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Hall A6, Taihu International Expo Center, Wuxi, ChinaSeminar on the Development of Artificial Intelligence and Electronic Manufacturing EquipmentSeminar on the Development of Artificial Intelligence and Electronic Manufacturing Equipment Semiconductor production and testing equipment designed and optimized for the manufacture of AI chips (such as GPUs, ASICs and NPUs) has entered a phase of rapid iteration, driven by both the explosive growth in large-model computing power and the evolution of advanced manufacturing and packaging processes. Such equipment places extremely high demands on process precision, stacking and interconnections, and serves as the core hardware foundation underpinning the explosive growth in artificial intelligence computing power. Key topics: (1) Specific requirements and technical challenges for semiconductor equipment in AI chip manufacturing (2) R&D and application of integrated line solutions for domestically produced semiconductor equipment (3) Pathways to breakthroughs in the localization of core parts for semiconductor equipment (4) Application of AI technology in equipment R&D, process debugging, and production line operation and maintenance (5) Industry chain collaboration: cooperation models between equipment manufacturers, chip manufacturers, part manufacturers and capital
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Hall A4, Taihu International Expo Center, Wuxi, ChinaGlobal Semiconductor CEO ForumBringing together leading entrepreneurs and executives from the global semiconductor industry, the event will address the challenges of industrial globalization, supply chain restructuring, and opportunities for technological competition and collaboration, whilst discussing future strategic planning for the sector and establishing a platform for high-level dialogue and resource networking.
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Hall A5, Taihu International Expo Center, Wuxi, ChinaForum on the Platformization of Semiconductor Equipment and Synergy among Core PartsThis forum focuses on the platformized design of semiconductor equipment, modular R&D, and the coordinated localization of core parts (such as pumps, valves, chambers and precision motion parts). It aims to integrate the industrial chains for complete equipment and parts, thereby reducing costs and enhancing the autonomy and controllability of the supply chain.
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Hall B5, Taihu International Expo Center, Wuxi, ChinaNew Product and Technology LaunchThis event serves as a platform for showcasing technology, facilitating the commercialisation of research outcomes and promoting brands. It brings together the latest technological achievements and innovative products in the fields of semiconductor equipment, materials and parts, with the aim of accelerating the market adoption of cutting-edge technologies. Priority will be given to winners of the Innovation Award.
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Hall B5, Taihu International Expo Center, Wuxi, ChinaForum on New Devices and Processes Driving Innovation and Development of New Materials and EquipmentIn response to the demand for new devices such as third-generation semiconductors and advanced logic/memory chips, we will explore pathways for collaborative innovation in new processes, materials and equipment, integrate the ‘device–process–material–equipment’ industrial chain, and support the development of next-generation semiconductor technologies.
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Hall B5, Taihu International Expo Center, Wuxi, ChinaChallenges of Industrial Robots in Smart ManufacturingFocusing on the application of industrial robots in high-precision and high-tech scenarios such as semiconductor manufacturing and electronic assembly, this session will explore challenges relating to precision, stability, cleanliness and adaptability, share smart manufacturing solutions, and promote the deep integration of industrial robots with electronic manufacturing.
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Hall A5, Taihu International Expo Center, Wuxi, ChinaForum on the Collaborative R&D in Advanced Packaging Technologies for the AI EraThe explosion in AI computing power has propelled advanced packaging technology to the forefront as the key avenue for breaking through chip performance bottlenecks. The forum has invited industry packaging experts to jointly explore the evolution of advanced packaging technologies during the 15th Five-Year Plan period, resolve industry challenges, and help secure a competitive edge. It will also focus on discussing the ‘seven key advantages’ and ‘four major challenges’ associated with CoWoP packaging technology, whilst exploring new pathways for cross-sector integration and full-chain collaboration through the application of the STCO methodology (System-level Collaborative Optimization).
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Wuxi International Conference Center,Wuxi, ChinaThe 18th Integrated Circuit Packaging and Testing Industry Chain Innovation and Development Forum (CIPA 2026)This year’s forum will focus on the current global landscape of the semiconductor packaging and testing industry and the state of China’s integrated circuit packaging and testing sector. It will explore strategies for enterprises across the upstream and downstream segments of the industry chain and supply chain to capitalise on the opportunities presented by the implementation of the 15th Five-Year Plan, as well as plans for collaborative innovation and development between industry, academia and research institutions. The event will also feature a plaque presentation ceremony for the current and rotating chairpersons.
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Hall A4, Taihu International Expo Center, Wuxi, ChinaHuman Resources: Thematic Roadshow on the Commercialization of University-Industry-Research CollaborationBy linking university research resources with the industrial needs of enterprises, this event features roadshows showcasing technological achievements in the fields of semiconductor equipment and integrated circuits. It aims to foster in-depth industry-academia-research collaboration and technology transfer, cultivate talent urgently needed by the industry, and strengthen the foundations of industrial innovation.