Forum on the Collaborative R&D in Advanced Packaging Technologies for the AI Era

Forum on the Collaborative R&D in Advanced Packaging Technologies for the AI Era

The explosion in AI computing power has propelled advanced packaging technology to the forefront as the key avenue for breaking through chip performance bottlenecks. The forum has invited industry packaging experts to jointly explore the evolution of advanced packaging technologies during the 15th Five-Year Plan period, resolve industry challenges, and help secure a competitive edge. It will also focus on discussing the ‘seven key advantages’ and ‘four major challenges’ associated with CoWoP packaging technology, whilst exploring new pathways for cross-sector integration and full-chain collaboration through the application of the STCO methodology (System-level Collaborative Optimization).

Forum on the Collaborative R&D in Advanced Packaging Technologies for the AI Era
Meeting time Tuesday,September 1st, 13:25-16:30
Meeting address The Orchid Hall ,World Hotel Grand Juna Wuxi
  • Welcome Address
    Dongmei Xu
    Deputy Secretary General of China Semiconductor Industry Association,Secretary General of the Sealing and Testing Branch
  • AD PKG Drives AI Development
    Leo
    Tianshui Huatian Technology Co., Ltd.
  • AMEC Superior Product Solution Empowered Innovation For Advanced Packaging Yield Enhancement
    Li Tai
    Sr. Director of Advanced Packaging Business Development,Advanced Micro-Fabrication Equipment Inc. China
  • Optical Interconnection and OE Co-packaging Technology in the AI Era
    Fengman Liu
    VP,NCAP
  • Photolithography Technology for Large-Area Modules in Advanced Packaging
    Li Gong
    General Manager,Suss MicroTec(shanghai) LTD
  • AI-Empowered New Paradigm for Advanced Packaging Design: Full-Flow STCO Collaborative Innovation for 2.5D/3D IC EDA
    Yi Zhao
    Founder and General Manager,Zhuhai Silicon Chip Technology Ltd.
  • Enabling wafer‑manufacturing capabilities for the AI era
    Haiwei Yin
    Founder and General Manager,ideaoptics Inc.
  • Collaborative Innovation, Driving the Future: Deep Integration of Advanced Packaging Grinding and Laser Cutting Process Chains
    Chien Kuo
    VP of sales,Leadlap Semiconductor
  • Advanced Packaging & Testing, Precision Sensing— Forge a New High Ground in Sensor Packaging & Testing Technology
    Jiegfried Gong
    Marketing&Sales Director,Shanghai Gongjin Microelectronics Technology Co., Ltd.
  • Characteristic 3D Heterogeneous Wafer Process, National Innovation Center for Intelligent Sensors
    Ted
    Head of Pilot Line,Siwave, Inc.
Special Guests of the Conference
Dongmei Xu
Deputy Secretary General of China Semiconductor Industry Association,Secretary General of the Sealing and Testing Branch
Li Tai
Sr. Director of Advanced Packaging Business Development,Advanced Micro-Fabrication Equipment Inc. China
Li Gong
General Manager,Suss MicroTec(shanghai) LTD
Yi Zhao
Founder and General Manager,Zhuhai Silicon Chip Technology Ltd.
Haiwei Yin
Founder and General Manager,ideaoptics Inc.
Chien Kuo
VP of sales,Leadlap Semiconductor
Ted
Head of Pilot Line,Siwave, Inc.
Jiegfried Gong
Marketing&Sales Director,Shanghai Gongjin Microelectronics Technology Co., Ltd.