2024 Forum on the Interaction of Manufacturing Processes and Semiconductor Equipment Industry Chain Development
2024 Forum on the Interaction of Manufacturing Processes and Semiconductor Equipment Industry Chain Development
| Meeting time | Thursday, September 26 09:30-16:30 |
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| Meeting address | Hall B1, Taihu International Expo Center, Wuxi, China |
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Introduction of E-beam metrology & inspection
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New progress in localization of semiconductor manufacturing supply chain
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Thin-film technology and integrated circuit equipment – challenges, opportunities and solutions
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Domestical Nanoscale Broad Band Bright Field Inspection Equipment Booster Integrated Circuit Manufacturing Yield Improvement
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Challenges for Wafer Inspection
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The Challenges of Semiconductor & Advanced Packaging Failure Analysis and ZEISS Microscopy Solutions
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Exploration of the Localization of Metal Materials Based on Atomic Layer Deposition
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GC Equipment Introduction & SGS Safety Design
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Application of High Power RF Devices in Photovoltaic Semiconductors
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Sharing of High Quality Reuse Technology for Reclaimed Water
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Industrialization Progress of Kingstone Ion Implanters
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Advanced emissions technology boost semiconductor ESG
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Innovation and Evolution of Lithography technology for advanced semiconductor manufacturing
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Development Trends of Automotive Semiconductor
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AI-Enabled Edge Applications, Outlook for Semiconductor Investment
Special Guests of the Conference
Xu Kaidong
Chairman and CEO of Jiangsu Luwen Instrument Co., Ltd
Coast Yan
Deputy Head of Suzhou TZTEK Technology Co.,Ltd.
Chengliang Huang
BD Manager, ZEISS
Jin Cunzhong
Executive Deputy Secretary General of China Electronics Special Equipment Industry Association
Bruce.Zhang
VP, Kingstone Semiconductor Joint Stock Company Limited
LewisLU
Product&Application Director, Shanghai Shareway Environment Co., Ltd.
Xu Jingrui
Vice President of Zhongdao Optoelectronic Equipment Co., Ltd
YANZHAO
CEO, SiScan Technology Co. Ltd.
ZhangTing
Director, GTA Semiconductor Co., Ltd
Wang Chuandao
VP, Pioneer Semiconductor Research Co., Ltd
Danny Ding
GC Division Deputy General Engineer, CESE2
Zhoulei
General Manager, Shanghai Huaxiang Computer Communication Engineering Co., Ltd.
Wang Chengyi
Technical Research Institute, R&D Director, China Electronics Innovation Environmental Technology Co., Ltd
Bruce.Zhang
VP, Kingstone Semiconductor Joint Stock Company Limited
Lewis LU
Shanghai Shareway Environment Co., Ltd. Product&Application Director
JackChen
CTO, AeblTech Shanghai Co. Ltd.
Adela Guo
AP Research Director, IDC Consulting