Forum on the Innovation in Packaging and Testing Equipment and Materials

Forum on the Innovation in Packaging and Testing Equipment and Materials

Drawing on the three major trends in the development of advanced packaging technologiesnamely, packaging architecture innovations driven by AI and high-performance computing (such as chiplets, 2.5D/3D and hybrid bonding); heterogeneous integration and system-level synergy emerging as core pathways; and an equal emphasis on self-reliance within the industrial chain and global expansionwe will explore and demonstrate how the latest packaging equipment and key materials (such as substrates, interconnect materials and thermal management materials) support the mass production of higher-density, more reliable packaging structures.

Forum on the Innovation in Packaging and Testing Equipment and Materials
Meeting time Monday, August 31st,09:20-12:00
Meeting address The Orchid Hall ,World Hotel Grand Juna Wuxi
  • A Solution to Boost the Packaging Throughput of HPC Chips
    Lei Guo
    General Manager of the CMP Division,Hwatsing Technology Co., Ltd.;Ph.D. from Tsinghua University, Senior Engineer
  • Technological Innovation and Domestic Breakthrough of Process Optical Inspection in the Full Semiconductor
    Owen
    Product Director, Zhuhai Chengfeng Electronic Technology Co., Ltd.
  • The technological evolution direction of FC-BGA packaging substrate under the AI trend
    Yu Long Li
    Advanced Technology R&D Manager, GreatTech Substrates Co., Ltd.
  • Accretech technical update for 3D package process and heat dissipation technology
    Jianxing Bai
    Marketing Planning & Information Dept, ACCRETECH (CHINA) CO., LTD
    Zhenzhou Lu
    Marketing Planning & Information Dept, ACCRETECH (CHINA) CO., LTD
  • Design and Manufacturing of High-precision wire bonder
    ZHENGRONG LI
    Deputy GM,R&D Director, Shenzhen Han's Assembly and Testing Technology Co.,Ltd
  • Rethinking High-Power ATC: Thermal Control for the AI Test Era
    Yu Gong
    VP of Technology, JHT Design Co., LTD.
  • The Domestic Substitution of Key Electronic Packing Materials
    SHUNLI ZHU
    Deputy Vice President,EP Materials(Wuhan)Co. Ltd.
  • Co-innovation of Materials and Processes for Advanced Semiconductor Packaging
    Leo Hu
    Country Technical Manager - China,Indium Corporation
Special Guests of the Conference
Lei Guo
General Manager of the CMP Division,Hwatsing Technology Co., Ltd.;Ph.D. from Tsinghua University, Senior Engineer
Owen
Product Director, Zhuhai Chengfeng Electronic Technology Co., Ltd.
Yu Long Li
Advanced Technology R&D Manager, GreatTech Substrates Co., Ltd.
Jianxing Bai
Marketing Planning & Information Dept, ACCRETECH (CHINA) CO., LTD
Zhenzhou Lu
Marketing Planning & Information Dept, ACCRETECH (CHINA) CO., LTD
ZHENGRONG LI
Deputy GM,R&D Director, Shenzhen Han's Assembly and Testing Technology Co.,Ltd
Yu Gong
VP of Technology, JHT Design Co., LTD.
SHUNLI ZHU
Deputy Vice President,EP Materials(Wuhan)Co. Ltd.
Leo Hu
Country Technical Manager - China,Indium Corporation