Forum on the Collaborative R&D in Advanced Packaging Technologies for the AI Era

The explosion in AI computing power has propelled advanced packaging technology to the forefront as the key avenue for breaking through chip performance bottlenecks. The forum has invited industry packaging experts to jointly explore the evolution of advanced packaging technologies during the 15th Five-Year Plan period, resolve industry challenges, and help secure a competitive edge. It will also focus on discussing the ‘seven key advantages’ and ‘four major challenges’ associated with CoWoP packaging technology, whilst exploring new pathways for cross-sector integration and full-chain collaboration through the application of the STCO methodology (System-level Collaborative Optimization).