Countdown to Opening
The 14th Semiconductor Equipment,Materials and Core Parts Exhibition(CSEAC2026)
The 14th Semiconductor Equipment,Materials and Core Parts Exhibition(CSEAC2026)will be held from August 31 to September 1 in 2026 at Wuxi Taihu International Expo Center.Over the years,CSEAC has brought together industry experts,researchers,exhibitors,and professional visitors,building a strong reputation for professionalism,industry influence,and high-quality resources.With the aim of "professionalism, industrialization, and internationalization,"CSEAC provides a friendly and cooperative platform for the domestic and international semiconductor industry to exchange technologies,conduct business negotiations,expand markets,and promote products.
Statement
Any attempt to pre-order booth space, advertise, inquire, or register as an attendee without going through the official channels designated by the CSEAC Organizing Committee, (including www.cseac.org.cn, the CEPEM official account, or calling 021-61009295/61009296)are invalid. Any disputes or financial losses arising from such activities will be borne by the individual.
CSEAC Organizing Committee
October 22, 2025
Exhibition Highlights
CSEAC 2026 Agenda
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Main Forum: 2026 China Electronic Special Equipment Industry Association Semiconductor Equipment Annual Conference |
Seminar on Etching Technology, Processes and Equipment |
| Seminar on Thin-Film Deposition Technology, Processes and Equipment | Seminar on the Advanced Process Cleaning Technology and Equipment |
| Seminar on Measurement Technology and Equipment | Seminar on the Advanced Process Cleaning Technology and Equipment |
| Seminar on the Development of Artificial Intelligence and Electronic Manufacturing Equipment | Global Semiconductor CEO Forum |
| Forum on the Platformization of Semiconductor Equipment and Synergy among Core Parts | New Product and Technology Launch |
| Forum on New Devices and Processes Driving Innovation and Development of New Materials and Equipment | Challenges of Industrial Robots in Smart Manufacturing |
| Human Resources: Thematic Roadshow on the Commercialization of University-Industry-Research Collaboration | The 18th Integrated Circuit Packaging and Testing Industry Chain Innovation and Development Forum (CIPA 2026) |
| Forum on the Collaborative R&D in Advanced Packaging Technologies for the AI Era | Forum on the Innovation in Packaging and Testing Equipment and Materials |
| Forum on the Supply Chain Security and Cross-Industry Collaboration in the Packaging and Testing Market | 2026 Forum on the Development of Integrated Circuit Equipment, Materials and Parts |
| 2026 (the 5th) Semiconductor Ecosystem Innovation Conference | Path to Sovereign Semiconductor Fab |
| Opening Ceremony of Wuxi Innovation and Development Conference |