Seminar on Thin-Film Deposition Technology, Processes and Equipment

Dr. Xu Can serves as General Manager of the Metal Deposition Products Division at Advanced Micro-Fabrication Equipment Inc. China (AMEC). With more than a decade of experience specializing in the development and volume production of metal thin films, he possesses extensive hands-on expertise and deep industry insight. In response to China’s demand for advanced logic and memory technologies, he has led the development and commercialization of more than ten advanced metal thin-film deposition products for advanced logic and memory applications.

Dr. Zhang Qintong holds a Ph.D. in Condensed Matter Physics and is a Senior Engineer. He currently serves as CTO of the MDP Business Unit at Beijing NAURA Microelectronics Equipment Co., Ltd. He received his doctoral degree from the Institute of Physics, Chinese Academy of Sciences, and has long been engaged in the R&D and commercialization of metalization process equipment for integrated circuits, as well as the exploration of new processes and materials. He has been invited to deliver presentations at industry conferences including CSTIC and the Atomic-Level Manufacturing Forum. He has published more than 20 papers in international journals, contributed to the book Physical Vapor Deposition Processes and Equipment, and holds more than 20 published and granted patents.

He has 27 years of experience in the integrated circuit and semiconductor industry, including 15 years of experience in Foundry process and integration technology R&D and high-volume manufacturing management at GlobalFoundries, IBM, and SMIC, as well as 12 years of experience in equipment R&D, technology development, and market development at Lam Research and AMEC. He currently serves as General Manager of the Atomic Layer Deposition Business Unit at Piotech (Shanghai) Co., Ltd. He holds a Ph.D. in Chemistry and Materials from the National University of Singapore, with more than 35 U.S. and Chinese patents and 25 publications in international academic journals and conferences.

He is Chief Technology Officer of Qingdao Sirui Intelligent Technology Co., Ltd. He has long been dedicated to the R&D of ion implanters and atomic layer deposition (ALD) equipment. He has extensive and systematic hands-on experience in the development, engineering, and commercialization of a full range of ion implanters. Under his leadership, his team successfully developed multiple first-of-their-kind domestically manufactured ion implanters, which subsequently passed high-volume manufacturing validation at customer sites. In recognition of his outstanding contributions, he was selected for the Taishan Industry Leading Talent Program of Shandong Province and received an Outstanding rating.

He holds a Ph.D. in Materials Science and Engineering from National Tsing Hua University in Taiwan and currently serves as a Senior Director of R&D at Nexchip Semiconductor Corporation. He specializes in advanced process technologies including metal silicides, epitaxial growth, ultra-shallow junctions, and emerging memory technologies. With more than 28 years of hands-on experience in the semiconductor industry, he holds 111 U.S. patents and has long been engaged in research on integrated circuit processes and materials applications. He has made outstanding contributions to technological innovation in the semiconductor industry, leading teams in advancing numerous innovative projects, developing multiple new processes, and helping improve process performance and product competitiveness. He has established a strong influence in the global semiconductor industry.

He holds a Ph.D. in Engineering from the University of Tokyo, where he studied under the internationally renowned materials scientist Professor Takuzo Aida. His research has focused on thin-film deposition processes for silicon wafers, and he was a co-first author of a paper published in the prestigious U.S. journal Science. He has published more than ten papers as first author in international journals and conferences, and has filed more than 50 patent applications in mainland China, the United States, Japan, and other jurisdictions. He has been recognized as a Shenzhen Overseas High-Level Talent and selected as a Shenlong Talent. He has long been engaged in process technology and process R&D for Logic devices at technology nodes below 7 nm.

Assistant to the General Manager of Shanghai Jita Semiconductor Co., Ltd. With more than ten years of experience in the semiconductor industry, he/she has long focused on the strategic design and operational execution of supply chain systems, continuously driving the localization of critical raw materials and equipment. He/she has also led the establishment of deep strategic partnerships with multiple leading suppliers and systematically developed a diversified supply structure.

His research focuses primarily on interdisciplinary fundamental and applied research in integrated circuit thin-film equipment and processes. He has been recognized as a Leading Talent of Hefei City and a Jianghuai Talent of Anhui Province, and his technology received the First Prize for Technological Invention from the China Instrument and Control Society. Under his leadership, his team has developed and successfully introduced multiple physical vapor deposition (PVD) systems into high-volume production. He holds more than 20 granted Chinese invention patents and has extensive experience in equipment and process development.

Vice President of Electroplating Process Engineering at ACM Research (Shanghai), Inc. He has more than 10 years of industry experience in the R&D of electroplating and planarization equipment and processes for the integrated circuit industry. As a core technical contributor, he participated in two major projects under the Ministry of Science and Technology’s National 02 Special Program.

Main Research Areas: Copper interconnect processes for dual-damascene structures in integrated circuits and metal interconnect processes using through-silicon vias (TSVs) for 3D stacking. His work primarily focuses on the R&D, design, and industrialization of semiconductor processes and equipment technologies for interconnect metal deposition and planarization.

He holds a Ph.D. in Mechatronic Engineering from Wuhan University and is a National Senior Engineer. He currently serves as General Manager of Beijing Nuohua Capital Investment Management Co., Ltd. He has more than ten years of experience in the semiconductor industry and more than ten years of hands-on experience in investment and mergers and acquisitions. He previously worked at NAURA, where he led the development of multiple semiconductor equipment products.

He was involved in the establishment of Nuohua Capital in early 2020. The firm currently manages funds with total assets under management of RMB 5.1 billion, has invested in more than 50 companies, and has completed two corporate acquisitions. Among its portfolio companies, Kema Technology, Xianfeng Precision, Qiangyi Technology, Torrence, and Chengdu Chaochun have successfully entered the capital markets. Several other portfolio companies are currently undergoing IPO guidance or have had their IPO applications accepted.

He holds a Ph.D. in Materials Science and Engineering from National Tsing Hua University in Taiwan and currently serves as a Senior Director of R&D at Nexchip Semiconductor Corporation. He specializes in advanced process technologies including metal silicides, epitaxial growth, ultra-shallow junctions, and emerging memory technologies. With more than 28 years of hands-on experience in the semiconductor industry, he holds 111 U.S. patents and has long been engaged in research on integrated circuit processes and materials applications. He has made outstanding contributions to technological innovation in the semiconductor industry, leading teams in advancing numerous innovative projects, developing multiple new processes, and helping improve process performance and product competitiveness. He has established a strong influence in the global semiconductor industry.