Mr. Zhao Jinrong currently serves as the President of the China Electronic Special Equipment Industry Association and the Chairman of the NAURA Technology Group Co., Ltd. He previously held positions including Deputy Director of the Microelectronics Equipment Research Institute at Beijing Jianzhong Machine Factory, Deputy Plant Manager, Chief Engineer, and Executive Deputy Plant Manager at Beijing Jianzhong Machine Factory, Deputy General Manager and General Manager at Beijing Qixing HuaChuang Electronics Co., Ltd., and Deputy General Manager and General Manager at Beijing Northern Microelectronics Base Equipment and Process Research Centre Co., Ltd. In 2014, he was selected for the National ‘Ten Thousand Talents’ Programme. In 2015, he was awarded the title of ‘Person Enjoying the State Council's Special Allowance.’ In 2019, he was conferred the title of ‘Beijing Scholar.’ He currently serves as a member of the International Board of Directors of the International Semiconductor Industry Association, President of the China Electronic Special Equipment Industry Association, Vice President of the China Integrated Circuit Innovation Alliance, and President of the China Integrated Circuit Equipment Innovation Alliance. Born in August 1964, he holds Chinese nationality, holds a master's degree, and is a professor-level senior engineer.

Zhiyue Wang, formerly served as the Chief Scientist of China Electronics Technology Group Co., Ltd. and the Chief Technology Officer of China Electronics Technology Equipment Group Co., Ltd. Currently, he is a Senior Technical Consultant and Senior Engineer at China Electronics Technology Equipment Group Co., Ltd. He has been deeply involved in the research and management of semiconductor equipment for 40 years. As the overall technical commander, he has led the implementation of major projects such as the National Science and Technology 02 Special Project and Key R&D Program, and have won provincial and ministerial level awards such as the Second Prize for Scientific and Technological Progress of the Ministry of Electronics Industry, the First Prize for Scientific and Technological Progress of the Group Company, and the Second Prize for Management Innovation Achievements of Military Enterprises， long term contribution to the localization of semiconductor equipment.

Chen Ji is a member of the Executive Committee and President of Beijing Northern HuaChuang Microelectronics Equipment Co., Ltd. Northern HuaChuang's main products cover core process equipment such as etching, thin film deposition, thermal processing, wet processing, and spin coating and developing, which are widely used in the manufacturing fields of integrated circuits, 3D integration and advanced packaging, compound semiconductors, new displays, and substrate materials.

He holds 36 invention patents, including 16 U.S. patents.

Ph.D. in Materials Science, Chinese Academy of Sciences

National Senior Engineer

Previously held positions at multiple top global semiconductor equipment manufacturers, serving successively as Senior Technical Expert，Senior Product Manager and Senior Marketing Manager.

Possesses over 20 years of experience in semiconductor Metrology and Inspection. Expertise spans electron beam inspection (EBI) tools and bright-field/dark-field optical inspection tools, with an in-depth understanding of current domestic/international developments and future trends in the field.

The founder and chairman of Qinghe Jingyuan, an overseas high-level talent of the Chinese Academy of Sciences, a doctor from the University of Tokyo, has long focused on advanced heterogeneous integration technology, presided over and participated in a number of research projects, published more than 30 SCI articles as the first and corresponding author, and has been invited to give reports at international societies for many times, and founded Qinghe Jingyuan in 2020 to promote technology industrialization.

Zhiyue Wang, formerly served as the Chief Scientist of China Electronics Technology Group Co., Ltd. and the Chief Technology Officer of China Electronics Technology Equipment Group Co., Ltd. Currently, he is a Senior Technical Consultant and Senior Engineer at China Electronics Technology Equipment Group Co., Ltd. He has been deeply involved in the research and management of semiconductor equipment for 40 years. As the overall technical commander, he has led the implementation of major projects such as the National Science and Technology 02 Special Project and Key R&D Program, and have won provincial and ministerial level awards such as the Second Prize for Scientific and Technological Progress of the Ministry of Electronics Industry, the First Prize for Scientific and Technological Progress of the Group Company, and the Second Prize for Management Innovation Achievements of Military Enterprises， long term contribution to the localization of semiconductor equipment.

Dr. LI WEIMIN, male, born in 1967, is a Finnish citizen. He serves as the Vice Chairman and Chief Technology Officer (CTO&Vice Chairman) of Jiangsu

Leadmicro Nano-Technology Co., Ltd.Dr. Li holds over 40 international patents

and possesses nearly 30 years of experience in the research, development, and

industrialization of atomic layer deposition (ALD) technology. His research findings have been published multiple times in international journals and conferences.

Dr. Li played a key role throughout the industrialization of ALD technology at

the 45nm semiconductor technology node. He has long been dedicated to promoting

international cooperation in ALD technology and its adoption in China. He serves as a member of the Technical Committee of the International ALD Conference and is

the initiator and Co-Chair of the China ALD Conference. He is also a Core

Committee Member of SEMI China Standards (Cursor Committee).

Dr. Li has received numerous prestigious honors, including:

1. Selection as a Category A Expert under the National Major Talent

Engineering Program

2. Recipient of the State Council Special Government Allowance

3. Winner of the Jiangsu Provincial "Friendship Award"

4. Recognized as the Leading Figure of Jiangsu Provincial Innovation and

Entrepreneurship Teams (Shuang Chuang Teams)

5. Recognized as a Shuang Chuang Talent (Double Innovation Talent) of

Jiangsu Province

Leading Figure of the Wuxi City "Taihu Talent Plan" Team

Mr. Zhao Jinrong currently serves as the President of the China Electronic Special Equipment Industry Association and the Chairman of the NAURA Technology Group Co., Ltd. He previously held positions including Deputy Director of the Microelectronics Equipment Research Institute at Beijing Jianzhong Machine Factory, Deputy Plant Manager, Chief Engineer, and Executive Deputy Plant Manager at Beijing Jianzhong Machine Factory, Deputy General Manager and General Manager at Beijing Qixing HuaChuang Electronics Co., Ltd., and Deputy General Manager and General Manager at Beijing Northern Microelectronics Base Equipment and Process Research Centre Co., Ltd. In 2014, he was selected for the National ‘Ten Thousand Talents’ Programme. In 2015, he was awarded the title of ‘Person Enjoying the State Council's Special Allowance.’ In 2019, he was conferred the title of ‘Beijing Scholar.’ He currently serves as a member of the International Board of Directors of the International Semiconductor Industry Association, President of the China Electronic Special Equipment Industry Association, Vice President of the China Integrated Circuit Innovation Alliance, and President of the China Integrated Circuit Equipment Innovation Alliance. Born in August 1964, he holds Chinese nationality, holds a master's degree, and is a professor-level senior engineer.

Jia Zhaowei graduated from Shanghai Chiao Tung University in 2007 with a major in condensed matter physics. After that, he joined ACM Shanghai and has been engaged in semiconductor wet and electroplating process and equipment development. He is currently the vice president of process department. He has applied for more than 100 invention patents related to wafer electroplating technology, single-wafer megasonic cleaning, vapor phase etching technology, etc. As one of the main members, he participated in the 02 project: "65-45nm stress-free polishing equipment and process" and "45-14nm electroplating process and equipment development" projects.

Zhu Peiwen serves as Chairman and General Manager of Jiangsu Shenzhou Semiconductor Technology Co., Ltd. With nearly two decades of deep expertise in semiconductor equipment, he has led the development of core technologies including a high-dissociation-rate, corrosion-resistant remote plasma source. These innovations address critical "bottleneck" challenges in chip manufacturing, with related patents filling domestic technology gaps and enabling domestic replacement of multiple key equipment types. Under his leadership, Shenzhou Semiconductor has successfully commercialized semiconductor RF power supplies and remote plasma sources, pioneering domestic substitution in advanced process nodes. The company serves over 350 Fab customers worldwide and has secured strategic investment from the National Integrated Circuit Industry Investment Fund Phase II.

He has worked in the semiconductor industry for over 40 years and is familiar with semiconductor production processes and enterprise management. He has participated in major microelectronics projects during the Sixth and Seventh Five-Year Plans of the country, as well as the '908' project. For many years, he has consistently collected and analyzed the development of the semiconductor industry both internationally and domestically in this region. He conducts in-depth corporate and market surveys, and writes industry research reports and professional articles. He undertakes project evaluations, training, teaching, consulting tasks, and plans and organizes various forms of semiconductor industry activities.

Dr. Herman Lee received PhD in EE in National Tsing Hua University in Taiwan, with over 20 years of experience in the semiconductor industry. He once served as the US president of Taiwan's eMemory Technology, co-founded CanSemi Technology Inc and held the position of Vice President, and joined Chongqing Xinlian Microelectronics as a Senior Vice President in 2024.
Dr. Lee specializes in non-volatile memory technology and business development in chip design/wafer manufacturing. He has conducted over 200 patent technology licensing and product development cooperation projects with more than 50 internationally renowned semiconductor enterprises. Dr. Lee also serves as consultant in semiconductor associations in several regions in China.

Desmond Hor, GM of Jiangsu Leadlap Semiconductor Technology Co., Ltd. He oversees all aspects of Leadlap's worldwide commercial operations, ensuring revenue optimization. In this role, he is responsible for Leadlap's entire product portfolio, including new product launches, sales and marketing activities, customer support, and financial performance.

He possesses over two decades of extensive experience in product management, sales, and marketing within the electronics and semiconductor industries across China and Southeast Asia. He has been actively involved in China's semiconductor ecosystem and has played a significant role in promoting semiconductor collaboration between China and Southeast Asia.

Desmond graduated from the University of Technology Malaysia with a Bachelor's degree in Electrical Engineering and holds an MBA degree from the University of British Columbia (UBC).

In 2022, he joined zhongdao Optoelectronics as a senior vice president, responsible for the semiconductor business department. With more than 20 years of experience in the semiconductor industry, he has served as the sales director of AMAT, the general manager of Orbotech China, and the senior vice president of Zhengfan Technology.

With over 20 years of dedicated expertise in the semiconductor equipment industry，as Sales Director at ADA SEMI, he led the team to dramatically boost market share and brand recognition for domestic wire bonders and packaging solutions, accelerating China's wire bonder localization initiatives.

Jia Zhaowei graduated from Shanghai Chiao Tung University in 2007 with a major in condensed matter physics. After that, he joined ACM Shanghai and has been engaged in semiconductor wet and electroplating process and equipment development. He is currently the vice president of process department. He has applied for more than 100 invention patents related to wafer electroplating technology, single-wafer megasonic cleaning, vapor phase etching technology, etc. As one of the main members, he participated in the 02 project: "65-45nm stress-free polishing equipment and process" and "45-14nm electroplating process and equipment development" projects.

Mr. Sun Bin is a seasoned expert in semiconductor cleanroom facilities with 16 years of industry experience, having led major projects for BOE and Wise Road Capital. Currently the Sales Manager at Huakang Clean Tech, he is well-versed in cleanroom design and the construction of plant utility systems. Holding a mechanical and electrical engineer certification, he specializes in controlling high-specification clean environments. In this session, he will share insights on 12-inch wafer fab cleanroom system design and innovative solutions.

M.S. in Optics from CIOMP, CAS, with over 10 years of experience in industrial machine vision. Specializes in leveraging cutting-edge optical technologies to deliver high-precision, intelligent optical solutions for vision inspection in complex manufacturing environments.

Graduated from Huaqiao University with a master's degree in Nonlinear Optics, with 12 years of experience in software and hardware system integration in the semiconductor industry, and has close cooperation with Leading semiconductor enterprises both domestically and internationally.

He Mingsheng， who works in the communication and semiconductor industries. I have worked at Huawei for more than 10 years and have been responsible for sales and service teams in semiconductor component companies for over 5 years. In recent years, he has led his team to work closely with leading domestic semiconductor enterprises to advance the replacement of domestic components, and certain progress has been made in this regard.

As Tucsen Photonics' Semiconductor Business Leader, she has 15 years of end-to-end experience in the imaging field, honed across R&D, technology, marketing, and sales. Proficient in product development principles and industry standards, with deep insights into customer needs. In recent years, has led the team to focus on the semiconductor metrology and inspection market, gaining in-depth understanding of industry pain points and domestic substitution pathways. The team provides high-line-frequency TDI cameras and deep-cooling scientific cameras to leading enterprises, overcoming multiple critical "bottleneck" technical challenges.

Mr. Hideki Masuyama is a pioneering figure in the field of UHP pressure sensors for semiconductors, recognized for both his technological contributions and global market development. He began his career at Nagano Keiki, where he played a key role in the R&D and standardization of Japan’s first-generation UHP pressure sensors. The products he led in development were the first to obtain SEMI F20 certification, marking a significant step in bringing Japanese UHP technology to the global stage. Currently serving as the President of LOK-FIT Co., Ltd., he is dedicated to advancing the third-generation semiconductor market by building localized clean and service systems, driving the standardization and large-scale adoption of UHP sensors in high-end global applications.

Currently serving as Deputy General Manager at BICCNS, previously worked at several Fortune 500 sensor companies, with 18 years of experience in the sensor industry. He has long focused on the deep integration of sensor design, manufacturing processes, and application scenarios, specializing in the development of high-reliability, high-precision sensor solutions. He is committed to providing customers with stable and reliable products as well as professional technical support.

His research focuses on high-intensity laser physics and its applications, including laser-driven particle acceleration and radiation sources, as well as strong-field effects. He has published over 50 papers in peer-reviewed journals and is recipient of the national high-level young talent program, the Humboldt Research Fellowship, and the Asia-Pacific Plasma Society Young Scientist Award, among others. He is now leading several research projects, such as the CAS Strategic Priority Program and the 100PW laser experimental platform in national key scientific infrastructure and so on.

Wang Xinhe, Associate Professor and PhD Supervisor at Beihang University, Beijing Nova Program. His research focuses on integrated circuit equipment (process monitoring & metrology technologies) and novel device circuits (spintronics & carbon-based electronics). His work has been published in Applied Physics Reviews (cover feature), Science Advances, Nano Letters, etc. He holds 19 granted Chinese invention patents (15 authorized) and 12 first-authored US patents, addressing 4 key IC equipment challenges with industrial translation through leading enterprises.

Dr. Cao Zizheng is a tenured professor/Qiushi Distinguished Professor at College of Integrated Circuits, Zhejiang University, he is recognized as a National High-Level Talent Program awardee. He previously served as a tenured faculty member at Eindhoven University of Technology and a professor at Peng Cheng Laboratory (also the Deputy Director of an Research Institute). He was also a member of the semiconductor advisory expert group at Science, Technology and Innovation Commission of Shenzhen Municipality. His primary research focuses include: 1) Achieving communication, computing, and sensing functions in photonic integrated system-on-chip (SoC) architectures; 2) Developing high-field lithography technologies to support ultra-large-scale photonic SoC and system-on-wafer (SoW) systems.

Dr. Chenyang Ding received the bachelor's degree from Xian Jiaotong University and the master's degree from National University of Singapore. In 2013, he received the Ph.D. degree from Control Systems Group, Electrical Engineering, Eindhoven University of Technology. He worked on dynamics and control of precision mechatronic systems in high-tech industry in Eindhoven, the Netherlands for a few years and in 2019, he joint Fudan University in Shanghai. His main interest is dynamic modeling and control of piezo actuators, maglev systems, and vibration isolation systems.

Professor Xu Jianming is deeply involved in the field of intelligent microsystem integration. He is currently the Vice Dean and Professor of the School of Integrated Circuits at Sun Yat sen University, a leading talent in the Hundred Talents Plan, and the head of the Heterogeneous Integration and Intelligent Microsystems discipline. He has served as the Chief Designer and Technical Director of the System Department of China Ordnance Industry Group, and has long led national key scientific research projects. He has achieved systematic innovation in integrated circuit design, ASIC dedicated chip key technology research and development, and made outstanding contributions to breaking through foreign technology blockades and promoting the modernization of national defense equipment.

Professor Li is from Zhejiang University, with nearly 20 years of experiences in development and engineering of ultra-precision metrology technology. Her research interests cover measurement and calibration, complex system integration and control, dynamic and unsteady state modeling, as well as opto-electromechanical system design. She used to work in the institute of the Chinese Academy of Sciences, and had ever worked for an international high-tech company for many years.

He Xiaoning, a doctoral graduate from Xi'an Jiaotong University, currently serves as a professor in the Department of Integrated Circuits at Xi'an Jiaotong University, the general manager of Shaanxi Semiconductor Leading Technology Center Co., Ltd., the executive director of the China Semiconductor Industry Association, the vice chairman of the China Semiconductor Industry Association Integrated Circuit Design Branch, the executive vice chairman and secretary-general of the Shaanxi Semiconductor Industry Association, and the deputy director of the National Engineering Center for Wide Bandgap Semiconductors. She has long been engaged in research on cutting-edge common technologies in semiconductors and their industrial applications. She has won multiple awards such as the first prize for technological inventions in Shaanxi Province and has been selected as a talent in Sanqin and Shaanxi Province for scientific and technological innovation and entrepreneurship.

Li Shiqun graduated in 2012 and then joined NAURA Microelectronics Equipment Co., Ltd. He has been engaged in market sales-related work for over 13 years and possesses extensive experience in semiconductor equipment sales.

Mr. Ma Rongyao, a master's graduate in microelectronics from the University of Electronic Science and Technology of China, has been dedicated to the technological development of power devices. He previously worked at MPS and possesses extensive experience and achievements in the research and development of integrated power devices, medium and low voltage discrete devices, and high voltage discrete devices. He has obtained dozens of patents for technology in the United States and China. Currently, he serves as the Vice President of the High Voltage Product Line in the Power Device Business

Gilbert Zhou, AccoPower President, Director, One of the core founders and director of AscenPower. He is a technical expert in the field of semiconductors and integrated circuits.Senior Engineer. He holds a master's degree in engineering, an MBA degree from Webster and Shanghai University of Finance, and is the founding president of Xi 'an Jiaotong University's microelectronics alumni association. He has been deeply involved in the field of semiconductor application technology for more than 30 years, and has rich experience. He often participates in speeches at industrial activities, and his unique opinions are widely recognized in the industry.

Ding Guohua, male, Han ethnicity, born in 1963 in Zhangjiagang, Jiangsu Province, is the Chairman of Suzhou Convert Semiconductor Co., Ltd. As a member of the Communist Party of China, he has been recognized as a National Leading Talent in Technology Entrepreneurship (under the National "Ten Thousand Talents Plan"), a Gusu Leading Talent, and an Outstanding Individual in Innovation and Entrepreneurship in Jiangsu Province.

He also holds several social roles, including serving as an expert for the Jiangsu Provincial Department of Industry and Information Technology, a part-time corporate mentor at Xidian University, and the Vice President of the Microelectronics Alumni Association of Xi'an Jiaotong University.

Zhang Tao, a senior packaging technology expert at Huayi Microelectronics Co., Ltd, has 12 years of experience in power semiconductor discrete device product development and project management. I have led the mass production and development of packaging platforms including ultra-thin chip packaging, 8-inch wafer Back Grinding and Back Metallization process(BGBM-CP), Cu clip bonding process, PPAK series, TOLL, TOLT, etc. In 2015, I won the second prize for scientific and technological progress in Tianshui City, Gansu Province for my ultra-thin chip packaging technology, and participated in the compilation of "Power Semiconductor Packaging Technology" (published in 2021). Previously awarded the title of Technology Innovation Model by Huatian Electronics Group. Currently serving as a mentor for the "Packaging Testing Class" of Fudan University's school enterprise cooperation enterprise and participating in graduate training.

Tang Jun, PhD, is a top talent in Ningbo City. He is currently the Vice General Manager of CEC compound Semiconductor Co.,Ltd.and an off campus master's supervisor at Huazhong University of Science and Technology. Engaged in long-term research and industrialization of third-generation semiconductor GaN and SiC epitaxial technology, participated in multiple national key research and development projects, and applied for more than 40 invention patents.

Chen Xianglong, Deputy General Manager of Qingdao SRI Intellectual Technology Co., Ltd. Since 2018, managing global sales and European R&D center.After the acquisition of Finnish Beneq by SRII, he successfully integrated domestic and international teams to achieve a comprehensive upgrade of ALD product lines. Since 2022, he has led the ALD and Ion Implantation sales teams to accelerate the development of the domestic semiconductor market. Under his leadership, SRII has rapidly grown into a leading global high-end semiconductor equipment manufacturer, serving more than500 customers across more than 40 countries and regions.

Yanan Pang has over ten years of experience in GaN research and development and has been deeply involved in the field of wide bandgap semiconductors. He is fully responsible for the wide bandgap semiconductor product line of Prisemi. He has led the development and successfully mass-produced a variety of GaN products covering low, medium and high voltage series, achieving large-scale production and stable shipment of products. The products he developed have leading performance and reliable quality, and have been highly recognized by core customers and achieved continuous repurchase.

Dr. Nan Jiang, graduated from Technical University of Chemnitz, Germany. He worked for Heraeus Electronics in Germany, participated in the R&D of advanced packaging materials; In 2019, he returned to China to establish Guangdong Nengxin Semiconductor .CO, Ltd. in Foshan; Later, he was appointed as an associate researcher at Hefei Comprehensive National Science Center, responsible for the construction of power device platforms; In 2023, Wuxi Powersemilab Co., Ltd. was founded to provide solutions for dynamic parameter tests and dynamic reliability tests of SiC devices.

1. In the context of intensifying global competition and technological rivalry, China's semiconductor equipment industry faces dual challenges of technological innovation breakthroughs and compliance risk management, with intellectual property disputes becoming increasingly prevalent both domestically and internationally. This presentation will examine three critical dimensions of IP protection and compliance management in semiconductor equipment development:(1)Patent offense-and-defense strategies and barrier construction for core technologies under asymmetric competitive conditions;(2)End-to-end IP compliance risks and their management mechanisms throughout business operations;(3)Key IP queries and response tactics during STAR Market listings and related financing activities.

2002 Received a master's degree in Physical Electronics from Fudan University

2002-2004 served as a process engineer in the Lithography Engineering Department of Grace Semiconductor

2004 joined the Semiconductor Systems Division of Hitachi High-Tech (Shanghai) Co., Ltd. and was responsible for the application of Metrology and Inspection equipment. He has successively held the positions of senior engineer, manager and deputy general manager.

Mr. Chen Xiang currently works as the deputy general manager of the semiconductor materials sales department at Resonac(China) Corporation and concurrently serves as the general manager of the Beijing branch. He is mainly responsible for the marketing of semiconductor wafer materials and packaging materials in the Chinese market and also manages the marketing of wiring board materials in the North China market. Prior to this, he worked as a process engineer manager at STATS ChipPAC (Shanghai) Co., Ltd.

Ma Qinghai, senior economist, SMC global director, general manager of SMC China; as an early entrepreneur of SMC China, he participated in and presided over the establishment of a research and development center and four modern manufacturing plants in Beijing. In recent years, he replanned the business blueprint of SMC China Asia Pacific, reorganized the marketing system of SMC China, and comprehensively promoted the SMC BCP (Business Continuity Plan) plan, SDGS business, energy saving & CO2 reduction business, and created a high-end equipment and core parts supporting enterprise with a value of tens of billions.

Sales&Marketing in Tokyo Electron, General manager in Fujitsu Semiconductor. Semiconductor senior analyst in Gartner and Omdia for 12 years, Securities analyst in ABN AMRO and Lehman Brothers for 8 years.

Vin Zhou, Engineering Head of VAT China. With 20 years’ experience in vacuum and semiconductor industry, now leads engineering team support customization projects in local pan-semiconductor customers; and promotes VAT R&D’s launch.

Snow has over twenty years of experience on optical communication industry. Currently, he works at Optical system division of Broadcom as senior BD manager, focusing at CPO and optical solution promotion in China market. Before that, He has worked at Intel and Finiar for many years to take charge of the marketing promotion and technical support for traditional and Siph transceiver

Andrew Chan Yik Hong is the Executive Director of the Malaysia Semiconductor Industry Association (MSIA). MSIA is the voice of the Malaysia semiconductor and electronics industry. Andrew leads MSIA’s strategic direction, policy advocacy, industry development, and international engagement. MSIA currently represents over 300 member companies from 20 countries, spanning the full semiconductor value chain.

Andrew plays a pivotal role in positioning Malaysia within the global semiconductor landscape. He serves on several high-level national platforms, including PEMUDAH, the National Strategic Semiconductor Task Force, and TalentCorp’s MyMahir Future Skills Talent Council for the semiconductor sector. He also chairs the Semiconductor Working Group under Malaysia’s National Standards Committee, where he champions cross-sector collaboration and technical leadership.

Graduated from Nagoya Institute of technology on 1990. Then worked on display and semiconductor manufacturing materials for about 30 years for RD, mass production, global product manager and quality assurance. Now focusing on electroic chemicals supply chain and platform development

Seungcheol Oh is CTO at TYST, focusing on functional and plasma-resistant ceramic coatings for semiconductor components using aerosol deposition and sputtering.

CHEN Dengyun， PhD of Analytical Chemistry, Xiamen University; Industry Expert of Xiamen University (Semiconductor); Senior Engineer; worked in Agilent Technoligies 13 years as G. China Spectroscopy Products (SPSD) Manager; 2 years in PerkinElmer as Inorganic Product Line Leader(APAC); with >30years experiences in ICPMS technologies; Second Editor and Major Author of <Application Examples of Modern ICP-MS>; Currently working in Rorze-IAS Inc. as Service Representative & Technical Director in China.

Thomas Tong holds a Bachelor of Technology degree in Manufacturing Technology from the National University of Singapore and has over 30 years of experience in electronics manufacturing. He spent 12 years in SMT process roles at multinational companies like Apple and 3COM, followed by 7 years at Indium as Technical and Sales Manager focusing on soldering materials. He also has over 10 years of experience in thermal processing applications with companies such as Despatch and BTU. Currently, he is the Process Technology Manager at BTU International, developing advanced thermal solutions for the SMT and semiconductor packaging industries.

Berthold Ocker studied physics at Goethe University Frankfurt. In 1991, he began his career in the development of production systems using vacuum deposition technology. Since 1995, his work has focused on spintronic applications. In 2001, he joined Singulus, where he headed the semiconductor development department until 2015. In 2015, he was promoted to the director of the Business Unit Semiconductor.

Lou spent 29 years at Texas Instruments, retiring in 2007. As Director of TI’s Mixed-Signal Technology Development organization, he was responsible for worldwide analog, power, RF SiGe, and mixed-signal technology development, design enablement, production ramps, and transfers that supported every business unit in the company. He was elected a TI Fellow in 1995. In 2008, he joined DB HiTek, in Seoul, S. Korea, as Senior Vice President and General Manager of the newly created Analog Foundry Business Unit. During his tenure there, he established DB HiTek as a leading analog/power foundry. Since 2012, he is the CEO of Lou Hutter Consulting LLC, assisting foundries, IDMs, fabless design houses, and material suppliers in the areas of analog/power technology, design enablement, organizational management, and business development. From 2013-16, he worked extensively to try to establish India’s first high-volume production wafer fab, Cricket Semiconductor, focusing on analog/power technologies. Lou has 50 U.S. patents, has published over 35 journal articles, has co-authored 1 book entitled Silicon Analog Components, now in its 2nd edition, and a newly released 5-book self-study series. He has an MSEE from MIT, and resides in Lisbon, Portugal.

Namhoon Lee is CEO at TYST, focusing on functional and plasma-resistant ceramic coatings for semiconductor components using aerosol deposition and sputtering.

More than twenty years of R&D work for Nissin Ion Equipment Co., Ltd. as an executive engineer now. Form July 2025, also work for Nissin Allis Ion Equipment (Shanghai) Co., Ltd.as the vice president.

Zhou Yibin, male, currently serves as Deputy General Manager and Chief Technology Officer of Firsquare. He has been engaged in the field of semiconductor exhaust gas treatment components and equipment for 15 years and has accumulated 45 authorized patents (including 13 invention patents). The core products leading the research and development are widely applied in well-known semiconductor enterprises such as Huahong, Nexchip and Yangtze Memory.

Dr. Hailiang Lu holds a Ph.D. from Shanghai Jiao Tong University and is currently the CTO at Jiangsu JITRI SKS Technologies Co., Ltd. He has over 20 years of experience in semiconductor equipment R&D, product development, and R&D team management. Dr. Lu has led the development of multiple "first-of-its-kind" semiconductor equipment and motion platforms. He specializes in interdisciplinary R&D of complex systems integrating precision motion and optoelectronic technologies, with deep expertise in enhancing system performance through motion-image integration and compensating for image errors caused by motion dynamics. He has published over 20 papers in renowned journals, holds more than 20 valid invention patents, and has led over 10 municipal or higher-level science and technology projects. Dr. Lu is recognized as a Jiangsu Province Entrepreneurship and Innovation Talent and a Leading Talent of Suzhou Xiangcheng District's Key Innovation Team.

As the technical director of IMP group at Hwatsing. Leading market expansion and technical support of Hwatsing’s ion implantation equipments. Twenty-one years of experience in the ion implantation industry. Deep expertise in the principles and applications of imported implanter.

Lauren Cui, senior specialist in the semiconductor industry with over twenty years experience, had occupied pivotal roles including head of FA lab. at UMC/HJTC and senior Project Manager for Strategic Collaborations at Wingtech. Ms.Cui has rich experience in semiconductor manufacturing and R&D, strategic project management, and industrialization implementation. Currently serving as the Deputy General Manager of Wuxi Nasikey Semiconductor Technology Co., Ltd, where she leads the R&D project for core components of Electron Microscopes.

Huang Xiaolu, Vice President in charge of Manufacturing Center of Chongqing Xinlian Microelectronics Co., Ltd., Ph.D., Engineering Professor, Doctoral Supervisor. Over 20 years of experience in technology development and mass production of 12 inch semiconductor Fabs in China and abroad, with nearly 150 invention patents granted and 50 papers published. Has presided over and participated in several national and provincial-level major semiconductor development projects.

Former associate professor and senior engineer of the School of Optoelectronics, Beijing Institute of Technology, visiting professor of the School

of Software Engineering, Xi'an Jiaotong University, visiting researcher of the Key Laboratory of CrossScale Manufacturing Technology, Chongqing

School of University of Chinese Academy of Sciences, doctoral entrepreneurship mentor of University of Chinese Academy of Sciences, and leading

talent of Hefei City.

Has been engaged in research on precision machinery, precision optical

instruments, semiconductor lithography equipment and processes.

In 2000, joined the Spherical Semiconductor Co., Ltd. in the United Statesand participated in the research and production of directwrite lithographyequipment for semiconductor manufacturing. One of the earliest technical

personnel in China to engage in the research and production of direct writing lithography equipment. Also served as the GM of Zhongshan Aiscent Technology Co., Ltd., chief scientist and DGM of Wuxi UNICOMP, and chief scientist and DGM of Circuit Fabology Microelectronics Equipment Co., Ltd.‌

Has more than ten years of experience in the field of direct-write lithography.

Familiar with semiconductor lithography equipment and related imaging systems, ultra-precision motion platforms, light source systems, alignment systems, and other components of lithography equipment, as well as related semiconductor manufacturing processes.

Shenyang Cao, AoXinMing Technical Marketing Engineer

·Tracks power module market dynamics and trends.

·Identifies customer requirements and pain points in various applications.

·Focuses on SiC power module packaging solutions research and application.

With over ten years of process experience in the panel, semiconductor and other industries, I am dedicated to the application and research and development of filtration and separation technologies. I have been deeply involved in the design and development of multiple high-performance filtration products for the semiconductor industry, effectively converting customer demands into technical indicators, promoting the transition of products from concept to mass production, and facilitating the localization of high-end filters.

Mr. Suning Shi is currently the Lithography and Bonding Product Manager at SUSS MicroTec. Since joining SUSS in 2012, he has been dedicated to lithography and wafer bonding processes. For over a decade, he has worked alongside SUSS’s global wafer bonding expert team, collaborating with numerous semiconductor factories, research institutes, and universities in China. He has helped customers research, develop, and optimize wafer bonding processes for various applications in semiconductor manufacturing.

Zhu Peiwen founded Yangzhou Shenzhou Technology Co., Ltd. in 2001, specializing in repair services for remote plasma sources, RF matchers, RF power supplies, and other equipment. The company has provided professional, efficient, and high-quality technical services to global production lines in the SEMI, DISPLAY, SOLAR, and medical industries. In 2016, he established Jiangsu Shenzhou Semiconductor Technology Co., Ltd., leading the Shenzhou team through a transformation from repair services to R&D and manufacturing. He remains committed to Shenzhou’s vision: to become a world-class plasma system manufacturer, and upholds its core values: "The world’s trust, Shenzhou’s responsibility." After years of continuous R&D investment, SZSEMICON has successfully mass-produced multiple advanced-process-compatible remote plasma sources and RF power supplies, effectively addressing several critical bottlenecks in the semiconductor industry. Under his leadership, SZSEMICON is advancing toward becoming a globally competitive company.

As a senior technician specializing in the design of specialty gas control components, since 2004, I have led the development of ultra-high purity pressure reducers, ultra-high purity diaphragm valves, ultra-high purity joints, ultra-high purity instruments and other products. I have participated in the design of numerous high-purity and ultra-high purity gas delivery systems, providing customers with many optimized solutions. I have been deeply involved in this industry for over 20 years Have rich experience in the application of products.

John joined the Shanghai Branch of DAIKIN FLUOROCHEMICALS(CHINA)CO.,LTD SHANGHAI BRANCH in 2012, where he was primarily responsible for the marketing of Perfluoroelastomer Sealing Ring, dry etching gases, and Anti corrosion lined semiconductor. In 2022, John was transferred to DATIKIN TSINQYAN ADVANCED TECHNOLOGIES(HUIZHOU)CO.,LTD as the Sales Director, specializing in the development of the Chinese market for perfluoro seals.

Male, born in 1992, Master's degree. Graduated from Harbin Institute of Technology in 2014 and obtained a Master's degree in Materials Processing Engineering from Harbin Institute of Technology in 2016. Mainly engaged in the research and development of semiconductor wet process equipment and related components. In charge of the development of various fluid control and temperature control components for semiconductor wet processes in the company.

President Lou Suning has been deeply involved in the pneumatic & fluid industry for over 20 years. Leading her team, She has established long-term and in-depth cooperative relationships with Fortune 500 companies in 118 countries around the world and is a reliable strategic partner for equipment manufacturers.President Lou adheres to the original aspiration of "beauty in craftsmanship and excellence in both internal and external aspects", and insists on taking technology as the foundation and innovation to create value as the core concept. She has built company into a co-creation platform for the manufacturing of industrial automation components based on pneumatic and fluid control, establishing a virtuous ecosystem centered on customers, shared by strategic partners, and advanced together with business partners. Led Eternal company to achieve rapid growth and become a leader in the industry. Mr. Lou possesses a strong sense of social responsibility, a global perspective and strategic business thinking. She has been honored with titles such as "Expert in China's Pneumatic Industry" and "Top Ten Outstanding Young People of Ningbo City".

After earning a Master's degree in 2007, joined Naura. Possesses 16 years of experience in semiconductor equipment technology development and product development, along with extensive experience in quality management.
Previously served as:
Vice General Manager of the Etch I Business Unit at NAURA；General Manager of Quality System at NAURA. Currently holds the position of President of Supply Chain System at NAURA

Dr. Chen Xinyi holds a Ph.D. in Materials Science and Engineering from the University of Maryland, College Park, USA. He has long been engaged in the research and development of processes, applications and equipment for semiconductor thin film material deposition, accumulating over a decade of research and management experience in this high-tech field. Since returning to China in 2020, Dr. Chen Xinyi has served as the Director of Advanced Film Process Technology, General Manager of the ALD Business Unit, and Deputy General Manager of Piotech Inc., being responsible for the application research and development of advanced semiconductor thin film equipment.

Chairman of the TGV Industry Alliance of the Global Semiconductor Association, President of the China Campus Association at National Tsing Hua University (Taiwan), MBA from Nation University of USA, Bachelor's degree from National Tsing Hua University (Taiwan); Expertise in semiconductor Photo/CMP/Etching/Thin Film/Diffusion/Metrology & Inspection/Cleaning/2.5D & 3D Advanced Packaging/TSV/TGV/FOPLP/FOWLP/CoWoS/CPO/Vacuum technologies, high-end semiconductor manufacturing, semiconductor advanced technology integration and deployment, semiconductor project international expansion, semiconductor high-tech finance; 25 years of executive management and technical marketing experience in the semiconductor industry, with extensive global semiconductor industry network, client, and market resources; Former executive at KLA (Top 5 global semiconductor equipment company) and listed semiconductor companies Hermes and Marketech, leading teams to achieve outstanding records during tenure. Founder and Chairman of Mutual Benefit Technology and Mutual Benefit Semiconductor Companies. Lawrence Fong frequently organizes and participates in semiconductor manufacturing events, delivering acclaimed lectures on semiconductor technology, recognized widely by semiconductor industry professionals.

Ye Tianchun graduated from Fudan University in 1986 with a degree in Semiconductor Microelectronics. He is the former Director and a Research Fellow at the Institute of Microelectronics of the Chinese Academy of Sciences (CAS). As one of the leading figures in China's integrated circuit (IC) manufacturing field, he has long been engaged in frontline innovative research with outstanding achievements.He is a recipient of the "Special Government Allowance from the State Council" and has been awarded numerous prestigious honors, including:three National Technology Invention Awards(Second Class),one CAS Outstanding Scientific and Technological Achievement Prize,one National Science and Technology Progress Award(Second Class),seven Provincial/Ministerial-Level Science and Technology Awards.With 121 authorized invention patents and over 130 academic papers published in top-tier national and international journals, he has also mentored more than 50 master's and doctoral students. In 2019, he was elected as an Academician of the International Eurasian Academy of Sciences.

In 2008, he was appointed by the State Council as the Chief Technology Officer of the National Science and Technology Major Project "Ultra-Large-Scale Integrated Circuit Manufacturing Equipment and Complete Process" (02 Special Project). In 2017, he served as the Deputy Director-General and Secretary-General of the China Integrated Circuit Innovation Alliance. In 2020, he was elected as the Chairman of the Integrated Circuit Branch of the China Semiconductor Industry Association .

Dr. Simon Yang is the CEO of YMTC, brings YMTC to new heights in 3D NAND industry. As an experienced executive in the semiconductor industry for over 30 years, Simon has served as the CEO of XMC, COO/CTO of SMIC, and CTO/SVP of GlobalFoundry, took full responsibility for fab operation and technical development. Before that he was with Portland Technology Development group in Intel for more than 10 years, led remarkable technical innovation projects.

Simon got his Bachelor Degree from Shanghai University of Science & Technology, Master Degree and Doctor Degree from Rensselaer Polytechnic Institute. He holds more than 40 patents and published over 30 articles.

Shouyi Yin, Professor and Vice Dean of the School of Integrated Circuits at Tsinghua University. He was a IEEE Fellow, and a recipient of The National Science Fund for Distinguished Young Scholar. His research areas include: Reconfigurable Computing, Computing-in-Memory architecture, and AI chip design. He has published more than 100 papers in top journals and international conferences, such as ISSCC, VLSI, ISCA, MICRO, HPCA, IEEE JSSC, TPDS, TCSVT, TVLSI, TCAS-I/II, etc. He has Published two monographs. He has received Second Prize of China’s State Technological Invention Award, First Prize of Science and Technology Advancement Award of The Chinese Institute of Electronics, First Prize of Technological Invention Award of the Ministry of Education, etc.

Secretary-General of the China Automotive Chip Industry Innovation Strategic Alliance.He holds a bachelor's and master's degree in Industrial Engineering and Precision Instrumentation from Tsinghua University, as well as a Ph.D. in Mechanical Engineering from the University of Illinois at Urbana-Champaign (UIUC), USA. With long-term dedication to the R&D of new energy vehicle technologies and strategic research and management in the industry, he is an expert in power batteries, powertrain platforms, and vehicle integration and control.His accolades include the Outstanding Young Manufacturing Engineer Award from the Society of Manufacturing Engineers (SME), the Outstanding Young Manufacturing Leadership Award from the Society of Automotive Engineers (SAE), the First Prize of China Automotive Industry Science and Technology Award, and the First Prize of Beijing Science and Technology Award, among others.He has served in various key roles, including as an expert member of the National New Energy Key Research Program, a Beijing Municipal Specially Appointed Expert, an expert reviewer for Beijing Senior Professional Title Evaluation, and a high-level leading talent in Zhongguancun.

As the CTO of NCAP engaged in research on 3D heterogeneous integration technology of microelectronics and optoelectronics. As the project and research leader, he has undertaken multiple national-level major projects, published over 70 academic papers, and received the National Science and Technology Progress Award and the Science Promotion and Development Award from the Chinese Academy of Sciences.

Mr. Liu Weiping has been working hard in the field of EDA and integrated circuit design for more than 30 years. He is a witness of the famous “Panda” EDA tool development project. In 2009, Mr. Liu led a team to establish Empyrean Technology，which continue to improve technology level and core competitiveness of China’s EDA. Mr. Liu has been successively employed as a member of the National ICCAD Expert Committee, a member of the National Software Expert Committee of Ministry of Industry and Information Technology, a member of the National 863 Integrated Circuit Design Expert Group, etc. He has achieved First and Third Class Prizes of The State Scientific and Technological Progress Award，which is repeatedly affirmed.

Ph.D., Postdoctoral Fellow at Rutgers, The State University of New Jersey, Doctoral Supervisor, Second-Class Professor, and Chief Scientist of Huatian Technology.

Graduated from Tsinghua University in 1989 with a major in Semiconductor Device Physics, and obtained a master's degree from Xidian University in 1992 and a Ph.D. from Xi’an Jiaotong University in 1998. Since 1992, he has been engaged in teaching and research in the field of microelectronics at Xidian University. From 2005 to 2023, he served as Vice Dean and Dean of the School of Microelectronics at Xidian University.Currently, he holds the following positions: Deputy Director of the National Key Laboratory of Wide Bandgap Semiconductor Devices and Integrated Technology、Member of the Standing Committee of the Shaanxi Provincial People’s Congress、Deputy Chair of the Shaanxi Provincial Committee of the Revolutionary Committee of the Chinese Kuomintang (RCCK)

have been engaged in the design of new architectures and system - on - a - chip for a long time. I am the core proponent of Software - Defined Interconnect (SDI) and Software - Defined System - on - Wafer (SDSoW). One achievement was selected for the "13th Five - Year Plan" Scientific and Technological Achievements Exhibition, one for the "Top Ten Scientific and Technological Developments in China", and one for the "Top Ten Scientific and Technological Developments in National Defense". Over 100 technical invention patents have been authorized, over 90 academic papers have been published. I have won 1 National Science and Technology Progress Second Prize, 1 Tianjin Special Prize, and 3 provincial - ministerial first prizes.

Dr. Hong Xie is the Vice President of Tongfu Microelectronics and the General Manager of the Group Engineering Center. Dr. Xie earned his Bachelor's and Master's degrees from Tsinghua University and a Ph.D. in Mechanical Engineering from the University of Colorado Boulder, USA. With 28 years of experience in the packaging industry, Dr. Xie has held various technical and managerial positions at Intel, FCI, Tongfu Microelectronics, and Goer Microelectronics. He has led and participated in the development and production of a wide range of packaging technologies and products, covering applications such as CPUs, memory, communications, and consumer electronics. Dr. Xie is a Senior Member of IEEE and holds 35 U.S. patents and over 10 Chinese patents. He has published more than 10 technical papers in IEEE and ASME journals.

National-Level Young Talent,Associate Professor and Doctoral Supervisor, College of Computer Science and Technology, Zhejiang University.Research Focus on Neuromorphic Computing Chips, Neural Processing Units (NPUs), System-on-Chip (SoC) Design.Key Achievements:Led the development of the Darwin series brain-inspired computing chips;Awarded the 2020 World Internet Conference Leading Scientific Achievement;Recognized in the 2021 "Science and Technology Innovation China" Pioneer Technologies list (Electronics & Information category);Principal Investigator for multiple national and provincial research programs, including:National Natural Science Foundation of China (Key Regional Innovation Program, General Program, Youth Program),Key R&D Project of the Ministry of Science and Technology;Innovation Special Zone Project of the Military Science and Technology Commission;Zhejiang Province's "Pioneer" R&D Initiative;Published 20+ papers in top-tier journals/conferences (IEEE TVLSI, TCAD, TCDS, IJCAI, etc.);Holds 30+ authorized invention patents

Guo Chao, a PhD from Tsinghua University and VP of iSABers Group, has over a decade of experience in advanced manufacturing R & D and industrialization. He has led or been a key contributor to 3 National Key R & D Projects of the Ministry of Science and Technology, and is the first inventor of dozens of authorized national invention patents.

Daquan Yu is a Distinguished Professor at Xiamen University and the Chairman of Xiamen Sky Semiconductor Technology Co., Ltd. He earned his Bachelor's degree in 1999 and Ph.D. in 2004 from Dalian University of Technology. He has conducted research and development in advanced packaging technologies at the City University of Hong Kong, Fraunhofer IZM in Germany, the Institute of Microelectronics (IME) in Singapore, and the Institute of Microelectronics of the Chinese Academy of Sciences. He previously served as the Dean of the Packaging Technology Research Institute at Huatian Technology.Dr. Yu has led major national science and technology projects under the "02 Major Special Program" and has published over 200 academic papers. His notable awards include:Second Prize of the Beijing Science and Technology Progress Award (2018);Third Prize of the Jiangsu Science and Technology Progress Award (2019);First Prize of the National Science and Technology Progress Award (2020)

Chen Chuan, Ph.D., Associate Research. His research interests include thermal management of IC, thermal-mechanical reliability, and multi-physics field simulation design, etc. He has presided over more than 10 projects, such as the NSFC Youth Program, the Cultivation Project of Major Program of the NSFC, and the topic of Key Program of Beijing NSF. He has also carried out cooperation with Huawei, STIC, Hygon, Honor, AKMMV, etc. He has published more than 30 papers in top journals and IEEE international conferences, and has applied for more than 30 invention patents, among which more than 10 have been authorized.

Senior expert in semiconductor packaging and automotive electronics, holding a Bachelor’s degree from HIT and Master degree from HUST, With nearly 20 years of industry experience, he has worked at globally renowned semiconductor IDM companies as well as leading domestic packaging firms, specializing in memory packaging, automotive electronics application technologies, and market research. Leveraging deep expertise in packaging technologies, automotive-grade chip development, and market strategy analysis, he combines strong technical R&D capabilities with commercial insight, consistently driving innovation and industrial applications in semiconductor packaging technologies.

Libbert Peng, Vice President, Product Management/Product Development

Mr. Libbert Peng has received his Master Degree from East China University of Science and Technology in 2002, and IMBA from HongKong University-Fudan University in 2016. He has more than 20years experience in semiconductor field, successively served at SMIC and Anji Microelectronics Technology (Shanghai) Co. LTD

Graduated from Zhejiang University in 2008, with over ten years of experience in the semiconductor industry, having a strong understanding of semiconductor processes, manufacturing, and equipment. Currently serving as the director of Jiatasemiconductor Co., Ltd., responsible for the company's supply chain planning and management operations. Previously held the position of deputy director of the Development Planning Department at Huada Semiconductor Co., Ltd., and director of the Planning and Technology Department at Jiatasemiconductor Co., Ltd. With six years of experience in semiconductor industry planning in central enterprises, a core member of the planning team for national-level major production line construction projects, and a core member of the semiconductor equipment localization project team, has completed the argumentation and establishment of multiple national-level major semiconductor engineering construction projects.

A versatile expert in the semiconductor industry (design, construction, and operation & maintenance) with China Electronics System Engineering No.2 Construction Co., Ltd.; a senior engineer with 27 years of industrial experience and accumulated expertise in various roles (parties A, B, and C); possesses specialized knowledge in facility engineering and a comprehensive system thinking approach to factory operations, as well as extensive experience in multiple semiconductor factory construction projects, covering site selection, conceptual planning, engineering design, construction, and introduction & production.

Mr. Kevin Tsai is a senior semiconductor equipment manufacturing expert with many years of experience in semiconductor equipment development and manufacturing. He has independent development capabilities in advanced packaging, mask cleaning, TGV through-hole, and metallization, and has rich technical experience in these areas, having obtained certification from major manufacturers. In recent years, he has continued to make breakthroughs in advanced packaging and TGV critical equipment and processes, and has obtained related patent achievements. He is an expert in this field with both practical and innovative capabilities.

Bachelor's degree in Mechatronics from the University of Electronic Science and Technology of China, and Master's degree in Microelectronics from Shanghai Jiao Tong University.

With over 20 years of experience in the semiconductor industry, including years of experience in equipment management at well-known wafer fabs. Co-founded Honghu Semiconductor in 2016, and has extensive experience in the R&D and localization of wafer handling robots.

Has successively presided over science and technology plan projects of Suzhou City, Jiangsu Province, and the Science and Technology Leading Talent Program of Xiangcheng District.

Dr.Zhu Lieping, serves as the technical director and has extensive experience and profound professional knowledge in the field of membrane technology. He led the strategic transformation of Tbmc towards quality improvement and efficiency enhancement. Through technological innovation and resource integration, he enhanced the company's competitiveness in the reverse osmosis membrane and seawater desalination markets. He led the team to develop high chemical durability reverse osmosis membrane products, which have excellent performance and are widely used in seawater desalination, wastewater reuse, and other fields. He advocated the concept of "reverse osmosis + Internet", and developed a cloud platform software for tracking the operation and diagnosing faults of RO systems, improving the quality of after-sales service.

Chen Feibiao currently serves as the Product Director at SHW Technologies (Shanghai) Co., Ltd.. He graduated from the School of Mechanical Engineering at Huazhong University of Science and Technology in 2006, obtaining a master's degree. From June 2006 to April 2024, he worked at SMEE, where he held various positions including member of the lithography system team, head of the lithography measurement subsystem, leader of the metrology discipline, member of the optoelectronic subcommittee, manager of the special products department, and director of bonding products. He has been granted over 140 authorized invention patents.

Founder and CEO of Ju Shi Technology (Shanghai) Co., Ltd: Responsible for product strategy development and specific implementation, responsible for the management of the company's core technology and product development. Introduced talents of dual-creation in Jiangsu Province, academician of Bell Labs Institute of Technology (ALTA), senior member of IEEE/IEICE, senior member of CCF, former head of the IETF Global Internet Protocol Working Group, participated in and dominated a number of international standards in mobile computing and networking. He has rich experience in machine learning, semiconductor, cloud computing, big data, IoT, etc., rich experience in industry, rich experience in product and system design and technology, and owns more than 50 global technology patents and more than 40 papers in the above fields; he has directly led 7 national projects in the above fields.

Donald Tsai, a seasoned expert in the semiconductor industry with nearly 30 years of extensive experience, has successfully led multiple large-scale semiconductor projects. These projects span critical areas such as new fab construction, manufacturing system upgrades, and the intelligentization of semiconductor equipment.

With a forward-thinking vision, Mr.Tasi has actively introduced AI and big data technologies, infusing smart elements into production processes. His initiatives have significantly enhanced production efficiency and intelligent capabilities, propelling wafer fabs from traditional automated production to new heights of smart manufacturing. His contributions have laid a solid technological foundation for sustained corporate growth.

Bin Liu, Ph.D. in Electrical Engineering from the National University of Singapore, oversees the company's technology strategy planning, core R&D, and commercialization. Under his leadership, IKAS has successfully developed and deployed a series of globally leading intelligent semiconductor manufacturing systems. These include core products such as intelligent production scheduling, big data platform, semiconductor Copilot system, and equipment intelligence solutions. His efforts have enabled the domestic substitution of key technologies and significantly enhanced the production efficiency of semiconductor enterprises.

Senior Engineer with nearly 30 years of experience in chip design, integrated circuit manufacturing, and market development. He/She currently serves as Marketing Director of Yuexin Semiconductor Technology Co., Ltd., deeply involved in the layout, development, and marketization of multiple key process platforms and projects at Yuexin Semiconductor, and committed to building the integrated circuit industry ecosystem and promoting the localization of chip manufacturing.

Prof Siyuan Yu is a senior professor at the School of Electronics and Information Engineering, Sun Yat-sen University, Guangzhou, China. He is a Fellow of OPTICA and Editor-in-Chief of Photonics Research Journal. His research activities cover optical physics， photonic and optoelectronic materials, devices and photonic integrated circuits (PIC) as well as optical communications and optical computing.

Canxiong Lai received the Ph.D. degree in Condensed Matter Physics in 2010 from Sun Yat-sen University, China. He currently works at National Key Laboratory of Science and Technology on Reliability Physics and Application of Electronic Component, China Electronic Product Reliability and Environmental Testing Research Institute, as a senior engineer. His research interests include failure analysis, accelerated testing, and reliability evaluation for optoelectronic devices.

Cai Yan is Senior Technical Director of Shanghai Industrial μTechnology Research Institute, Researcher and Doctoral Supervisor of Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences. She has been selected into the National High-level Young Talents and the Overseas High-level Talents of the Chinese Academy of Sciences. She received her doctorate from the Massachusetts Institute of Technology (MIT) in the United States. Her research directions include novel silicon photonics devices and the integration of silicon photonics process platforms, and she is committed to promoting the industrialization of silicon photonics technology in the fields of optical communication, sensing and imaging.

Yu Xie, male, born in 1985, is a native of Guangxi. From 2004 to 2014, he studied at the School of Optoelectronic Information, University of Electronic Science and Technology of China, where he obtained his Bachelor's, Master's and Doctoral degrees. During his doctoral studies, he attended one of the three major optical centers in the United States, majoring in Optical Engineering. He has a profound and innovative understanding of optoelectronics, semiconductor-related processes and their equipment.

Qiang Hu, deputy director of the semiconductor technology research department of Jihua Laboratory, has been engaged in the research of semiconductor equipment and components for 16 years. With 16 years of research experience in the field of semiconductor equipment and components, Dr.Hu has led his team to develop China's first II-group oxide semiconductor MOCVD equipment and the country's first high-temperature MOCVD equipment for AlN materials with a capacity of over 50 wafers. In collaboration with the Institute of Microelectronics, he co-developed China's first in-situ monitoring equipment for MOCVD.Dr.Hu has participated in numerous key projects, including the National "863" Program "Development of Next-Generation Large-Scale MOCVD Equipment", the National Energy Administration Application Demonstration Project "R&D and Industrialization of Large-Scale MOCVD Equipment", the Chinese Academy of Sciences Knowledge Innovation Project "Development of Multi-Wafer MOCVD Key Equipment", as well as Guangdong Provincial Strategic Emerging Industry Special Projects such as "Localization of MOCVD Equipment" and "Process Innovation for Domestic MOCVD Equipment".

Currently serving as Deputy Chief Engineer and Senior Researcher at the 58th Research Institute of China Electronics Technology Group Corporation (CETC), he specializes in integrated circuit and electronic component research. Having led or participated in over 10 national and provincial-level scientific research projects, he has published more than 10 academic papers and contributed to multiple national standards. His leadership roles include Director of the Management Committee at Jiangsu Integrated Circuit Testing and Reliability Engineering Center, Chief Technical Expert at China National Integrated Circuit Standard Verification Center, Deputy Secretary-General of China Testing and Inspection Alliance, member of National Military Standards Technical Committee, and committee member of China Electronics Society's Reliability Branch

Mr. Jiangang Han is employed at cybertechnologies GmbH, Germany, with over ten years of professional experience in optical topography measurement. He specializes in delivering high-precision measurement solutions to leading clients in the global semiconductor industry. His core expertise lies in designing and implementing customized optical topography measurement schemes for complex and demanding measurement requirements. Leveraging his deep understanding of semiconductor manufacturing processes and advanced measurement technologies, he successfully applies cutting-edge techniques to real-world production challenges, ensuring the precise execution of complex measurement tasks and the effective implementation of solutions.

With over 20 years of experience in the semiconductor inspection

equipment industry, Seddy Chu spent 15 years at leading fabs and internationally renowned inspection equipment companies, where he was responsible for market development and application support for metrology and particle defect inspection tools in China.

He joined ZAS in 2021, where he has led initiatives in both market expansion and technology development. Under his leadership, ZAS metrology system—benchmarked against KLA’s tools—was rapidly developed, validated, and commercialized, with nearly 20 units now installed across domestic fabs.

He also played a key role in market research and strategic direction for Zas’s non-patterned particle inspection systems. Following the release of a system with 19nm sensitivity designed to meet 14nm high-volume manufacturing (HVM) requirements, he quickly drove market penetration in China, securing demo orders from several major customers.

Defect inspection technology expert, currently serving as Deputy Head of the Semiconductor Division at Suzhou TZTEK Technology Co., Ltd. Previously headed the Yield Enhancement and Metrology & Inspection Department at a domestic chip manufacturing company.

Graduated from Beijing Institute of Technology, Senior Engineer, and expert at the Beijing Municipal Science & Technology Commission. With over a decade of industry experience, he has been engaged in the R&D of semiconductor metrology and inspection equipment.

As a key technical contributor, he has participated in multiple national-level research projects, including:

Three projects under the National Science and Technology Major Project "Extremely Large-Scale Integrated Circuit Manufacturing Equipment and Complete Process" (02 Special Project)

Two projects under the National Key R&D Program "Development of Major Scientific Instruments and Equipment"

With strong engineering expertise in semiconductor optical metrology and inspection, he has contributed to the development and industrialization of several domestically produced semiconductor optical measurement and inspection systems.

Richard NIE currently serves as the General Manager of the Business Division of Yuwei Semiconductor Technology Co.,Ltd. With over a decade of expertise in semiconductor optical inspection equipment, he has been instrumental in advancing cutting-edge solutions in this field.YUWEITEK has developed the Raptor series, providing the industry with photomask pattern defect inspection solutions tailored for mature process nodes. This equipment addresses a long-standing market gap and has been successfully deployed in photomask and wafer production scenarios.At this forum, Mr. Nie will delve into the key challenges and demands in domestic photomask inspection, engaging with attendees to explore future industry trends and product development directions.

Mr. Ge Liang is the Director of Business Development and Test Technology Architecture Department of Advantest China, responsible for the development, implementation and market expansion of new technologies/businesses in the field of SOC test. He has more than 15 years of experience in the semiconductor test industry, and has been engaged in R&D, application and marketing work related to chip ATE tests for a long time.

Mr. Sicheng Zhao is currently serving as the Product Director of the R&D Center of Herch Opto Electronic Technology Co., Ltd.

He was selected as a Young Innovative Talent by the 2024 Xi'an Talent Program .

He holds a Bachelor's degree in Chemical and Biomolecular Engineering from the Georgia Institute of Technology in the United States and a Master's degree in Advanced Mechanical Engineering from Sheffield Hallam University in the UK.

Previously, he worked as a Sales Engineer at Focuslight Technology, technical support for the German market, and served as a Product Development and Engineering Expert in the Semiconductor Laser Division.

With extensive experience in the laser and ‌Photonics field, he specializes in the design of beam shaping combining lasers and micro-optics, as well as the innovative research and development and process development of new products and manufacturing equipment.

Fang Wenqiang, Vice President of Post-Sales Process Technology at Shanghai Bangxin Semiconductor Technology Co., Ltd.

He holds a Master's degree in Mechanical Design and Theory from Shanghai Jiao Tong University. With 20 years of experience in wafer fab etching process technology and operations management, he has worked at SMIC (Semiconductor Manufacturing International Corporation) and Intel Dalian. He has contributed to the establishment of three 12-inch wafer fabs and led multiple cross-border (U.S., Singapore) technology transfer and rapid mass production ramp-up projects, demonstrating extensive expertise in technology migration and high-volume manufacturing (HVM).

In 2023, he joined Bangxin Semiconductor, where he oversees post-sales process support for the company.

Liu Ming, Director of the Customer Center at Huaxin (Jiaxing) Intelligent Manufacturing Co., Ltd. Graduated with a degree in Automation from Beijing Institute of Technology and has nearly 10 years of experience in the field of pan-semiconductor automation. During his tenure, he led the introduction of China's first 10.5-generation panel line AMHS project and has been extensively involved in the R&D of MCS/OHTC systems.

Mr. Denny Yu has over 20 years of experience in semiconductor equipment technology development and sales, primarily serving leading advanced packaging manufacturers both domestically and internationally. Currently, he serves as the Deputy General Manager of the Marketing Department at Suzhou Xinrui Technology, where he is responsible for technical and sales guidance.

From 2022 to present: General Manager,CAPT Semiconductor Technology Co., Ltd.

From 2013 to 2022: Inneng Technology Co., Ltd.

Prior to founding Wisdom Capital, Mr. Fisher Liu held key positions at SMIC and AMEC. During his tenure at AMEC, Fisher led the company’s IPO on the SSE STAR Market and drove multiple strategic investments across the semiconductor industry, generating significant economic returns and strategic synergies for AMEC.

Chen Tingwen, Vice President of Shanghai Jinqiao Lingang Comprehensive Zone Investment & Development Co., Ltd. Overseeing high-tech industrial planning and full lifecycle operations for integrated circuits, aviation and aerospace in Lingang New Area, she possesses extensive experience in investment attraction and cluster cultivation. Having successfully attracted over 20 leading enterprises in semiconductor equipment, materials and other specialized sectors, she spearheads the construction of Jinqiao Lingang's integrated circuit industrial ecosystem.

Wang Jun is the Chairman and Founding Partner of MTM Capital, with over 20 years of experience in semiconductor investment and risk management. He has participated in the management of ICF Phase I and several specialized semiconductor funds, covering over 100 projects across key segments such as equipment, materials, manufacturing, and packaging. He has been deeply involved in the development of China’s leading integrated circuit companies.

Zhu Peiwen serves as Chairman and General Manager of Jiangsu Shenzhou Semiconductor Technology Co., Ltd. With nearly two decades of deep expertise in semiconductor equipment, he has led the development of core technologies including a high-dissociation-rate, corrosion-resistant remote plasma source. These innovations address critical "bottleneck" challenges in chip manufacturing, with related patents filling domestic technology gaps and enabling domestic replacement of multiple key equipment types. Under his leadership, Shenzhou Semiconductor has successfully commercialized semiconductor RF power supplies and remote plasma sources, pioneering domestic substitution in advanced process nodes. The company serves over 350 Fab customers worldwide and has secured strategic investment from the National Integrated Circuit Industry Investment Fund Phase II.

Zhang Peng, Partner of TEDA Venture, holds Master's degree from the University of Electronic Science and Technology of China. With extensive experience spanning multiple years in the semiconductor industry and over a decade in semiconductor investment, he has spearheaded investments in more than 80 semiconductor projects. Among these, numerous companies have achieved successful IPOs, including: Rockchip Electronics, Chipown Micro-electronics, CHIPSEA Technologies, Sunlord Electronics, National Chip Technology, Maxscend Technologies, Fortior Tech, NOVOSENSE Microelectronics, Ningsemi, WeTest Semiconductor, BIWIN Storage, Jingyi Semiconductor Equipment, Brite Semiconductor, and Semicena. Additionally, multiple semiconductor projects are currently undergoing review for listing on the STAR Market.

Zhaoxiang Wang, a Doctor of Physical Chemistry from the University of Science and Technology of China, has applied for over 70 patents. He has won the Shanghai Science and Technology Award several times.As a member of the expert group for the Ministry of Science and Technology’s Qingfeng Forum on the Innovative Development of the Integrated Circuit Industry, he led the research and mass production of TSMC's 7/5/3nm etching equipment. With 19 years of experience in semiconductor equipment process development, Dr. Wang currently oversees the overall operations of Bangxin Semiconductor and leads etching process R&D. He has directed several major projects , including high-tech transformation projects in Shanghai, technological upgrades in the Lingang New Area, new product research and development. He is a two-time recipient of the Shanghai Science and Technology Award, earning both second and third prizes.

Zhang Hui, Master of Inorganic Chemistry; Deputy Secretary General of China Integrated Circuit Component Innovation Alliance; The project leader of the National "02" Science and Technology Major Project "Development and Industrialization of Key Components"; Young female scientist from Science and Technology Daily; The 15th Women's Representative of Beijing Municipality; Beijing's "YiQiLin" outstanding talents. The current General Manager of Beijing Yisemi Precision Semiconductor Co., Ltd. is fully responsible for the company's operation and management.

Paul Xu，senior executive director and sponsor representative of the TMT industry department of Guotai Haitong Investment Banking Division.

With 15 years of experience in investment banking, he dominated or participated in the IPO of YiTang（屹唐半导体） IPO （semiconductor equipment）, ZhaoXin（兆芯集成）IPO （chip design）, YiHuaTong（亿华通） IPO （hydrogen energy）, JingChen（晶晨股份） IPO （chip design）, YongYou（用友汽车）IPO （industrial software），HuaGuang（华光源海）IPO （first share of freight forwarding and shipping ）, JingJiaWei（景嘉微）IPO and refinancing（chip design）, KeKao（可靠股份）IPO, Zhaoyi（兆易创新）merger and acquisition, BaoGang（宝钢股份）non-public offering, Chuanhua（传化股份）non-public offering, Changjiang Media（长江传媒）non-public offering, Longqi（龙旗科技）financial advisor, etc., having rich practical experience in investment banking.

Li Jialong, General Manager of Beijing Heguang Smart Energe Technology Co., Ltd. and Deputy Secretary-General of the Truth Semi Group, has nearly three decades of experience in the HVAC industry. Dedicated to energy conservation in the electronics and semiconductor sectors, he has initiated the Green Facility Forum series with the Truth Semi Group's support since 2021. Multiple forums are held annually to build an interactive ecosystem for green facility management, contributing to the green and low-carbon development of the electronics and semiconductor industry.

Yin Guohai, Chairman of Jiangsu Xinyuan Semiconductor Co., Ltd.From 1987 to 1998, he served as Packaging Engineer, Deputy Technical Manager, and Deputy Factory Manager at Huajing; from 1998 to 2003, he served as Deputy Factory Manager of Sales at Huajing Packaging Factory; from 2003 to 2009, he served as Deputy General Manager of Marketing at Huarun Ansheng Technology; in 2010, he served as General Manager of Anhui Guojing Microelectronics. He is currently the Chairman of Jiangsu Xinyuan Semiconductor Co., Ltd. and also serves as a Senior Strategic Development Advisor to Hangzhou Changchuan Technology Co., Ltd. He is the Vice Chairman and Executive Council Member of the Truth Semi Group.

Commercial Pump Product Manager at Leo Pump Industry, primarily responsible for permanent magnet motors and corresponding pump product management. Intermediate Engineer with over eight years of experience in the pump industry. Possesses in-depth expertise in pump application scenarios and solution development for semiconductor plant utility systems.