Fengmi Talent Action · Industry-Education Integration

The event will feature three major sections—University Research Achievements Exhibition, Talent Recruitment Fair with 100+ Enterprises, and Policy & Corporate Presentations—creating a platform that integrates industry, academia, research, and application.

 

Date & Time: September 5–6, 09:00–17:00

Venue: Wuxi Taihu International Expo Center, Hall A4

 

Nearly 30 Universities & Institutes Showcasing Achievements

 

Nearly 30 prestigious universities and research institutes—including Tsinghua University, Fudan University, Shanghai Jiao Tong University, Zhejiang University, and Huazhong University of Science and Technology—will gather to showcase groundbreaking achievements in key materials for integrated circuits, IC design, manufacturing processes, packaging & testing, and intelligent device systems.

 

Confirmed Exhibitors Include:

 

• School of Materials Science and Engineering, Tsinghua University

• School of Microelectronics, Fudan University

• School of Integrated Circuits, Shanghai Jiao Tong University

• School of Integrated Circuits, Dalian University of Technology

• School of Integrated Circuits & CMOS IC Design and Manufacturing Innovation Platform, Zhejiang University

• School of Integrated Circuits, Jiangnan University

• Yangtze River Delta Advanced Materials Research Institute

• School of Microelectronics Industry, Shanghai University

• School of Electromechanical Engineering, Guilin University of Electronic Technology

• School of Materials, Shenzhen University

• Advanced Electronic Packaging Laboratory, Beijing University of Technology

• School of Integrated Circuit Science and Engineering, Beihang University

• Zhejiang University–Shangyu Semiconductor Materials Research Center Public Service Platform

• National Innovation Center for Third Generation Semiconductor Technology (Suzhou) & Jiangsu Third Generation Semiconductor Research Institute Co., Ltd.

• Institute of Rare Earth Metals, Hunan Institute of Rare Earth Materials Co., Ltd.

• Institute for Key Materials of Integrated Circuits, Shenzhen Polytechnic University

• School of Materials Science and Engineering, Hunan University

• Shenyang Ligong University

• National Key Laboratory of Precision Electronic Manufacturing Technology and Equipment, Guangdong University of Technology

• School of Electrical and Electronic Engineering, Huazhong University of Science and Technology

• Institute of High-End Semiconductor Equipment, Beijing University of Technology

• University of Science and Technology Beijing

• Biomimetic and Intelligent Technology Research Center, Hefei Institutes of Physical Science, Chinese Academy of Sciences

• Xiamen University

• Nankai University

• Advanced Semiconductor Institute, Zhejiang University Hangzhou International Science & Innovation Center

• Southeast University

  … (List continues to update)

 

100+ Enterprises Recruiting On-Site

 

A large-scale talent recruitment fair will be held on-site, with over 100 companies including SMC Automation, NAURA Technology Group, AMEC, and Tongfei Co., Ltd. posting job openings. Company HR representatives will conduct face-to-face interviews with job seekers to improve matching efficiency.

 

(Full recruitment company list provided in the original Chinese; list continues to update)

 

10+ Corporate Presentations – Insights into Trends & Opportunities

 

In the Policy & Corporate Presentation Zone, government representatives and industry leaders will share insights on the semiconductor ecosystem.

 

• Policy Briefings: Government officials will explain support policies for the semiconductor industry, including tax incentives, R&D subsidies, and talent housing programs.

• Corporate Presentations: More than ten enterprises—including AMEC, NAURA Technology Group, Injet Electric, Comed, and Tongfei Co., Ltd.—will introduce their corporate culture, advanced management concepts, and talent needs.

 

(Presentation schedule will be released soon—stay tuned)

 

Event Marketing Opportunities

 

University Achievements Exhibition Registration:

Ms. Liang – +86 18621703936 (WeChat)

Email: qiuqiu@fengm.cn

 

Corporate Presentation Registration:

Mr. Liu – +86 18621701662 (WeChat)

Email: beccaria.liu@cseac.org.cn

 

Sponsorship & Naming Rights:

Mr. Huang – +86 13917571770 (WeChat)

Email: hg@cseac.org.cn

 

You Are Welcome to Register and Join

Fengmi Talent Action · Industry-Education Integration – University Achievements Exhibition & Talent Matchmaking Fair

Date: September 5–6, 2025, 09:00–17:00

Venue: Wuxi Taihu International Expo Center, Hall A4

How to Register: Scan the QR code below to register and get free admission.