2024 Forum on Advanced Packaging Technology and Equipment-Materials Collaborative Development
2024 Forum on Advanced Packaging Technology and Equipment-Materials Collaborative Development
| Meeting time | Thursday, September 26 13:30-17:00 |
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| Meeting address | Hall A1, Taihu International Expo Center, Wuxi, China |
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Ada wire bonder and advanced packaging equipment
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SUSS Hybrid Bonding Technology
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Enable And Extend Processing Capabilities Within The Fab By ProTec´s Unique Electrostatic Fixation Technologies
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Advanced packaging in the age of AI
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Semiconductor dicing and precision dispensing process sharing
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Plating Process and Equipment
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Double side Copper-Sintering at 170°C for Power Electronics
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Application of Grinding, Lapping and Polishing in the Semiconductor Industry and Domestic Solutions
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Heterogeneous Wafer Level Integration
Special Guests of the Conference
He Yunbo
Chairman of Guangdong Ada Intelligent Equipment Co., Ltd
Zhou Yun
Director of Precision Cutting Division of Shenzhen Tengsheng Precision Equipment Co., Ltd
Desmond Hor
Deputy General Manager ,Jiangsu Leadlap Semiconductor Technology Co.Ltd
Ben Zhou
Sales Director, SUSS MicroTec (Shanghai) Ltd.
Devin Liu
General Manager, Shenzhen Dream Launch Semiconductor Equipment Co., Ltd.