China Electronic Professional Equipment Industry Association Semiconductor Equipment Annual Conference Main Forum

China Electronic Professional Equipment Industry Association Semiconductor Equipment Annual Conference Main Forum

The CSEAC 2025 Keynote Forum will gather industry experts and corporate leaders. Through keynote speeches and report releases, it will share industry insights and strategic thinking, and jointly explore industry development trends and future challenges.

Time

Thursday, September 4th, 14:00-17:45

Venue

Hall A4, Taihu International Expo Center, Wuxi, China

Theme

Main Forum

 

China Electronic Professional Equipment Industry Association Semiconductor Equipment Annual Conference Main Forum
Meeting time Thursday, September 4th, 14:00-17:45
Meeting address Hall A4, Taihu International Expo Center, Wuxi, China
  • AI Video Ceremony
  • Leadership Speeches
    Zhao Jinrong
    Chairman of China Electronic Production Equipment Industry Association & Chairman of NAURA Technology Group Co., Ltd.
  • Opportunities and Challenges in Post-Moore Semiconductor Equipment Innovation
    Wang Ping
    Secretary of the Party Committee and General Manager, CETC ELECTRONICS EQUIPMENT GROUP CO., LTD.
  • Progress of Equipment Made in China for IC
    Li Jinxiang
    Vice Secretary General of China Electronics Special Equipment Industry Association - Huada Semiconductor Co., Ltd. - Shanghai Jita Semiconductor Co., Ltd. - Director - Chief Engineer
  • The Innovation Path for the Integrated Circuit Equipment Industry in the AI Era
    Ji Chen
    President, Beijing NAURA Microelectronics Equipment Co., Ltd.
  • Advanced ALD and Bonding equipment enables semiconductor innovations in multiple dimensions
    Lv Guangquan
    Chairman of Tuojing Technology Co., Ltd
  • Breakthrough of Domestic Equipment in the New Landscape: Technological Innovation and Exploration of New Pathways
    Wang Jian
    General Manager of Shengmei Semiconductor Equipment (Shanghai) Co., Ltd
  • Opportunities and Challenges in the Development of Semiconductor Equipment and Materials amid the AI Era
    Xujin Wang
    Academician, Chief Scientist, Institute of Critical Materials for Integrated Circuits, Shenzhen Polytechnic University(Founding Dean of the Institute of Semiconductor Manufacturing Research, Shenzhen University)
  • Development Trends in e-Beam Metrology and Inspection Technology and Current Status of Localization
    Xiao junluo
    SVP, Dongfang Jingyuan Electron CO., LTD.
  • Advanced bonding technology for Semiconductor integration and its applications
    Fengwen Mu
    Founder & Chairman, iSABers Group Co.,Ltd.
  • Review of the Semiconductor Equipment Industry in 2024 and Development Prospects for 2025
    Jin Cunzhong
    Executive Deputy Secretary General of China Electronics Special Equipment Industry Association
  • Welcome Banquet
Special Guests of the Conference
Zhao Jinrong
Chairman of China Electronic Production Equipment Industry Association & Chairman of NAURA Technology Group Co., Ltd.
Wang Ping
Secretary of the Party Committee and General Manager, CETC ELECTRONICS EQUIPMENT GROUP CO., LTD.
Li Jinxiang
Vice Secretary General of China Electronics Special Equipment Industry Association - Huada Semiconductor Co., Ltd. - Shanghai Jita Semiconductor Co., Ltd. - Director - Chief Engineer
Zhiyue Wang
Ji Chen
President, Beijing NAURA Microelectronics Equipment Co., Ltd.
Lv Guangquan
Chairman of Tuojing Technology Co., Ltd
Wang Jian
General Manager of Shengmei Semiconductor Equipment (Shanghai) Co., Ltd
Xujin Wang
Academician, Chief Scientist, Institute of Critical Materials for Integrated Circuits, Shenzhen Polytechnic University(Founding Dean of the Institute of Semiconductor Manufacturing Research, Shenzhen University)
Xiao junluo
SVP, Dongfang Jingyuan Electron CO., LTD.
Fengwen Mu
Founder & Chairman, iSABers Group Co.,Ltd.
Jin Cunzhong
Executive Deputy Secretary General of China Electronics Special Equipment Industry Association