2026 Semiconductor Materials Development Forum(Wuxi)

2026 Semiconductor Materials Development Forum(Wuxi)

To strengthen upstream-downstream industrial chain collaboration and support the high-quality development of the semiconductor materials and equipment industry, the Semiconductor Materials Division of the China Electronic Materials Industry Association will host this event. The forum will focus on semiconductor materials including silicon, indium phosphide, silicon carbide, gallium oxide, and diamond, with in-depth discussions on how to build a complete industrial ecosystem—from materials R&D and device manufacturing to application deployment—through technological breakthroughs, industrial chain synergy, policy enablement, and new ecosystem integration.

2026 Semiconductor Materials Development Forum(Wuxi)
Meeting time Monday, August 31, 09:30-12:00
Meeting address Hall A6, Taihu International Expo Center, Wuxi, China
  • Technology of Application-oriented Silicon Wafers
    Wen-Chung Li
    Chief Technology Officer, Wafer Works Co. (Shanghai)
  • Development Trends of Large Silicon Wafers for Integrated Circuit Applications
    Dr. Zhang Junbao
    CTO at Shanghai Advanced Silicon Technology Co., Ltd
  • Introduction on Indium Phosphide (InP) Substrate
    Diansheng Ren
    Technical Director of Beijing Tongmei Crystal Technology Co., Ltd.(AXT Inc.)
  • Progress and Challenges of High-Quality Large-Diameter Gallium Oxide Substrate Wafers
    Hui Zhang
    Professor, Zhejiang University; Chairman, Hangzhou Garen Semiconductor Co., Ltd.
  • Research on Development Status and Trend of Aluminum Nitride Ultra-Wide Bandgap Semiconductor Materials
    Xie Nan
    Director and Senior Engineer , the Compound Semiconductor Research Office at the Integrated Circuit Research Institute, China Electronics Information Industry Development Research Institute
  • Research Progress of Wafer-Scale Diamond
    Dr. Lan Feifei
    Expert at the 46th Research Institute of China Electronics Technology Group Corporation
Special Guests of the Conference
Mr.Jian Lin
Secretary-General of the Semiconductor Materials Branch, CEMIA; Former Chief Expert, CETC 46th Research Institute.
Xie Nan
Director and Senior Engineer , the Compound Semiconductor Research Office at the Integrated Circuit Research Institute, China Electronics Information Industry Development Research Institute
Wen-Chung Li
Chief Technology Officer, Wafer Works Co. (Shanghai)
Dr. Zhang Junbao
CTO at Shanghai Advanced Silicon Technology Co., Ltd
Diansheng Ren
Technical Director of Beijing Tongmei Crystal Technology Co., Ltd.(AXT Inc.)
Hui Zhang
Professor, Zhejiang University; Chairman, Hangzhou Garen Semiconductor Co., Ltd.
Dr. Lan Feifei
Expert at the 46th Research Institute of China Electronics Technology Group Corporation