Human Resources: Thematic Roadshow on the Commercialization of University-Industry-Research Collaboration

Human Resources: Thematic Roadshow on the Commercialization of University-Industry-Research Collaboration

By linking university research resources with the industrial needs of enterprises, this event features roadshows showcasing technological achievements in the fields of semiconductor equipment and integrated circuits. It aims to foster in-depth industry-academia-research collaboration and technology transfer, cultivate talent urgently needed by the industry, and strengthen the foundations of industrial innovation.

Human Resources: Thematic Roadshow on the Commercialization of University-Industry-Research Collaboration
Meeting time Tuesday,September 1st, 09:15-16:50
Meeting address Hall B6-2, Taihu International Expo Center, Wuxi, China
  • Host's opening remarks
  • Opening Remarks-Department of Education
  • Micro-Electromechanical Energy (MEME) Thermoelectric Chip
    Hu Zhiyu
    Professor, Zhangjiang Institute for Advanced Study, Shanghai Jiao Tong University
  • MEMS-based Intelligent Gas Sensors
    Xu Jiaqiang
    Professor, College of Sciences, Shanghai University
  • Novel Memory Technology and Chip Security Design
    Zhan Xuepeng
    Professor, School of Information Science and Engineering, Shandong University
  • Ultra-High Porosity Solid-Skeleton Copper Foam and Its Sandwich Structure Material
    Xiao Jian
    Dr., School of Materials Science and Engineering, Jiangxi University of Science and Technology
  • Research on Laser Modification and Lift-off Technology of SiC Substrates
    Lu Xiwen
    Assistant Researcher, Ningbo Institute of Materials Technology and Engineering, Chinese Academy of Sciences
  • Efficiency and Low-Cost Edge Computing Chip (ReCIM5501)
    Ma Yitao
    Professor, College of Integrated Circuits, Zhejiang University
  • From the Perspective of Hard-Tech Commercialization: Cultivation Pathways and Practices for Interdisciplinary Talent in Technology Transfer
    Hou Jiajia
    Program Director, MTT Program, Fudan University
  • Large Model for Semiconductor Process Optimization
    Xiong Hongkai
    Professor, School of Information and Electronic Engineering, East China Normal University
  • Terahertz Semiconductor Non-destructive Testing
    Hu Min
    Professor, School of Electronic Science and Engineering, University of Electronic Science and Technology of China
  • Growth of Diamond and Its Applications in Electronic Devices
    Ren Zeyang
    Professor, School of Microelectronics, Xidian University
  • Research on Semiconductor-Grade Advanced Gas Flow Measurement and Control Sensors and Instrumentation Technology
    Tian Wei
    Dr., School of Information Science and Engineering, Shandong University
  • Atomic-Level Semiconductor TCAD with Real-Time Feedback
    Chen Jingzhe
    Associate Professor, School of Sciences, Shanghai University
  • Multi-Node Multi-GPU Parallel Software Development on Domestic Chips and NVIDIA GPU Platforms
    Zhang Yan
    Professor, School of Vehicle Engineering, Chongqing University of Technology
  • Latest Advances in Key Equipment Technologies for Semiconductor Advanced Packaging and Testing
    Ye Lezhi
    Professor, Beijing University of Technology (BJUT)
  • R&D of Optical Precision Manufacturing Equipment and Applied Technology for Optical Waveguides
    Ge Aiming
    Professor, School of Intelligent Robotics and Advanced Manufacturing, Fudan University
  • High-Precision Electro-Thermal Co-Characterization Platform (ET-1000)
    Li Junkang
    Professor, College of Integrated Circuits, Zhejiang University
  • Dual-Polarization and Dual-Domain Fusion Fiber Mode Decomposition and Intelligent Polarization State Measurement System
    Chai Junyu
    Professor, School of Sciences, Hangzhou Dianzi University
Special Guests of the Conference
Ye Lezhi
Professor, Beijing University of Technology (BJUT)
Hou Jiajia
Program Director, MTT Program, Fudan University
Chen Jingzhe
Associate Professor, School of Sciences, Shanghai University
Ma Yitao
Professor, College of Integrated Circuits, Zhejiang University
Li Junkang
Professor, College of Integrated Circuits, Zhejiang University
Chai Junyu
Professor, School of Sciences, Hangzhou Dianzi University
Ge Aiming
Professor, School of Intelligent Robotics and Advanced Manufacturing, Fudan University
Hu Min
Professor, School of Electronic Science and Engineering, University of Electronic Science and Technology of China
Zhang Yan
Professor, School of Vehicle Engineering, Chongqing University of Technology
Zhan Xuepeng
Professor, School of Information Science and Engineering, Shandong University
Xu Jiaqiang
Professor, College of Sciences, Shanghai University
Xiong Hongkai
Professor, School of Information and Electronic Engineering, East China Normal University
Xiao Jian
Dr., School of Materials Science and Engineering, Jiangxi University of Science and Technology
Tian Wei
Dr., School of Information Science and Engineering, Shandong University
Ren Zeyang
Professor, School of Microelectronics, Xidian University
Hu Zhiyu
Professor, Zhangjiang Institute for Advanced Study, Shanghai Jiao Tong University
Li Ying
Professor, School of Metallurgy, Northeastern University
Lu Xiwen
Assistant Researcher, Ningbo Institute of Materials Technology and Engineering, Chinese Academy of Sciences