The 18th Integrated Circuit Packaging and Testing Industry Chain Innovation and Development Forum (CIPA 2026)

This year’s forum will focus on the current global landscape of the semiconductor packaging and testing industry and the state of China’s integrated circuit packaging and testing sector. It will explore strategies for enterprises across the upstream and downstream segments of the industry chain and supply chain to capitalise on the opportunities presented by the implementation of the 15th Five-Year Plan, as well as plans for collaborative innovation and development between industry, academia and research institutions. The event will also feature a plaque presentation ceremony for the current and rotating chairpersons.