Seminar on the Advanced Process Cleaning Technology and Equipment

Seminar on the Advanced Process Cleaning Technology and Equipment

As advanced processes continue to demand ever-higher standards of cleaning precision, non-destructive cleaning and environmental sustainability, single-wafer cleaning and green cleaning have become the mainstream. Whilst domestically produced cleaning equipment is able to supply mature processes reliably, there is still room for improvement in cleaning equipment specifically designed for advanced processes.

Key Topics:

(1) Challenges in cleaning processes and future technical directions

(2) Technical comparison and application selection of single-wafer versus tank-type cleaning equipment

(3) Innovations in eco-friendly cleaning solutions and green cleaning processes

(4) Cleaning solutions for large-size wafers and 3D chip structures

(5) Case studies on the large-scale application of domestic cleaning equipment and its integration into the full production workflow

Seminar on the Advanced Process Cleaning Technology and Equipment
Meeting time Tuesday, September 1st, 9:30-11:35
Meeting address Hall B4, Taihu International Expo Center, Wuxi, China
  • Challenges in Advanced Wet Cleaning Process Technologies
    Wang Wenjun
    VP of Process, ACM Research (Shanghai), Inc.
  • Bonding Technologies and Evolution Trends for Co-Packaged Optics Applications
    Zhang Zhengwei
    Technology Director, Ferrotec (An Hui) Technology Development Co.; LTD
  • Challenges and ESG Contributions of Advanced Cleaning Process Equipment
    Li Ruiping
    CTO, Silicar semiconductor technology (Suzhou) Co.,Ltd.
  • Precision cleaning and micro contamination control of semiconductor equipment components
    Zhang Zhengwei
    Technology Director, Ferrotec (An Hui) Technology Development Co.; LTD
  • Preparation and Application of High‑Purity PFA for Advanced Nodes
    Lin Bangjia
    Product Manager of Melt‑Processable Fluororesin, Juhua Group Co., Ltd.
Special Guests of the Conference
Zhang Xiaoyan
Senior Vice‑President of Process Engineering, ACM Research (Shanghai), Inc.
Wang Wenjun
VP of Process, ACM Research (Shanghai), Inc.
Dai Fengwei
Senior R&D Director,National Center for Advanced Packaging Co., Ltd.
Li Ruiping
CTO, Silicar semiconductor technology (Suzhou) Co.,Ltd.
Zhang Zhengwei
Technology Director, Ferrotec (An Hui) Technology Development Co.; LTD
Lin Bangjia
Product Manager of Melt‑Processable Fluororesin, Juhua Group Co., Ltd.