Special Forum on New Progress in Semiconductor Equipment and Core Component Matching
Against the backdrop of rapid technological iteration and increasingly fierce market competition, the matching progress of semiconductor equipment and core components is no longer just a technical issue, but also a strategic issue related to the fate and future development of the entire industry chain. This special forum will delve into the core issues in this field, aiming to gather industry elites and jointly find solutions.
Meeting time | 2023年8月9日 09:00-17:00 |
---|---|
Meeting venue | Hall A6, the Taihu Lake International Expo Center, Wuxi |
Conference theme | Semiconductor equipment and core components |
Contact Us

Mr.Huang
general manager
Phone | 13917571770(Same WeChat account) |
---|---|
hg@cseac.org.cn | |
Address | 2108 Bao'an Building, No. 800 Dongfang Road, Shanghai |