Seminar on Etching Technology, Processes and Equipment
Global etching technology is currently evolving towards high selectivity, high uniformity, ultra-low damage and 3D etching. Domestic etching equipment has achieved breakthroughs in areas such as dielectric etching and silicon etching; however, process yield, stability and core parts for advanced processes still require continuous optimization.
Key topics:
(1) Global advanced etching technology roadways and evolution trends over the next 3–5 years
(2) Challenges and solutions in 7nm/5nm advanced process etching
(3) Case studies of industrial applications for domestically produced etching equipment and practices for yield improvement
(4) Pathways for the localization of core parts in etching equipment
(5) Sharing of experiences in joint R&D between foundries and equipment manufacturers, and collaborative process optimization
