Countdown to Opening
The 14th Semiconductor Equipment,Materials and Core Parts Exhibition(CSEAC2026)
The 14th Semiconductor Equipment,Materials and Core Parts Exhibition(CSEAC2026)will be held from August 31 to September 2 in 2026 at Wuxi Taihu International Expo Center.Over the years,CSEAC has brought together industry experts,researchers,exhibitors,and professional visitors,building a strong reputation for professionalism,industry influence,and high-quality resources.With the aim of "professionalism, industrialization, and internationalization,"CSEAC provides a friendly and cooperative platform for the domestic and international semiconductor industry to exchange technologies,conduct business negotiations,expand markets,and promote products.
Statement
Any attempt to pre-order booth space, advertise, inquire, or register as an attendee without going through the official channels designated by the CSEAC Organizing Committee,(including www.cseac.org.cn, the CEPEM official account, or calling 021-61009295/61009296) are invalid. Any disputes or financial losses arising from such activities will be borne by the individual.
CSEAC Organizing Committee
October 22, 2025
Exhibition Highlights
CSEAC 2026 Agenda
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Main Forum: 2026 China Electronic Special Equipment Industry Association Semiconductor Equipment Annual Conference |
Seminar on Etching Technology, Processes and Equipment |
| Seminar on Thin-Film Deposition Technology, Processes and Equipment | Seminar on the Advanced Process Cleaning Technology and Equipment |
| Seminar on Measurement Technology and Equipment | Seminar on the Advanced Process Cleaning Technology and Equipment |
| Seminar on the Development of Artificial Intelligence and Electronic Manufacturing Equipment | Global Semiconductor CEO Forum |
| Forum on the Platformization of Semiconductor Equipment and Synergy among Core Parts | New Product and Technology Launch |
| Forum on New Devices and Processes Driving Innovation and Development of New Materials and Equipment | Challenges of Industrial Robots in Smart Manufacturing |
| Human Resources: Thematic Roadshow on the Commercialization of University-Industry-Research Collaboration | The 18th Integrated Circuit Packaging and Testing Industry Chain Innovation and Development Forum (CIPA 2026) |
| Forum on the Collaborative R&D in Advanced Packaging Technologies for the AI Era | Forum on the Innovation in Packaging and Testing Equipment and Materials |
| Forum on the Supply Chain Security and Cross-Industry Collaboration in the Packaging and Testing Market | 2026 Forum on the Development of Integrated Circuit Equipment, Materials and Parts |
| 2026 (the 5th) Semiconductor Ecosystem Innovation Conference | Path to Sovereign Semiconductor Fab |