Seminar on the Development of Artificial Intelligence and Electronic Manufacturing Equipment

Seminar on the Development of Artificial Intelligence and Electronic Manufacturing Equipment

Semiconductor production and testing equipment designed and optimized for the manufacture of AI chips (such as GPUs, ASICs and NPUs) has entered a phase of rapid iteration, driven by both the explosive growth in large-model computing power and the evolution of advanced manufacturing and packaging processes. Such equipment places extremely high demands on process precision, stacking and interconnections, and serves as the core hardware foundation underpinning the explosive growth in artificial intelligence computing power.

Key topics:

(1) Specific requirements and technical challenges for semiconductor equipment in AI chip manufacturing

(2) R&D and application of integrated line solutions for domestically produced semiconductor equipment

(3) Pathways to breakthroughs in the localization of core parts for semiconductor equipment

(4) Application of AI technology in equipment R&D, process debugging, and production line operation and maintenance

(5) Industry chain collaboration: cooperation models between equipment manufacturers, chip manufacturers, part manufacturers and capital

Seminar on the Development of Artificial Intelligence and Electronic Manufacturing Equipment
Meeting time Tuesday, September 1st, 09:30-11:50
Meeting address Plum Blossom Hall,Wuxi Junlai World Hotel
  • Multi-Agent Virtual Manufacturing Empowering Proximity Lithography: From Computational Lithography to Intelligent Equipment
    Zizheng Cao
    Tenured Professor/Qiushi Distinguished,Zhejiang University
  • AI Empowers High-quality Development of Semiconductor Equipment
    Xiaoliang Gong
    Director of Overall Technology Department, CETC ELECTRONICS
  • Opportunities and Challenges of FOPLP and Electroplating Technologies for Advanced AI Chip Packaging
    Zhaowei Jia
    SVP of Process,ACM Research (Shanghai), Inc.
  • AI-Native Smart Equipment: Reshaping a New Paradigm for Semiconductor R&D and Manufacturing
    Bin Liu
    IKAS Holdings (Beijing) Co., Ltd.CTO
  • Discussion on the Collaborative Mechanism between Micro-Environmental Control Components and Complete Semiconductor
    Xiaoping LI
    Founder,Wuhan Micro-Environment Control Co., Ltd.
  • Research Report on Talent Demand in the Integrated Circuit Industry and the Current Status of Talent Cultivation at Shanghai Dianji University
    Na Liu
    Professor, Head of the Integrated Circuit Industry Division at the Industrial Development Research Center
  • Unlocking the New Smart Manufacturing Paradigm in Semiconductors: IBM's Hybrid Cloud & AI Compute Approach
    Wenzheng Pang
    GCG Storage Product Manager,IBM
Special Guests of the Conference
Ye Lezhi
Professor, Beijing University of Technology (BJUT)
Zizheng Cao
Tenured Professor/Qiushi Distinguished,Zhejiang University
Xiaoliang Gong
Director of Overall Technology Department, CETC ELECTRONICS
Zhaowei Jia
SVP of Process,ACM Research (Shanghai), Inc.
Bin Liu
IKAS Holdings (Beijing) Co., Ltd.CTO
Xiaoping LI
Founder,Wuhan Micro-Environment Control Co., Ltd.
Na Liu
Professor, Head of the Integrated Circuit Industry Division at the Industrial Development Research Center
Wenzheng Pang
GCG Storage Product Manager,IBM