Forum on the Platformization of Semiconductor Equipment and Synergy among Core Parts

Forum on the Platformization of Semiconductor Equipment and Synergy among Core Parts

This forum focuses on the platformized design of semiconductor equipment, modular R&D, and the coordinated localization of core parts (such as pumps, valves, chambers and precision motion parts). It aims to integrate the industrial chains for complete equipment and parts, thereby reducing costs and enhancing the autonomy and controllability of the supply chain.

Forum on the Platformization of Semiconductor Equipment and Synergy among Core Parts
Meeting time August 31st, Monday, 09:20 - 12:00
Meeting address Hall B6-1, Taihu International Expo Center, Wuxi, China
  • 《Building Cross-Border Supply Chain Resilience Through a Full-Chain Data System》— Focusing on how to build a “full-chain data system” with data standardization as the foundation, the Three-Ledger Accounting and Five-Flow Consistency framework as the core
    David
    Product Director, HMG Supply Chain Group
  • AI + Digital Twin: Powering AMHS’s Intelligent Leap
    HaijunYang
    Vice President, Hefei Sineva Intelligent Machine Co., Ltd.
  • Metrology Revolution in the Angstrom Era: CD-SEM Evolution, Industry Trends, and the Path Toward Breakthroughs in Domestic Electron Beam Equipment
    Zeno Wang
    Chairman ,Wellrun Microelectronics Technology Co., Ltd.
  • Microwave Plasma – High-efficiency Treatment Technology for Fluorine-containing Exhaust Gas (PFCS)
    Zhou Yibin
    Chief Technology Officer, Firsquare Technology Group
  • Exploration and Practice of Core Power Supply Technology Development for Semiconductor Equipment
    George
    Chairman,MORNSUN Guangzhou Science & Technology Co.﹐Ltd.
  • Xinshino's 50kg-Class PLP-Dedicated OHT: Breaking the Advanced Packaging Logistics Bottleneck to Enable AI Computing Power at Scale
    Tong Lu
    Deputy General Manager of Technology, Suzhou Xinshinuo Semiconductor Equipment Co.,Ltd
  • Key Equipment and Core Technology Breakthroughs in Advanced Packaging
    Yujie
    Deputy GM & Exec. Asst. to GM, Maxwell Technologies (Zhuhai) Co., Ltd.
  • Wafer Bonding: Challenges and Breakthroughs in Domestic Equipment
    Lujie Qu
    Senior Technical Advisor, Shenzhen Cronus Technology Co., Ltd.
Special Guests of the Conference
Zhang Xiaoyan
Senior Vice‑President of Process Engineering, ACM Research (Shanghai), Inc.
David
Product Director, HMG Supply Chain Group
HaijunYang
Vice President, Hefei Sineva Intelligent Machine Co., Ltd.
Zeno Wang
Chairman ,Wellrun Microelectronics Technology Co., Ltd.
Zhou Yibin
CTO, Firsquare Semiconductor Equipment (Jiangsu) Co., Ltd.
George
Chairman,MORNSUN Guangzhou Science & Technology Co.﹐Ltd.
Tong Lu
Deputy General Manager of Technology, Suzhou Xinshinuo Semiconductor Equipment Co.,Ltd
Yujie
Deputy GM & Exec. Asst. to GM, Maxwell Technologies (Zhuhai) Co., Ltd.
Lujie Qu
Senior Technical Advisor, Shenzhen Cronus Technology Co., Ltd.