Seminar on Advanced Bonding Technology, Processes and Equipment

Global bonding technology is evolving towards lower temperatures, higher precision, greater reliability and larger dimensions. Domestic bonding equipment is being used reliably in low- to mid-range packaging, whilst breakthroughs in advanced bonding equipment and processes are urgently needed.

Key topics:

(1) New requirements for bonding technology in advanced packaging (Chip-let/3D stacking)

(2) Breakthroughs and industrialization of wafer-level bonding and hybrid bonding technologies

(3) Design, manufacturing and commissioning techniques for high-precision bonding equipment

(4) Solutions for improving bonding process yield and reliability verification

(5) Practical applications of domestic bonding equipment in advanced packaging production lines