Forum on the Interaction of Manufacturing Processes and Semiconductor Equipment Industry Chain Development

Forum on the Interaction of Manufacturing Processes and Semiconductor Equipment Industry Chain Development

This forum showcases cutting-edge semiconductor equipment and process technologies, highlighting the synergistic relationship between "each generation of equipment, materials, and processes leading to a new generation of products." We aim to establish a collaborative "process-equipment-materials" triangle model. Our speakers, primarily from industry technology and marketing departments, will present equipment solutions based on advanced processes such as EUV lithography and atomic layer deposition (ALD). The presentations will also cover new features of semiconductor production lines, as well as next-generation semiconductor design concepts and intelligent equipment.

TIME

Thursday, September 4th, 09:30-12:10

Venue

Hall A3, Taihu International Expo Center, Wuxi, China

Theme semiconductor equipment and process technologies

 

Forum on the Interaction of Manufacturing Processes and Semiconductor Equipment Industry Chain Development
Meeting time September 4th, 09:30-12:10
Meeting address Hall A3, Taihu International Expo Center, Wuxi, China
  • Synergizing new qualities, succeeding with innovations
    Herman Lee
    Senior Vice President, Chongqing Xinlian Microelectronics Co., Ltd.
  • The Breakthrough Path for Small and Medium-sized Semiconductor Equipment Companies in the diversified and competitive Situation
    Feng Liu
    VP, Deputy General Manager of Sales Center, Advanced Materials Technology &Engineering Co., Ltd.
  • The cornerstone of advanced packaging: the collaborative innovation of SDBG process solution
    Desmond Hor
    General manager, Jiangsu Leadlap Semiconductor Technology Co., Ltd.
  • Defect inspection technology and equipments in Semiconductor chip manufacturing
    Knight Xu
    Senior Vice President, Zhongdao Optoelectronic Equipment Co.,Ltd.
  • ADA SEMI promotes the localization of wire bonder and advanced packaging equipment
    Johnson
    Sales Director, Guangdong ADA Semiconductor Equipment Ltd.
  • Challenges and Opportunities of Electroplating Technology in the Field of 3D Chip Integration
    Zhaowei Jia
    Vice President,ACM Research (Shanghai), Inc.
  • Introduction to 12-Inch Semiconductor Fabrication Plant Cleanroom Systems
    SUN BIN
    Sales Manager, Wuhan Huakang Century Clean Technology Co., Ltd
  • LSUTER Device: Advanced Driver for High-Precision Semiconductor Defect Detection
    Tianye Wang
    Solution Director, LUSTER LightTech Co., Ltd.
Special Guests of the Conference
Shula Ruan
Deputy Secretary General of the Integrated Circuit Branch of the China Semiconductor Industry Association
Herman Lee
Senior Vice President, Chongqing Xinlian Microelectronics Co., Ltd.
Feng Liu
VP, Deputy General Manager of Sales Center, Advanced Materials Technology &Engineering Co., Ltd.
Desmond Hor
General manager, Jiangsu Leadlap Semiconductor Technology Co., Ltd.
Knight Xu
Senior Vice President, Zhongdao Optoelectronic Equipment Co.,Ltd.
Johnson
Sales Director, Guangdong ADA Semiconductor Equipment Ltd.
Zhaowei Jia
Vice President,ACM Research (Shanghai), Inc.
SUN BIN
Sales Manager, Wuhan Huakang Century Clean Technology Co., Ltd
Tianye Wang
Solution Director, LUSTER LightTech Co., Ltd.