Forum on the Supply Chain Security and Cross-Industry Collaboration in the Packaging and Testing Market

This forum will explore how deep collaboration across the entire industrial chain can empower emerging applications such as data centers, smart vehicles and robotics. Discussions will focus on the current state of supply chain security within China’s packaging and testing industry, deeply identify the risks and challenges facing key segments, and examine targeted strategies to safeguard the supply chain. The event will also feature business matching activities.

Meeting time	Monday, August 31st, 13:30-16:10
Meeting address	The Orchid Hall ,World Hotel Grand Juna Wuxi

13:30 -13:50
Power Semiconductor and Integration Technology in the AI Era
Liu Guoyou

CRRC scientist、Deputy Director, National Key Lab of Power Semiconductor and Integration; Associate Dean, School of Integrated Circuits, Southwest Jiaotong University

CRRC scientist、Deputy Director, National Key Lab of Power Semiconductor and Integration; Associate Dean, School of Integrated Circuits, Southwest Jiaotong University
Attend Meeting

Forum on the Supply Chain Security and Cross-Industry Collaboration in the Packaging and Testing Market
Monday, August 31st, 13:30-16:10

8other guests
Liu Guoyou

CRRC scientist、Deputy Director, National Key Lab of Power Semiconductor and Integration; Associate Dean, School of Integrated Circuits, Southwest Jiaotong University
13:50 -14:10
AI application scenario requirements push various packaging
Jiaen Fang

chairman, RMT

chairman, RMT
Attend Meeting

Forum on the Supply Chain Security and Cross-Industry Collaboration in the Packaging and Testing Market
Monday, August 31st, 13:30-16:10

8other guests
Jiaen Fang

chairman, RMT
14:10 -14:30
Introduction to the IC Industry Development in Lingang Special Area
Cao Yang

General Manager, Shanghai Lin-gang Special Area International Investment & Development Cpo.,Ltd.

General Manager, Shanghai Lin-gang Special Area International Investment & Development Cpo.,Ltd.
Attend Meeting

Forum on the Supply Chain Security and Cross-Industry Collaboration in the Packaging and Testing Market
Monday, August 31st, 13:30-16:10

8other guests
Cao Yang

General Manager, Shanghai Lin-gang Special Area International Investment & Development Cpo.,Ltd.
14:30 -14:50
Solving the pain points in advanced packaging VOC management LACO high-efficiency adsorption and low-temperature catalytic degradation integrated solution
Jinhua

Technical Director, Shanghai Lanzhen Environmental Protection Technology Co., Ltd.

Technical Director, Shanghai Lanzhen Environmental Protection Technology Co., Ltd.
Attend Meeting

Forum on the Supply Chain Security and Cross-Industry Collaboration in the Packaging and Testing Market
Monday, August 31st, 13:30-16:10

8other guests
Jinhua

Technical Director, Shanghai Lanzhen Environmental Protection Technology Co., Ltd.
14:50 -15:10
Innovations and Independent Breakthroughs of Ultrasonic Inspection in Advanced Packaging
Frank Duan

Director & EVP GM of SBT Ultrasonic Technology Co., Ltd.

Frank Duan, Director & EVP GM of SBT Ultrasonic Technology Co., Ltd., is a senior engineer holding a Master's degree from Shanghai Jiao Tong University's School of Mechanical Engineering and currently pursuing a Ph.D. at Tsinghua University. With 15 years of specialized experience in ultrasonic technology, he focuses on ultrasonic testing and bonding technologies, driving product development across semiconductor and new energy application markets.
Attend Meeting

Forum on the Supply Chain Security and Cross-Industry Collaboration in the Packaging and Testing Market
Monday, August 31st, 13:30-16:10

8other guests
Frank Duan

Director & EVP GM of SBT Ultrasonic Technology Co., Ltd.
15:10 -15:30
Self-controllable Core Equipment: Practice and Development of Domestic Wafer Transfer Robots
Jacky Lin

Chairman&CTO, Honghu (Suzhou) Semiconductor

Chairman&CTO, Honghu (Suzhou) Semiconductor
Attend Meeting

Forum on the Supply Chain Security and Cross-Industry Collaboration in the Packaging and Testing Market
Monday, August 31st, 13:30-16:10

8other guests
Jacky Lin

Chairman&CTO, Honghu (Suzhou) Semiconductor
15:30 -15:50
Packaging & Testing Supply Chain Under Multi-Type Wafer Process Integration: MEMS, BCD and Silicon Photonics
Aileen Deng

Marketing director, Guangzhou Zen Semiconductor Corporation

Marketing director, Guangzhou Zen Semiconductor Corporation
Attend Meeting

Forum on the Supply Chain Security and Cross-Industry Collaboration in the Packaging and Testing Market
Monday, August 31st, 13:30-16:10

8other guests
Aileen Deng

Marketing director, Guangzhou Zen Semiconductor Corporation
15:50 -16:10

Capital-Driven Integration and Legal Safeguarding

ZHANG NEI

Partner, King & Wood

Partner, King & Wood

Attend Meeting

ZHANG NEI

Partner, King & Wood