Seminar on Advanced Bonding Technology, Processes and Equipment

Director of Unit Product and Solution Department，Beijing NAURA Microelectronics Equipment Co.,Ltd.

He is General Manager of Piotech JEK (Haining) Semiconductor Equipment Co., Ltd., where he is responsible for business development and product development for 3D integration equipment, with wafer bonding equipment as a key product category. He has 16 years of experience in the semiconductor industry and specializes in 3D integration processes, with extensive technical expertise in wafer-to-wafer and die-to-wafer hybrid bonding.

He holds a master’s degree from Tsinghua University and a Ph.D. from the University of Tokyo, and previously served as a researcher at the Institute of Microelectronics, Chinese Academy of Sciences. He has long been engaged in the research, development, and commercialization of advanced heterogeneous integration technologies and equipment. He is a multidisciplinary leader combining academic depth, strong technical expertise, and a broad industrial perspective, with extensive expertise in hybrid bonding integration technologies and equipment. He has published more than 40 papers in leading international conferences and journals, including IEDM (2019, 2024, and 2025) and ACS Applied Materials & Interfaces (ACS AMI), and has filed more than 100 patent applications, establishing strong technological barriers. In recognition of his outstanding contributions, he has been selected for the high-level talent program of the Organization Department of the CPC Central Committee, the Chinese Academy of Sciences Overseas High-Level Talent Program, and the Beijing Science and Technology Rising Star Program, and was also named one of the Top Ten Tianjin Development Talent Pioneers of the Year and a Leading Entrepreneurial Talent of Tianjin Binhai New Area.

Sales Manager‌，EVG Group China Ltd.

He received his bachelor’s and master’s degrees in Materials Science and Engineering from Shanghai Jiao Tong University and earned a Ph.D. in Materials Science and Engineering in the United States. After more than 33 years of working and studying in the United States, he returned to China in October 2022 and joined Yibo Semiconductor as a member of the founding team. His primary expertise lies in the design, simulation, and development of advanced packaging technologies. He led the Yibo team in completing the development and deployment of its COORS® advanced packaging technology, successfully bringing up customer chips. The technology is at the forefront in China for advanced packaging applications in AI computing chips and CPO/NPO. During his career in the United States, he was granted 27 U.S. patents. During his tenure at Yibo, 13 patents in China, the United States, Taiwan, and South Korea have been granted, with another 33 patent applications in China, the United States, Taiwan, and South Korea currently under examination.

He holds a master’s degree in Materials Physics from Xi’an Jiaotong University. He has previously held positions at leading semiconductor and pan-semiconductor companies, including SMIC, BOE, TCL CSOT, and HKC Optoelectronics. With nearly 20 years of experience in new product development and introduction, he has led his team in filing more than 30 patent applications, including one U.S. patent.

Dr. Yang Lieyong is Co-Founder & Chief Scientist of Wuyuan Semiconductor Technology (Qingdao) Co., Ltd., with a long-standing focus on 3D IC research, development, and manufacturing. He has more than 20 years of experience in integrated circuit R&D and has held positions at several internationally renowned semiconductor manufacturing companies in Singapore, Taiwan, Shanghai, and Beijing. He has published more than 20 papers in academic journals and conferences in his field and holds more than 30 granted patents. He received his bachelor’s degree from Shandong University and earned a Ph.D. in Microelectronics from Nanyang Technological University in Singapore.