced Technology and Supporting Industry Chain Integration Development

This forum has gathered corporate guests from the materials and equipment sectors of semiconductor manufacturing and packaging/testing, as well as experts and scholars from organizations such as innovation alliances and industry associations. It introduces the characteristics of new materials and equipment driven by new applications and new processes brought about by product iteration, along with the underlying logical chain, focusing on demonstrating the vitality that innovation has brought to the semiconductor industry.

TIME:

Friday, September 5th,09:20-17:00

Venue:

Hall B1, Taihu International Expo Center, Wuxi, China

Theme

Forum on Semiconductor Packaging and Testing Advanced Technology and Supporting Industry Chain Integration Development

 

Forum on Semiconductor Packaging and Testing Advanced Technology and Supporting Industry Chain Integration Development
Meeting time Friday, September 5th,09:20-17:00
Meeting address Hall B1, Taihu International Expo Center, Wuxi, China
Special Guests of the Conference
Zhikuang Cai
Director of Science and Technology Department, Nanjing University of Posts and Telecommunications
Wang Chengqian
Research Fellow, China Key System & Integrated Circuit Co.,Ltd.
Jian Zhang
Senior Director, Tongfu Microelectronics Co.,Ltd.
Jessica Zhou
President of Academy, Energy Intelligent Equipment (Wuxi) Co.,Ltd.
Huaguang Bao
Professor,Nanjing University of Science and Technology
SHAO HONG
Senior Director of Marketing and Sales, CR Micro FBG
Kaihong Zhang
General Manager, CMC electronics CO.,LTD.
Kai Pei
Deputy general manager, Dalian Creditchem Semiconductor Materials Co.,Ltd.
Ye Lezhi
PHD & Deputy Secretary-General of ChinaElectronic Special Equipment Industry Association
Jiulin Shen
Research and Development Manager, Huatian Technology (Kunshan) Electronics Co., Ltd.
Jeff
General Manager, Jiangsu NEXIC Technology Co.,Ltd.
Li Yang
manager of the R&D department, Wuxi Zhongwei Hi-Tech Electronics Co.,Ltd.
Wang Ronghua
Vice President, RUNXIN MICROELECTRONICS (DALIAN)CO.,LTD.
Professor Yang Daoguo
Guilin University of Electronic Technology