CSEAC 2026

Bringing together leading entrepreneurs and executives from the global semiconductor industry, the event will address the challenges of industrial globalization, supply chain restructuring, and opportunities for technological competition and collaboration, whilst discussing future strategic planning for the sector and establishing a platform for high-level dialogue and resource networking.

This conference will focus on disruptive technologies and practical applications in the semiconductor sector, providing precise insights into new directions for the industry’s evolution. Centred on the need for the deep integration of innovation, industrial, financial and talent ecosystems, we will jointly explore pathways to achieving self-reliance in core technologies and new mechanisms for industrial collaboration, proactively addressing development bottlenecks and opening up new avenues for value growth.

This year’s forum will focus on the current global landscape of the semiconductor packaging and testing industry and the state of China’s integrated circuit packaging and testing sector. It will explore strategies for enterprises across the upstream and downstream segments of the industry chain and supply chain to capitalise on the opportunities presented by the implementation of the 15th Five-Year Plan, as well as plans for collaborative innovation and development between industry, academia and research institutions. The event will also feature a plaque presentation ceremony for the current and rotating chairpersons.

The Russian industry is making confident steps in the development of sovereign equipment, materials, chemistry, and design tools for semiconductor factories. It is important to ensure independence from proprietary technologies by developing own key components and software. Russian manufacturers will present their reports on lithographic, plasma-chemical, metrology and epitaxial equipment, as well as advanced materials, gases and chemistry. Forum will provide an opportunity to discuss the prospects for cooperation between leading Russian and Chinese enterprises in this field.

In response to the demand for new devices such as third-generation semiconductors and advanced logic/memory chips, we will explore pathways for collaborative innovation in new processes, materials and equipment, integrate the ‘device–process–material–equipment’ industrial chain, and support the development of next-generation semiconductor technologies.

This forum focuses on the platformized design of semiconductor equipment, modular R&D, and the coordinated localization of core parts (such as pumps, valves, chambers and precision motion parts). It aims to integrate the industrial chains for complete equipment and parts, thereby reducing costs and enhancing the autonomy and controllability of the supply chain.

By linking university research resources with the industrial needs of enterprises, this event features roadshows showcasing technological achievements in the fields of semiconductor equipment and integrated circuits. It aims to foster in-depth industry-academia-research collaboration and technology transfer, cultivate talent urgently needed by the industry, and strengthen the foundations of industrial innovation.

Drawing on the three major trends in the development of advanced packaging technologies—namely, packaging architecture innovations driven by AI and high-performance computing (such as chiplets, 2.5D/3D and hybrid bonding); heterogeneous integration and system-level synergy emerging as core pathways; and an equal emphasis on self-reliance within the industrial chain and global expansion—we will explore and demonstrate how the latest packaging equipment and key materials (such as substrates, interconnect materials and thermal management materials) support the mass production of higher-density, more reliable packaging structures.

This forum will explore how deep collaboration across the entire industrial chain can empower emerging applications such as data centers, smart vehicles and robotics. Discussions will focus on the current state of supply chain security within China’s packaging and testing industry, deeply identify the risks and challenges facing key segments, and examine targeted strategies to safeguard the supply chain. The event will also feature business matching activities.

As the annual flagship event for leading semiconductor equipment manufacturers, this gathering brings together industry experts, leading enterprises, research institutes and key players across the supply chain. It focuses on industrial policy, technological trends, market dynamics and supply chain security, with participants collaborating to chart a course for independent innovation and high-quality development in domestic semiconductor equipment sector, thereby guiding the industry’s future direction.

Global etching technology is currently evolving towards high selectivity, high uniformity, ultra-low damage and 3D etching. Domestic etching equipment has achieved breakthroughs in areas such as dielectric etching and silicon etching; however, process yield, stability and core parts for advanced processes still require continuous optimization. Key topics: (1) Global advanced etching technology roadways and evolution trends over the next 3–5 years (2) Challenges and solutions in 7nm/5nm advanced process etching (3) Case studies of industrial applications for domestically produced etching equipment and practices for yield improvement (4) Pathways for the localization of core parts in etching equipment (5) Sharing of experiences in joint R&D between foundries and equipment manufacturers, and collaborative process optimization

As advanced processes continue to evolve, thin films are becoming increasingly ultra-thin, uniform, defect-free and highly consistent. Advanced technologies such as ALD have become essential, with domestically produced thin-film deposition equipment now seeing widespread application in mature processes; however, breakthroughs in equipment for advanced processes still need to be accelerated. Key topics: (1) Demand for thin-film materials in advanced processes and innovation directions for deposition technologies (2) Technological iteration and performance upgrades of PVD/CVD/ALD equipment (3) Process control and yield management for thin-film deposition on large-size wafers (4) Applications of domestically produced thin-film deposition equipment in advanced packaging and power devices (5) Integrated innovation across equipment, materials and processes, and the development of supply chain security

Global bonding technology is evolving towards lower temperatures, higher precision, greater reliability and larger dimensions. Domestic bonding equipment is being used reliably in low- to mid-range packaging, whilst breakthroughs in advanced bonding equipment and processes are urgently needed. Key topics: (1) New requirements for bonding technology in advanced packaging (Chip-let/3D stacking) (2) Breakthroughs and industrialization of wafer-level bonding and hybrid bonding technologies (3) Design, manufacturing and commissioning techniques for high-precision bonding equipment (4) Solutions for improving bonding process yield and reliability verification (5) Practical applications of domestic bonding equipment in advanced packaging production lines

As processes continue to shrink, measurement technology is evolving towards nano-scale, non-destructive, high-speed in-line inspection. Whilst domestic measurement equipment has achieved breakthroughs in certain areas, high-end in-line measurement and 3D measurement still rely on imports. Key Topics: (1) Upgraded standards and accuracy requirements for advanced process measurement technologies (2) Technological innovations in optical measurement, electron beam measurement and 3D measurement (3) Integration of in-line measurement with process control to enhance manufacturing efficiency (4) Applications of domestically produced measurement equipment in wafer fabrication and packaging/testing (5) Trends towards AI-driven and intelligent measurement equipment

This event serves as a platform for showcasing technology, facilitating the commercialisation of research outcomes and promoting brands. It brings together the latest technological achievements and innovative products in the fields of semiconductor equipment, materials and parts, with the aim of accelerating the market adoption of cutting-edge technologies. Priority will be given to winners of the Innovation Award.

Semiconductor production and testing equipment designed and optimized for the manufacture of AI chips (such as GPUs, ASICs and NPUs) has entered a phase of rapid iteration, driven by both the explosive growth in large-model computing power and the evolution of advanced manufacturing and packaging processes. Such equipment places extremely high demands on process precision, stacking and interconnections, and serves as the core hardware foundation underpinning the explosive growth in artificial intelligence computing power. Key topics: (1) Specific requirements and technical challenges for semiconductor equipment in AI chip manufacturing (2) R&D and application of integrated line solutions for domestically produced semiconductor equipment (3) Pathways to breakthroughs in the localization of core parts for semiconductor equipment (4) Application of AI technology in equipment R&D, process debugging, and production line operation and maintenance (5) Industry chain collaboration: cooperation models between equipment manufacturers, chip manufacturers, part manufacturers and capital

The explosion in AI computing power has propelled advanced packaging technology to the forefront as the key avenue for breaking through chip performance bottlenecks. The forum has invited industry packaging experts to jointly explore the evolution of advanced packaging technologies during the 15th Five-Year Plan period, resolve industry challenges, and help secure a competitive edge. It will also focus on discussing the ‘seven key advantages’ and ‘four major challenges’ associated with CoWoP packaging technology, whilst exploring new pathways for cross-sector integration and full-chain collaboration through the application of the STCO methodology (System-level Collaborative Optimization).

This year’s forum will focus on the current global landscape of the semiconductor packaging and testing industry and the state of China’s integrated circuit packaging and testing sector. It will explore strategies for enterprises across the upstream and downstream segments of the industry chain and supply chain to capitalise on the opportunities presented by the implementation of the 15th Five-Year Plan, as well as plans for collaborative innovation and development between industry, academia and research institutions. The event will also feature a plaque presentation ceremony for the current and rotating chairpersons.

Global bonding technology is evolving towards lower temperatures, higher precision, greater reliability and larger dimensions. Domestic bonding equipment is being used reliably in low- to mid-range packaging, whilst breakthroughs in advanced bonding equipment and processes are urgently needed. Key topics: (1) New requirements for bonding technology in advanced packaging (Chip-let/3D stacking) (2) Breakthroughs and industrialization of wafer-level bonding and hybrid bonding technologies (3) Design, manufacturing and commissioning techniques for high-precision bonding equipment (4) Solutions for improving bonding process yield and reliability verification (5) Practical applications of domestic bonding equipment in advanced packaging production lines