The 18th Integrated Circuit Packaging and Testing Industry Chain Innovation and Development Forum (CIPA 2026)

Dean, the School of Microelectronics at Nanjing University ;Academician, the Chinese Academy of Sciences

Professor at Wuhan University; Academician of the Chinese Academy of Sciences (CAS); Foreign Member of the European Academy of Science and Arts (Austria); Executive Dean of the Wuhan University Institute of Industrial Science; Dean of the School of Integrated Circuits.

He is a recipient of the National Science Fund for Distinguished Young Scholars (Category B), a Changjiang Scholar Distinguished Professor, and a Fellow of both ASME and IEEE.

An expert in micro/nano manufacturing, he has long been committed to addressing critical "bottleneck" challenges in China's chip manufacturing sector, and has achieved systematic and innovative outcomes in micro/nano manufacturing science and engineering.

His honors include the First Prize of the National Science and Technology Progress Award (2020), the Second Prize of the National Technological Invention Award (2016), the First Prize of the Chinese Institute of Electronics (CIE) Technological Invention Award (2018), the First Prize of the Ministry of Education Technological Invention Award (2015), and the US Presidential Faculty Fellow Award (1995). He has published over 650 SCI-indexed papers, authored 7 monographs, and holds more than 270 authorized invention patents.

Dr. Yang Cheng boasts over 25‑year experience in integrated‑circuit packaging and system development. Currently a Scientist at JCET Group, he is in charge of industry‑university‑research cooperation for the company.

Prior to joining JCET Group, Dr. Yang led system‑level packaging product and technology development at Flex, covering design, manufacturing and testing for IoT, automotive, medical and industrial applications.

He spent 13 years at Intel, taking charge of packaging design and technology development for memory products. Dr. Yang holds a Doctorate from the National University of Singapore, an EMBA from Washington University in St. Louis, as well as Master’s and Bachelor’s degrees from Shanghai Jiao Tong University.

Dr. Ding Jingfeng, as a core contributor, has led multiple national‑level and internationally cutting‑edge chip R&D projects. He has published 18 papers in international journals and been granted 16 international invention patents. Serving as a Senior Researcher at Johannes Kepler University Linz, he has overcome key technical challenges in radio‑frequency communications, GPU system platforms and high‑speed memory interfaces. Over his two‑decade technical career, he has covered the full‑chain technologies spanning from world‑leading RF chips to domestic 5G, high‑performance GPUs and memory interfaces. His contributions to NFC chip technology have benefited every mobile‑phone user.

Yu Daquan is a Distinguished Professor at Xiamen University, Head of the Department of Microelectronics and Integrated Circuits, and Founder of Xiamen Yuntian Semiconductor Technology Co., Ltd.

He previously conducted research at internationally renowned institutions including City University of Hong Kong, the Fraunhofer Institute for Reliability and Microintegration (IZM) in Germany, and the Institute of Microelectronics (IME) in Singapore. From 2010 to 2015, he served as a Research Professor at the Institute of Microelectronics, Chinese Academy of Sciences (IMECAS). From 2014 to 2019, he was Dean of the Packaging Technology Research Institute at Tianshui Huatian Technology Co., Ltd.

He has been selected for numerous prestigious talent programs, including the Alexander von Humboldt Fellowship (Germany), the Chinese Academy of Sciences "Hundred Talents Program," the Jiangsu Province "Innovation and Entrepreneurship Talent Program," and the Fujian Province "Hundred Talents Program."

With a long-standing focus on advanced microelectronic packaging research and industrialization, he has achieved significant research outcomes in through-silicon vias (TSV), through-glass vias (TGV), 3D wafer-level advanced packaging, and integrated passive devices (IPD)—technologies that have been deployed in large-scale mass production.

He has published over 250 academic papers and holds more than 100 authorized patents. His accolades include the Second Prize of the Beijing Science and Technology Progress Award (2018), the Third Prize of the Jiangsu Provincial Science and Technology Progress Award (2019), and the First Prize of the National Science and Technology Progress Award (2020).

Researcher, Tsinghua University