Main Forum: 2026 China Electronic Special Equipment Industry Association Semiconductor Equipment Annual Conference

He has long been engaged in theoretical research and engineering development in the fields of integrated electronic systems and quantum information systems. Having made significant contributions to the theoretical innovation, technological advancement and industrial development of integrated electronic and quantum information systems, he has been awarded multiple honors including the Special Prize of the National Science and Technology Progress Award.

Dr. Dong Boyu, CPC member, Doctor of Engineering, and Research Fellow. He currently serves as President of Naura Technology Group Co., Ltd. and Chairman of Shenyang Keyi Microelectronics Equipment Co., Ltd. He is a National-level Talent, Chairperson of the China Electronic Special Equipment Industry Association, Beijing Scholar, Distinguished Expert of Beijing Municipality, and Changjiang Scholar Distinguished Professor at Xidian University.

He has long been engaged in the R&D of integrated circuit equipment. As the principal investigator, he has led dozens of national key scientific and technological research projects. He has developed more than 10 types of integrated circuit equipment across four major series and achieved full industrialization, filling multiple domestic market gaps. His research achievements have generated nearly 10 billion yuan in direct economic benefits. He holds 85 domestic and foreign invention patents and has published over 40 academic papers.

His prestigious honors include the National Outstanding Engineer Team Award, the First Prize of Beijing Municipal Science and Technology Progress Award, Beijing Model Worker, Capital Labor Medal, and Beijing High-Level Overseas Talent.

Vice President of R&D, Yangtze Memory Technologies Co., Ltd.

Head of AI R&D，Nexchip Semiconductor Corporation

General Manager, Software System, Beijing Naura Microelectronics Equipment Co., Ltd.

Professor-level Senior Engineer and a State Council Special Allowance Expert. He has long been engaged in semiconductor manufacturing equipment and the integrated circuit industry, as well as international cooperation, international M&A research, and industrialization. He has led major national and provincial-level projects involving integrated circuit manufacturing equipment, semiconductor materials manufacturing equipment, electronic component manufacturing equipment, intelligent manufacturing equipment, and enterprise informatization. He has received 10 National and Ministerial Science and Technology Progress Awards, as well as the China Outstanding Young Science and Technology Entrepreneurship Award, and enjoys a special allowance from the State Council.

Previous Positions:

1. Director, Electronic Manufacturing Equipment Institute of the Ministry of Information Industry (Institute No. 40)
2. Director, Industrial Development Department, China Electronics Technology Group Corporation
3. Director, International Business Department, China Electronics Technology Group Corporation
4. Deputy Chief Engineer, China Electronics Technology Group Corporation
5. Vice Chairman, China Invention Association.

Vice President of Electroplating Process Engineering at ACM Research (Shanghai), Inc. He has more than 10 years of industry experience in the R&D of electroplating and planarization equipment and processes for the integrated circuit industry. As a core technical contributor, he participated in two major projects under the Ministry of Science and Technology’s National 02 Special Program.

Main Research Areas: Copper interconnect processes for dual-damascene structures in integrated circuits and metal interconnect processes using through-silicon vias (TSVs) for 3D stacking. His work primarily focuses on the R&D, design, and industrialization of semiconductor processes and equipment technologies for interconnect metal deposition and planarization.

He has more than 20 years of experience in the semiconductor inspection equipment industry, including 15 years of experience working at relevant Fab facilities and internationally renowned inspection equipment manufacturers. He has been responsible for market development and product applications for wafer geometry and morphology measurement and particle defect inspection equipment in China.

He joined Zhong’an Semiconductor in 2021, where he has been responsible for market development and technology expansion. He led the marketing and R&D teams in rapidly completing the development, validation, and commercialization of geometry and morphology measurement equipment benchmarked against KLA. To date, nearly 20 systems have been installed domestically.

He has also been deeply involved in market research and strategic direction-setting for Zhong’an Semiconductor’s unpatterned wafer particle inspection equipment. Following the launch of an inspection system with 19 nm sensitivity capable of meeting the requirements of 14 nm mass production, he rapidly expanded the domestic market and secured demo orders from multiple customers.

Secretary-General, CEPEA

Chairman & CEO, Advanced Micro-Fabrication Equipment Inc. China

Dr. Dong Boyu, CPC member, Doctor of Engineering, and Research Fellow. He currently serves as President of Naura Technology Group Co., Ltd. and Chairman of Shenyang Keyi Microelectronics Equipment Co., Ltd. He is a National-level Talent, Chairperson of the China Electronic Special Equipment Industry Association, Beijing Scholar, Distinguished Expert of Beijing Municipality, and Changjiang Scholar Distinguished Professor at Xidian University.

He has long been engaged in the R&D of integrated circuit equipment. As the principal investigator, he has led dozens of national key scientific and technological research projects. He has developed more than 10 types of integrated circuit equipment across four major series and achieved full industrialization, filling multiple domestic market gaps. His research achievements have generated nearly 10 billion yuan in direct economic benefits. He holds 85 domestic and foreign invention patents and has published over 40 academic papers.

His prestigious honors include the National Outstanding Engineer Team Award, the First Prize of Beijing Municipal Science and Technology Progress Award, Beijing Model Worker, Capital Labor Medal, and Beijing High-Level Overseas Talent.

He has more than 20 years of experience in the semiconductor inspection equipment industry, including 15 years of experience working at relevant Fab facilities and internationally renowned inspection equipment manufacturers. He has been responsible for market development and product applications for wafer geometry and morphology measurement and particle defect inspection equipment in China.

He joined Zhong’an Semiconductor in 2021, where he has been responsible for market development and technology expansion. He led the marketing and R&D teams in rapidly completing the development, validation, and commercialization of geometry and morphology measurement equipment benchmarked against KLA. To date, nearly 20 systems have been installed domestically.

He has also been deeply involved in market research and strategic direction-setting for Zhong’an Semiconductor’s unpatterned wafer particle inspection equipment. Following the launch of an inspection system with 19 nm sensitivity capable of meeting the requirements of 14 nm mass production, he rapidly expanded the domestic market and secured demo orders from multiple customers.

CEO, Beijing Huafeng Test & Control Technology Co.,Ltd

Dr. Mark Zheng joined Nexchip Semiconductor Corporation, in July 2021. He has successively served as Senior Director of the Forward-looking Technology Development Center and Senior Vice President of R&D, and currently holds the position of Co-President.