Forum on the Interaction of Manufacturing Processes and Semiconductor Equipment Industry Chain Development

Forum on the Interaction of Manufacturing Processes and Semiconductor Equipment Industry Chain Development

This forum showcases cutting-edge semiconductor equipment and process technologies, highlighting the synergistic relationship between "each generation of equipment, materials, and processes leading to a new generation of products." We aim to establish a collaborative "process-equipment-materials" triangle model. Our speakers, primarily from industry technology and marketing departments, will present equipment solutions based on advanced processes such as EUV lithography and atomic layer deposition (ALD). The presentations will also cover new features of semiconductor production lines, as well as next-generation semiconductor design concepts and intelligent equipment.

TIME

September 5th,09:30-12:10

Venue

Hall A3, Taihu International Expo Center, Wuxi, China

Theme semiconductor equipment and process technologies

 

Forum on the Interaction of Manufacturing Processes and Semiconductor Equipment Industry Chain Development
Meeting time September 5th,09:30-12:10
Meeting address Hall A3, Taihu International Expo Center, Wuxi, China
  • New Progress in the Localization of the Supply Chain for the Silicon Carbide Manufacturing Industry
    Zhang Ting
    Director, GTA semiconductor company
  • Guiding the Way: Top-level Planning for Semiconductor Factory Construction
    Hua Jindong
    Deputy Chief Engineer of East China Region, China Electronics System Engineering No.2 Construction Co., Ltd.
  • The Development History of Advanced Packaging and TGV Critical Technologies
    Kevin Tsai
    GM of the Equipment Manufacturing Division, Zhejiang Houji Technology Co. Ltd
  • Technological Breakthroughs and Innovations in Semiconductor Wafer Transfer Robot
    Jacky Lin
    CEO&CTO, HONGHU (SuZhou) Semiconductor Technology Co.,LTD.
  • Toray membrane technology helps achieve energy-efficient production of industrial pure water and high-value reuse of wastewater
    Dr.ZHU LIEPING
    CTO, Toray Bluestar Membrane Co.,Ltd
  • Efficient and non-destructive ultra-high vacuum direct bonding technology
    Chen Feibiao
    Product Director, SHW Technologies (Shanghai) Co., Ltd.
  • Precision Vision and Deep Learning for Wafer Defect Inspection
    Jun Zheng
    CEO, Matrixtime Robotics Co.,Ltd.
  • Embodied Intelligence in Semiconductor Equipment: Evolving from Sensing to Autonomy
    Donald Tsai
    Automation Engineering Division Deputy Director, Nexchip Semiconductor Corporation
    Dr. Liu Bin
    CTO, IKAS Holdings (Beijing) Co., Ltd.
Special Guests of the Conference
Dazhang Pei
Senior Executive of the China Electronic Production Equipment Industry
Zhang Ting
Director, GTA semiconductor company
Hua Jindong
Deputy Chief Engineer of East China Region, China Electronics System Engineering No.2 Construction Co., Ltd.
Kevin Tsai
GM of the Equipment Manufacturing Division, Zhejiang Houji Technology Co. Ltd
Jacky Lin
CEO&CTO, HONGHU (SuZhou) Semiconductor Technology Co.,LTD.
Dr.ZHU LIEPING
CTO, Toray Bluestar Membrane Co.,Ltd
Chen Feibiao
Product Director, SHW Technologies (Shanghai) Co., Ltd.
Jun Zheng
CEO, Matrixtime Robotics Co.,Ltd.
Donald Tsai
Automation Engineering Division Deputy Director, Nexchip Semiconductor Corporation
Dr. Liu Bin
CTO, IKAS Holdings (Beijing) Co., Ltd.