Forum on the Innovation in Packaging and Testing Equipment and Materials

Drawing on the three major trends in the development of advanced packaging technologies—namely, packaging architecture innovations driven by AI and high-performance computing (such as chiplets, 2.5D/3D and hybrid bonding); heterogeneous integration and system-level synergy emerging as core pathways; and an equal emphasis on self-reliance within the industrial chain and global expansion—we will explore and demonstrate how the latest packaging equipment and key materials (such as substrates, interconnect materials and thermal management materials) support the mass production of higher-density, more reliable packaging structures.