Semiconductor Equipment and Core Components Supporting New Progress Forum

Semiconductor Equipment and Core Components Supporting New Progress Forum

The R&D level of semiconductor equipment and core components is an important indicator to measure the capability of semiconductor manufacturing processes, which is related to the competitiveness and future development trends of the entire industry. Guests at this forum will conduct in-depth discussions on the current status of the coordinated development of equipment, core components, and process capabilities, as well as the interaction between them.

TIME

Thursday, September 4th,09:30-17:30

Venue

Hall B1, Taihu International Expo Center, Wuxi, China

Theme Semiconductor Equipment and Core Components Supporting New Progress Forum

 

Semiconductor Equipment and Core Components Supporting New Progress Forum
Meeting time Thursday, September 4th,09:30-17:30
Meeting address Hall B1, Taihu International Expo Center, Wuxi, China
  • Naura Supply Security Assurance
    ChenQing
    Supply Chain President, Beijing NAURA Microelectronics Equipment Co.,Ltd.
  • Ultra-thin Film Technology and Its Applications in Advanced Processes
    Xinyi Chen
    R&D VP, Piotech, Inc
  • Microwave Plasma – High-efficiency Treatment Technology for Fluorine-containing Exhaust Gas (PFCS)
    ZhouYibin
    Deputy General Manager, Firsquare Environmental Technology (Jiangsu) Co.,Ltd.
  • The application of domestic high-performance motion control systems in precision semiconductor equipment
    Dr.Lu Hailiang
    CTO,Jiangsu JITRI SKS Technologies Co., Ltd.
  • Challenges and Future of Domestic lon Implantation Equipment
    Tick Cai
    Technical director, Hwatsing Technology Co.,Ltd.
  • From searching beyond the ‘Microscope’ to achieving breakthroughs within the ‘Core’
    Lauren Cui
    Project General Manager, Nasikey Semiconductor Co., Ltd.
  • Market and Technology Development of Power Modules
    Shenyang Cao
    Technical Marketing Engineer, ASMPT SEMI Equipment (Shanghai) Co.,Ltd.
  • The Application of Precision Motion Platforms in Semiconductor Field
    Lujie Qu
    Senior Technical Advisor of Shenzhen Cronus Technology Co., Ltd. & Director of Guangdong Semiconductor Ultra Precision Motion Platform Engineering & Technology Research Center
  • Coordinated development of semiconductor fab and the improvement of localization
    Norman Huang
    Vice President,Chongqing Xinlian Microelectronics Co., Ltd.
  • Becoming a world-class manufacturer of advanced process semiconductor plasma systems
    Zhu Peiwen
    Chairman & General Manager of Jiangsu Shenzhou Semiconductor Technology Co., Ltd.
  • SUSS Hybrid Bonding Platform:Pioneering the Next Generation of 2.5D/3D Advanced Packaging
    Shi Suning
    Product Manager, SUSS MicroTec SE
  • Filtration and Separation Technology Exploration for Semiconductor Industry
    QUEQIAOYING
    technical support manager, Feature-Tec (Shanghai) Advanced Materials
  • The application and innovative development of magnetic levitation bearingless pumps in semiconductor wet processing.
    Max Xu
    Sales Director,, Panther Technology (Shenzhen) Co., Ltd.
  • How do pneumatic fluid components adapt to the development of semiconductor manufacturing
    Sunny Lou
    Founder&Co-Chairman and President,ZHE JIANG ETERNAL AUTOMATION SCI-TEC Co., Ltd.
  • Introduction to produced high-purity fluoropolymer components in semiconductor wet processes.
    WangXuesong
    Development Director, Jiangsu OKFLON Precision Manufacturing Co.,Ltd.
  • Daikin Fluoromaterials in the Semiconductor Industry
    John
    Sales Director, DATIKIN TSINQYAN ADVANCED TECHNOLOGIES(HUIZHOU)CO.,LTD.
  • How Advanced Gas Delivery Systems Ensure Cleanliness and Yield in Semiconductor Manufacturing
    Baohua Wang
    Product Manager,GENTEC (SHANGHAI) CORPORATION
  • Ion Implanter for SiC power devices of Nissin Ion Equipment Co., Ltd.
    Zhao Weijiang
    Vice President, Nissin Allis Ion Equipment (Shanghai) Co., Ltd.
  • Mutual Benefit Semiconductor Advanced Packaging TGV Turnkey Line Machines Total Solution
    Lawrence Fong
    Chairman, Mutual Benefit Semiconductor (Shenzhen)Co., Ltd.
  • Principle and Application of High-Precision Pressure Gauges for Semiconductors
Special Guests of the Conference
Zhao Weijiang
Vice President, Nissin Allis Ion Equipment (Shanghai) Co., Ltd.
ZhouYibin
Deputy General Manager, Firsquare Environmental Technology (Jiangsu) Co.,Ltd.
Dr.Lu Hailiang
CTO,Jiangsu JITRI SKS Technologies Co., Ltd.
Tick Cai
Technical director, Hwatsing Technology Co.,Ltd.
Lauren Cui
Project General Manager, Nasikey Semiconductor Co., Ltd.
Norman Huang
Vice President,Chongqing Xinlian Microelectronics Co., Ltd.
Liansheng Cao
Vice President,Amber Intelligence Semiconductor Equipment (shanghai) Company
Lujie Qu
Senior Technical Advisor of Shenzhen Cronus Technology Co., Ltd. & Director of Guangdong Semiconductor Ultra Precision Motion Platform Engineering & Technology Research Center
Shenyang Cao
Technical Marketing Engineer, ASMPT SEMI Equipment (Shanghai) Co.,Ltd.
QUEQIAOYING
technical support manager, Feature-Tec (Shanghai) Advanced Materials
Max Xu
Sales Director,, Panther Technology (Shenzhen) Co., Ltd.
Shi Suning
Product Manager, SUSS MicroTec SE
Zhu Peiwen
Chairman & General Manager of Jiangsu Shenzhou Semiconductor Technology Co., Ltd.
Baohua Wang
Product Manager,GENTEC (SHANGHAI) CORPORATION
John
Sales Director, DATIKIN TSINQYAN ADVANCED TECHNOLOGIES(HUIZHOU)CO.,LTD.
WangXuesong
Development Director, Jiangsu OKFLON Precision Manufacturing Co.,Ltd.
Sunny Lou
Founder&Co-Chairman and President,ZHE JIANG ETERNAL AUTOMATION SCI-TEC Co., Ltd.
ChenQing
Supply Chain President, Beijing NAURA Microelectronics Equipment Co.,Ltd.
Xinyi Chen
R&D VP, Piotech, Inc
Lawrence Fong
Chairman, Mutual Benefit Semiconductor (Shenzhen)Co., Ltd.