CSEAC 2026

Honorary Chairman of Jiangsu Semiconductor Industry Association

A PhD candidate at Xi'an Jiaotong University, he serves as Chairman of Xi'an ESWIN Materials, concurrently holding positions as Executive Director of Shaanxi Semiconductor Association and Co-President of Xi'an Alumni Association of Xi'an Jiaotong University.
With over 20 years of experience in general semiconductor technology and management, he once held senior management roles at multiple BOE factories. He joined ESWIN Group in 2018 to oversee the layout and operation of its materials business.
Under his leadership, the enterprise has become a leading domestic supplier of 12-inch electronic-grade silicon wafers listed on the Sci-Tech Innovation Board. It operates three factories in Xi'an and Wuhan, with a full-capacity monthly output of 1.8 million wafers. He has been honored as a national leading talent, a model worker in the national industry and information technology system, and an innovative leading talent of Shaanxi Province. 

Mr. Liu Erzhuang graduated from Xi'an Jiaotong University with a major in Semiconductor, obtained his Doctor of Applied Physics degree from the University of Dundee in the UK, and completed his postdoctoral research in Applied Physics at Harvard University. He has successively served as Engineering Director at Chartered Semiconductor Singapore, Factory Director at Shanghai Advanced Semiconductor, Vice President of China, General Manager / Group Vice President at Lam Research China, and Executive Vice President at Tsinghua Unigroup. In 2021, he joined Shanghai Pudate Semiconductor as CEO.

Chairman of Britech Semiconductor

Sysy Shen is a post-80s young entrepreneur and Economic Professor.
In 2010, she was recruited under Shanghai’s “Pujiang Talent Program” and has since dedicated over a decade to serving the national integrated circuit (IC) industry through supply chain solutions. She currently chairs HMG Supply Chain Group and founded Shanghai HMG Digital Intelligence Technology , and Wanliutang (Shanghai) Cultural Communication.
She pioneered the digitization of cross-border supply chains, building an online-offline integrated ecosystem that seamlessly connects customers, logistics providers, government regulators (Customs, Forex, Tax, Commerce, Drug Administration), crowdsourced service partners, and financial institutions. This interconnectivity empowers the “China Chip” industry with efficient, compliant, and resilient support.

President of National Silicon Industry Group

President of Beijing NAURAMicroelectronics Equipment Co.,Ltd. 

Academician of the RAS;Chief Researcher;First Vice-Rector of the Academic University of the RAS;Professor at the K.A.Valiev Institute of Integrated Electronics (MIET) 

President of Nuclei System Technology Co.Ltd.

CEO of Shanghai MILEX Semiconductor Co ,Ltd.

Head of Aerospace & Electronics Department of Moroccan Investment and Export Development Agency — AMDIE

Director of Enterprise Ireland for Greater China

Ma Qinghai, senior economist, SMC global director, general manager of SMC China; as an early entrepreneur of SMC China, he participated in and presided over the establishment of a research and development center and four modern manufacturing plants in Beijing. In recent years, he replanned the business blueprint of SMC China Asia Pacific, reorganized the marketing system of SMC China, and comprehensively promoted the SMC BCP (Business Continuity Plan) plan, SDGS business, energy saving & CO2 reduction business, and created a high-end equipment and core parts supporting enterprise with a value of tens of billions.

Chairman and President of Hua Hong Grace Semiconductor Limited

Chairman, China Resources Microelectronics Limited

Deputy Director of the Administrative Committee of Wuxi High-tech Zone and Mayor of Xinwu District, Wuxi

Secretary-General of the Semiconductor Materials Branch, CEMIA; Former Chief Expert, CETC 46th Research Institute.

Secretary-General, CEPEA

Tian Donglong, Doctor, Senior Engineer. He currently serves as Deputy General Manager and Director of Coating Division of Shanxi Zhongdianke Electronic Equipment Co., Ltd., in charge of the R&D of coating equipment and process technology.
He has long been engaged in the purification and coating of semiconductor components, led multiple provincial key research projects for the industrialization of PG, solid-SiC series coating equipment, published more than 10 academic papers and holds over 40 patents. He was honored as the "Outstanding Young Talent of CETC".
He is an equipment technology expert of the CETC Coating Equipment Engineering Research Center, and a member of the expert database of Shanxi Provincial Department of Industry and Information Technology. He has built a provincial research platform for domestic semiconductor technology. Committed to developing integrated solutions of "Equipment + Process + Service", he promotes the localized implementation of semiconductor component purification and coating technology.

Deputy General Manager，Shanghai RunPin Electronic Materials Co.,Ltd.

Liu Xianbing, National Distinguished Expert, Jiangsu Provincial and Suzhou Level 3 Leading Talent. He is the Founder, Chairman and General Manager of Suzhou Kema Materials Technology Co., Ltd.
He holds a Doctorate in Mechanical Engineering from the University of Connecticut, USA. He worked as a Postdoctoral Researcher at the Institute of Advanced Manufacturing, University of Connecticut, and a Postdoctoral Researcher as well as Deputy Director of the IMS-M Laboratory in the Department of Mechanical and Aerospace Engineering, University of California, Davis. He was appointed as a special reviewer for multiple well-known academic journals.
He previously worked at LTD Ceramics, Inc., an advanced ceramics enterprise in Silicon Valley, California, serving as R&D Manager and concurrently General Manager of its sister company LCL International.
He possesses more than 25 years of overseas experience in scientific research, industrialization and management within the advanced ceramics sector.

Zhou Ming, General Manager of Saimeike Advanced Materials Co., Ltd.
He serves as Director of the Testing & Application Branch of China Nuclear Society Nuclear Graphite & Carbon Materials, Director of the Integrated Circuit Materials Industry Technology Innovation Alliance, and person-in-charge of a national new material major special project.
He has long been engaged in business operation management and technical planning for special graphite and advanced carbon material enterprises. He actively promotes collaborative innovation in the semiconductor industrial chain, and strives to advance the domestic production of semiconductor-grade special graphite and advanced carbon materials.
He holds 11 invention patents, participated in formulating 1 national standard, and has published multiple EI papers.

Yang Shaohui, Deputy General Manager of Starqi (Shanghai) Semiconductor Co., Ltd.
He serves as Director of China IC Components Innovation Alliance, Director of China Electronics Equipment Industry Association, Director of Shanghai Integrated Circuit Association, and Director of Shenzhen Semiconductor and Integrated Circuit Industry Alliance.
He has more than ten years of research and professional experience in the semiconductor equipment and components industry.

Meng Qingwen, Chief Engineer of Fluoropolymer Division, Zhejiang Juhua Co., Ltd., Professor-level Senior Engineer.
He is Expert Committee Member of China Fluorosilicone Organic Materials Industry Association, Special Expert of Plastics Processing Committee of China Plastics Industry Association, Special Senior Expert of National Fluorine Materials Engineering Technology Research Center, Enterprise Supervisor for Master of Engineering at East China University of Science and Technology, Master Tutor at Zhejiang University and Zhejiang University of Technology, and Editorial Board Member of Chemical Production and Technology.
He is listed as Quzhou Top 115 Talents in Zhejiang Province and "Five-One" Talent of Enterprises Affiliated to Zhejiang Provincial State-owned Assets Supervision and Administration Commission.
He has won the First Prize of Science and Technology Progress Award of Petrochemical Joint Association, the Second Prize of Zhejiang Provincial Science and Technology Progress Award, Special Award, First Prize and Standard Contribution Special Award of China Fluorine Industry Technical Innovation, as well as First Prize for Patents.
He has received 6 First Prizes and 3 Second Prizes of Juhua Group Science and Technology Progress Award, and holds more than 50 authorized patents.
He participated in formulating 1 international standard and 1 national standard, and presided over or participated in more than 10 association standards.
He has supervised over 20 postgraduate students, published 2 monographs and more than 40 professional papers.

Que Xiaoying, Director of Application Technology, Feichao (Shanghai) New Materials Co., Ltd.
She has over ten years of process experience in display panel and semiconductor industries, specializing in core technologies of fluid purification and precision filtration & separation. She has long been committed to the R&D and on-site implementation of high-purity medium filtration solutions.
She has led the R&D and performance iteration of multiple high-end semiconductor precision filter components and high-purity medium filter assemblies. She excels at identifying pain points under working conditions, and efficiently converts customers’ actual production demands and stringent process standards into actionable quantitative technical parameters and product development indicators.
She continuously promotes independent technological breakthroughs of core components for ultra-high-purity filtration and high-precision separation in the semiconductor sector, and steadily advances the localization substitution of high-end semiconductor filters. She provides solid technical support for the industry to improve purification efficiency, reduce costs and stabilize mass production.

 Senior Analyst of ICMtia

Senior Engineer of Zhejiang Juhua Co., Ltd

CEO, Joint-Stock Company "International Science and Technology Center MIET" 

Director of Strategic Research Electronis, Industrial Development Center

Head of the Electronics Industry Chemicals Division

PhD, CEO, Joint Stock Company «Semiconductor Technologies and Equipment»

Executive Director, Sberbank of Russia

 Secretary-General of Jiangsu Semiconductor Industry Association

Deputy General Manager, Shanghai Cheyitian Technology Ltd.

General Manager, Schalod Industry Technology (Shanghai) Co.,Ltd

Senior Vice‑President of Process Engineering, ACM Research (Shanghai), Inc.

 Product Director, HMG Supply Chain Group

Zhou Yibin, co-founder of Zhihe Technology Group, currently serves as the Group's Deputy General Manager and Chief Technology Officer. With deep expertise in semiconductor manufacturing and process technology, he possesses comprehensive experience across the entire chain of industrial product design, R&D, and mass production. He has obtained a total of 45 authorized patents, including 13 invention patents. The products he led in developing have been widely applied in leading semiconductor companies such as Huahong, Jinghe, and Longjiang Memory.

Sales Manager, SHANGHAI-FANUC Robomachine Co., Ltd.

Member, The Engineering Academy of Japan & Chief Expert, SDIC Group; Chief Scientist, China Electronics Engineering Design Institute Co., Ltd. His research is centered on the R&D and application of seismic isolation and mitigation technologies as well as micro‑vibration control for electronic manufacturing facilities.

He has led his team to establish a nano‑scale micro‑vibration laboratory and successfully developed the world’s first large‑scale micro‑vibration simulation test‑bed. His team completed China’s first‑ever performance evaluation tests for active‑control products and assessment experiments on vibration‑control standards for precision equipment. Achieving world‑leading technical performance, these achievements have driven the advancement of advanced‑electronic‑manufacturing technologies in China.

Professor at Beijing University of Technology (BJUT); Deputy Secretary‑General of the China Electronic Special Equipment Industry Association; Director of the Institute of High‑End Semiconductor Equipment, Beijing University of Technology. He is a recipient of the Beijing Science and Technology Nova Program, with more than 10 years of R&D experience in semiconductor equipment.

He has undertaken over 10 research projects including the National 02 Major Project, National Natural Science Foundation of China, and the Beijing Science and Technology Nova Program. He has received five provincial‑ministerial‑level science and technology awards, published one monograph and more than 30 papers, and holds over 50 patents.

Program Director, MTT Program, Fudan University

Associate Professor, School of Sciences, Shanghai University

Professor, College of Integrated Circuits, Zhejiang University

Professor, College of Integrated Circuits, Zhejiang University

Professor, School of Sciences, Hangzhou Dianzi University

Professor, School of Intelligent Robotics and Advanced Manufacturing, Fudan University

Professor, School of Electronic Science and Engineering, University of Electronic Science and Technology of China

Professor, School of Vehicle Engineering, Chongqing University of Technology

Professor, School of Information Science and Engineering, Shandong University

Professor, College of Sciences, Shanghai University

Professor, School of Information and Electronic Engineering, East China Normal University

Dr., School of Materials Science and Engineering, Jiangxi University of Science and Technology

Dr., School of Information Science and Engineering, Shandong University

Professor, School of Microelectronics, Xidian University

Professor, Zhangjiang Institute for Advanced Study, Shanghai Jiao Tong University

Professor, School of Metallurgy, Northeastern University

Assistant Researcher, Ningbo Institute of Materials Technology and Engineering, Chinese Academy of Sciences

Group Vice President, Human Resources,Advanced Micro-Fabrication Equipment Inc. China

Director,Piotech,Inc

Director,Suzhou AODE Precise Equipment Co., Ltd.

Sale，COMET

HR ，COMET

HR Manager,Beijing Electronics Inspection and Metrology Equipment Co., Ltd.

HR Manager, Suzhou Baicon Sensor Technology Co., Ltd.

HRD,Shenzhen CSL Vacuum Science and Technology Co., Ltd.

Party Secretary, Faculty of Integrated Circuits, Xidian University

Secretary‑General, China Association for Electronic Special Equipment Industry

 Chairman, Microelectronics Alumni Association of Xidian University

 Deputy Director, Alumni Association of Xidian University

Chairman, Qili Semiconductor (Shaoxing) Co., Ltd.

Marketing Lead, United Microelectronics Center Co., Ltd.

Chairman, Shanghai Gejing Semiconductor Co., Ltd.

Chairman, Gallium Future Semiconductor Technology (Jinjiang) Co., Ltd.

Professor, School of Microelectronics, Xidian University

 Chairman & General Manager, Lizhu Intelligent Equipment Co., Ltd.

Vice President, GrandTrans (Zhejiang) Co., Ltd.

Advanced Technology R&D Manager, GreatTech Substrates Co., Ltd.

Marketing Planning & Information Dept, ACCRETECH (CHINA) CO., LTD

Marketing Planning & Information Dept, ACCRETECH (CHINA) CO., LTD

Country Technical Manager - China,Indium Corporation

Marketing Director, HT-Tech

CRRC scientist、Deputy Director, National Key Lab of Power Semiconductor and Integration; Associate Dean, School of Integrated Circuits, Southwest Jiaotong University

chairman, RMT

Marketing director, Guangzhou Zen Semiconductor Corporation

Technical Director, Shanghai Lanzhen Environmental Protection Technology Co., Ltd.

General Manager, Shanghai Lin-gang Special Area International Investment & Development Cpo.,Ltd.

General Manager, Software System, Beijing Naura Microelectronics Equipment Co., Ltd.

He has more than 20 years of experience in the semiconductor inspection equipment industry, including 15 years of experience working at relevant Fab facilities and internationally renowned inspection equipment manufacturers. He has been responsible for market development and product applications for wafer geometry and morphology measurement and particle defect inspection equipment in China.

He joined Zhong’an Semiconductor in 2021, where he has been responsible for market development and technology expansion. He led the marketing and R&D teams in rapidly completing the development, validation, and commercialization of geometry and morphology measurement equipment benchmarked against KLA. To date, nearly 20 systems have been installed domestically.

He has also been deeply involved in market research and strategic direction-setting for Zhong’an Semiconductor’s unpatterned wafer particle inspection equipment. Following the launch of an inspection system with 19 nm sensitivity capable of meeting the requirements of 14 nm mass production, he rapidly expanded the domestic market and secured demo orders from multiple customers.

Secretary-General, CEPEA

Professor-level Senior Engineer and a State Council Special Allowance Expert. He has long been engaged in semiconductor manufacturing equipment and the integrated circuit industry, as well as international cooperation, international M&A research, and industrialization. He has led major national and provincial-level projects involving integrated circuit manufacturing equipment, semiconductor materials manufacturing equipment, electronic component manufacturing equipment, intelligent manufacturing equipment, and enterprise informatization. He has received 10 National and Ministerial Science and Technology Progress Awards, as well as the China Outstanding Young Science and Technology Entrepreneurship Award, and enjoys a special allowance from the State Council.

Previous Positions:

1. Director, Electronic Manufacturing Equipment Institute of the Ministry of Information Industry (Institute No. 40)
2. Director, Industrial Development Department, China Electronics Technology Group Corporation
3. Director, International Business Department, China Electronics Technology Group Corporation
4. Deputy Chief Engineer, China Electronics Technology Group Corporation
5. Vice Chairman, China Invention Association.

Chairman & CEO, Advanced Micro-Fabrication Equipment Inc. China

Dr. Dong Boyu, CPC member, Doctor of Engineering, and Research Fellow. He currently serves as President of Naura Technology Group Co., Ltd. and Chairman of Shenyang Keyi Microelectronics Equipment Co., Ltd. He is a National-level Talent, Chairperson of the China Electronic Special Equipment Industry Association, Beijing Scholar, Distinguished Expert of Beijing Municipality, and Changjiang Scholar Distinguished Professor at Xidian University.

He has long been engaged in the R&D of integrated circuit equipment. As the principal investigator, he has led dozens of national key scientific and technological research projects. He has developed more than 10 types of integrated circuit equipment across four major series and achieved full industrialization, filling multiple domestic market gaps. His research achievements have generated nearly 10 billion yuan in direct economic benefits. He holds 85 domestic and foreign invention patents and has published over 40 academic papers.

His prestigious honors include the National Outstanding Engineer Team Award, the First Prize of Beijing Municipal Science and Technology Progress Award, Beijing Model Worker, Capital Labor Medal, and Beijing High-Level Overseas Talent.

Zhang Fan, Professor/Deputy General Manager of Technology/Technology Manager, Director of Research Institute of Unicomp Technology (Group) Co., Ltd., Vice Chairman of the 10th Council of China Electronic Production Equipment Industry Association/Chairperson of Electronic Assembly Equipment Branch Committee, Senior Member of Chinese Institute of Electronics (representative of the 11th National Members' Congress). He serves as chief technical advisor or lead consultant for multiple projects, and member of the Intellectual Property Working Committee and Standardization Technical Committee, as well as head of provincial-level enterprise technology center and expert in technology or industry, etc.

Second-grade Research Fellow, Doctor of Engineering, and Postdoctoral Supervisor. She is a Special Government Allowance Expert of the State Council.

She has received numerous scientific and technological awards, including one Third Prize of the National Science and Technology Progress Award, one Second Prize of the National Defense Science and Technology Progress Award, as well as six Second Prizes and one Third Prize of Ministerial-level Science and Technology Progress Awards.

She formerly served as Director of the Materials Division at the High-Tech Research and Development Center of the Ministry of Science and Technology. She has long been committed to the management of national science and technology programs such as the National 863 Program and key special projects of the National Key R&D Program in the field of new materials, as well as strategic research on the development of high-tech industries.

He has more than 20 years of experience in the semiconductor inspection equipment industry, including 15 years of experience working at relevant Fab facilities and internationally renowned inspection equipment manufacturers. He has been responsible for market development and product applications for wafer geometry and morphology measurement and particle defect inspection equipment in China.

He joined Zhong’an Semiconductor in 2021, where he has been responsible for market development and technology expansion. He led the marketing and R&D teams in rapidly completing the development, validation, and commercialization of geometry and morphology measurement equipment benchmarked against KLA. To date, nearly 20 systems have been installed domestically.

He has also been deeply involved in market research and strategic direction-setting for Zhong’an Semiconductor’s unpatterned wafer particle inspection equipment. Following the launch of an inspection system with 19 nm sensitivity capable of meeting the requirements of 14 nm mass production, he rapidly expanded the domestic market and secured demo orders from multiple customers.

CEO, Beijing Huafeng Test & Control Technology Co.,Ltd

Head of AI R&D，Nexchip Semiconductor Corporation

Vice President of Electroplating Process Engineering at ACM Research (Shanghai), Inc. He has more than 10 years of industry experience in the R&D of electroplating and planarization equipment and processes for the integrated circuit industry. As a core technical contributor, he participated in two major projects under the Ministry of Science and Technology’s National 02 Special Program.

Main Research Areas: Copper interconnect processes for dual-damascene structures in integrated circuits and metal interconnect processes using through-silicon vias (TSVs) for 3D stacking. His work primarily focuses on the R&D, design, and industrialization of semiconductor processes and equipment technologies for interconnect metal deposition and planarization.

Dr. Mark Zheng joined Nexchip Semiconductor Corporation, in July 2021. He has successively served as Senior Director of the Forward-looking Technology Development Center and Senior Vice President of R&D, and currently holds the position of Co-President.

Dr. Yang Lieyong is Co-Founder & Chief Scientist of Wuyuan Semiconductor Technology (Qingdao) Co., Ltd., with more than 20 years of experience in integrated circuit R&D and a long-standing focus on 3D IC research, development, and manufacturing. He has held positions at several internationally renowned semiconductor manufacturing companies in Singapore, Taiwan, Shanghai, and Beijing. He has published more than 20 papers in academic journals and conferences and holds more than 30 granted patents. He received his bachelor’s degree from Shandong University and earned a Ph.D. in Microelectronics from Nanyang Technological University in Singapore.

Senior Vice President, Chongqing Xinlian Microelectronics Co., Ltd.

 Group Vice President, GM of CCP Etch ProductDivision, Advanced Micro
Fabrication Equipment Inc. China (AMEC)

With 18‑year working experience in the semiconductor industry, he mainly focuses on ion implantation process application, performance improvement and process adaptation of domestic ion implanters.

Deputy General Manager, Jiangsu Leuven Instruments Co., Ltd

Regional General Manager, Yuwei Semiconductor Technology Co.,Ltd

Senior director, Applied Materials, Inc.

Associate Director of Etch BD & Tech Marketing

Deputy Director of Etching Engineering Department, Chongqing Xinlian Microelectronics Co., Ltd

Sales General Manager, Advanced Materials Technology & Engineering Co., Ltd

Technical Expert,  Jiangsu Leuven Instruments Co., Ltd

Process Manager,Lam Research

Dr. Xu Can serves as General Manager of the Metal Deposition Products Division at Advanced Micro-Fabrication Equipment Inc. China (AMEC). With more than a decade of experience specializing in the development and volume production of metal thin films, he possesses extensive hands-on expertise and deep industry insight. In response to China’s demand for advanced logic and memory technologies, he has led the development and commercialization of more than ten advanced metal thin-film deposition products for advanced logic and memory applications.

Dr. Zhang Qintong holds a Ph.D. in Condensed Matter Physics and is a Senior Engineer. He currently serves as CTO of the MDP Business Unit at Beijing NAURA Microelectronics Equipment Co., Ltd. He received his doctoral degree from the Institute of Physics, Chinese Academy of Sciences, and has long been engaged in the R&D and commercialization of metalization process equipment for integrated circuits, as well as the exploration of new processes and materials. He has been invited to deliver presentations at industry conferences including CSTIC and the Atomic-Level Manufacturing Forum. He has published more than 20 papers in international journals, contributed to the book Physical Vapor Deposition Processes and Equipment, and holds more than 20 published and granted patents.

He has 27 years of experience in the integrated circuit and semiconductor industry, including 15 years of experience in Foundry process and integration technology R&D and high-volume manufacturing management at GlobalFoundries, IBM, and SMIC, as well as 12 years of experience in equipment R&D, technology development, and market development at Lam Research and AMEC. He currently serves as General Manager of the Atomic Layer Deposition Business Unit at Piotech (Shanghai) Co., Ltd. He holds a Ph.D. in Chemistry and Materials from the National University of Singapore, with more than 35 U.S. and Chinese patents and 25 publications in international academic journals and conferences.

He is Chief Technology Officer of Qingdao Sirui Intelligent Technology Co., Ltd. He has long been dedicated to the R&D of ion implanters and atomic layer deposition (ALD) equipment. He has extensive and systematic hands-on experience in the development, engineering, and commercialization of a full range of ion implanters. Under his leadership, his team successfully developed multiple first-of-their-kind domestically manufactured ion implanters, which subsequently passed high-volume manufacturing validation at customer sites. In recognition of his outstanding contributions, he was selected for the Taishan Industry Leading Talent Program of Shandong Province and received an Outstanding rating.

He holds a Ph.D. in Materials Science and Engineering from National Tsing Hua University in Taiwan and currently serves as a Senior Director of R&D at Nexchip Semiconductor Corporation. He specializes in advanced process technologies including metal silicides, epitaxial growth, ultra-shallow junctions, and emerging memory technologies. With more than 28 years of hands-on experience in the semiconductor industry, he holds 111 U.S. patents and has long been engaged in research on integrated circuit processes and materials applications. He has made outstanding contributions to technological innovation in the semiconductor industry, leading teams in advancing numerous innovative projects, developing multiple new processes, and helping improve process performance and product competitiveness. He has established a strong influence in the global semiconductor industry.

He holds a Ph.D. in Engineering from the University of Tokyo, where he studied under the internationally renowned materials scientist Professor Takuzo Aida. His research has focused on thin-film deposition processes for silicon wafers, and he was a co-first author of a paper published in the prestigious U.S. journal Science. He has published more than ten papers as first author in international journals and conferences, and has filed more than 50 patent applications in mainland China, the United States, Japan, and other jurisdictions. He has been recognized as a Shenzhen Overseas High-Level Talent and selected as a Shenlong Talent. He has long been engaged in process technology and process R&D for Logic devices at technology nodes below 7 nm.

Assistant to the General Manager of Shanghai Jita Semiconductor Co., Ltd. With more than ten years of experience in the semiconductor industry, he/she has long focused on the strategic design and operational execution of supply chain systems, continuously driving the localization of critical raw materials and equipment. He/she has also led the establishment of deep strategic partnerships with multiple leading suppliers and systematically developed a diversified supply structure.

His research focuses primarily on interdisciplinary fundamental and applied research in integrated circuit thin-film equipment and processes. He has been recognized as a Leading Talent of Hefei City and a Jianghuai Talent of Anhui Province, and his technology received the First Prize for Technological Invention from the China Instrument and Control Society. Under his leadership, his team has developed and successfully introduced multiple physical vapor deposition (PVD) systems into high-volume production. He holds more than 20 granted Chinese invention patents and has extensive experience in equipment and process development.

Vice President of Electroplating Process Engineering at ACM Research (Shanghai), Inc. He has more than 10 years of industry experience in the R&D of electroplating and planarization equipment and processes for the integrated circuit industry. As a core technical contributor, he participated in two major projects under the Ministry of Science and Technology’s National 02 Special Program.

Main Research Areas: Copper interconnect processes for dual-damascene structures in integrated circuits and metal interconnect processes using through-silicon vias (TSVs) for 3D stacking. His work primarily focuses on the R&D, design, and industrialization of semiconductor processes and equipment technologies for interconnect metal deposition and planarization.

He holds a Ph.D. in Mechatronic Engineering from Wuhan University and is a National Senior Engineer. He currently serves as General Manager of Beijing Nuohua Capital Investment Management Co., Ltd. He has more than ten years of experience in the semiconductor industry and more than ten years of hands-on experience in investment and mergers and acquisitions. He previously worked at NAURA, where he led the development of multiple semiconductor equipment products.

He was involved in the establishment of Nuohua Capital in early 2020. The firm currently manages funds with total assets under management of RMB 5.1 billion, has invested in more than 50 companies, and has completed two corporate acquisitions. Among its portfolio companies, Kema Technology, Xianfeng Precision, Qiangyi Technology, Torrence, and Chengdu Chaochun have successfully entered the capital markets. Several other portfolio companies are currently undergoing IPO guidance or have had their IPO applications accepted.

Senior Vice‑President of Process Engineering, ACM Research (Shanghai), Inc.

VP of Process, ACM Research (Shanghai), Inc.

Dai Fengwei, male, PhD, Senior Research Director at Huajin Semiconductor Precursor Technology Development Center Co., Ltd. With nearly 20 years of experience in advanced packaging technology development, he specializes in research on wafer-level 2.5D/3D integration technology, opto-electronic co-packaging, hybrid bonding, and other advanced packaging interconnect technologies. He has led or participated in the development of major national projects such as the 02 Major Special Project, the CAS Pioneer A Project, and the Ministry of Science and Technology’s Key Project. He has applied for over 130 patents and has received the Second Prize of the China Electronics Society Science and Technology Award, the Second Prize of the Beijing Science and Technology Award, and the Science and Technology Promotion Award of the Chinese Academy of Sciences.

1. Mao Si Engineer 4 years
2. Manager, Fab Plant Department, UMC Group. 12 years of experience.
3. Sino-US Group (Zhaoyuan Technology) – Engineering/R&D Department Director, 6 years.
4. San'an Optoelectronics (Jing'an) – Vice President of R&D – 5 years
Yuan Fan Semiconductor, Chief Technology Officer, since October 2024.

Zhang Zhengwei graduated from Zhejiang University with a degree in Materials Science and Engineering in 2006. He holds a graduate degree. Currently, he serves as the Technical Director of Anhui Fu Leader and the General Manager of Micro Nano Jingxun. He led the development of advanced process equipment parts for precise cleaning technology for 12-inch semiconductors, developed coating technologies and coating evaluation systems for the semiconductor industry, and established a semiconductor micro-pollution analysis and detection center. He has extensive experience in micro-pollution control, surface structures, and failure modes in the field of precision cleaning.

Product Manager of Melt‑Processable Fluororesin, Juhua Group Co., Ltd.

Chairman, Meijie Semiconductor Equipment (Wuxi) Co., Ltd.