Forum on the Platformization of Semiconductor Equipment and Synergy among Core Parts

This forum focuses on the platformized design of semiconductor equipment, modular R&D, and the coordinated localization of core parts (such as pumps, valves, chambers and precision motion parts). It aims to integrate the industrial chains for complete equipment and parts, thereby reducing costs and enhancing the autonomy and controllability of the supply chain.

Meeting time	August 31st, Monday, 09:10 - 17:30
Meeting address	Hall B6, Taihu International Expo Center, Wuxi, China

09:20 -09:40
09:40 -10:00

AI + Digital Twin: Powering AMHS’s Intelligent Leap
10:00 -10:20

Metrology Revolution in the Angstrom Era: CD-SEM Evolution, Industry Trends, and the Path Toward Breakthroughs in Domestic Electron Beam Equipment
10:20 -10:40

Microwave Plasma – High-efficiency Treatment Technology for Fluorine-containing Exhaust Gas (PFCS)
10:40 -11:00

Exploration and Practice of Core Power Supply Technology Development for Semiconductor Equipment
11:00 -11:20

Xinshino's 50kg-Class PLP-Dedicated OHT: Breaking the Advanced Packaging Logistics Bottleneck to Enable AI Computing Power at Scale
11:20 -11:40

Key Equipment and Core Technology Breakthroughs in Advanced Packaging
11:40 -12:00

Wafer Bonding: Challenges and Breakthroughs in Domestic Equipment
12:10 -13:30
13:30 -13:50

Performance and Applications of the World’s Largest Micro-vibration Shaking Table
13:50 -14:10

Domestic Precision Motion Stages for Metrology & Inspection: Beyond Replacement, Leading the Race
14:10 -14:30

Breaking Process Barriers with Laser: New Frontiers in Semiconductor
14:30 -14:50

Process-Driven, Fab & Equipment Synergy —— The Integrated Design Path of Semiconductor Equipment and Cleanroom Facilities
14:50 -15:10

Looking at current issues and future directions from the perspective of semiconductor temperature control equipment
15:10 -15:30

AURASKY core components support the development of the semiconductor industry
15:30 -15:50
15:50 -16:10

Wide-Bandgap Semiconductor Material & Device Thinning Process Solutions
16:10 -16:30

Fanuc Intelligent Manufacturing Drives Cost Reduction, Quality Improvement, and Efficiency Enhancement in the Semiconductor Industry

Next Agenda

Monday, August 31st, 09:30-17:00

Human Resources: Thematic Roadshow on the Commercialization of University-Industry-Research Collaboration

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