Semiconductor Packaging and Testing Special Equipment and Material Ecological Innovation Cooperation Forum
This forum will focus on the latest technologies, market trends, and industrial ecology of semiconductor packaging and testing equipment and materials. The attendees will gain a deeper understanding of the research and development progress, application scenarios, and market prospects of sealing and testing equipment and materials, and jointly explore the challenges and opportunities faced by the industry. At the same time, the forum will also invite industry experts, business leaders, and technology innovators to share their successful experiences and innovative ideas, providing valuable cooperation opportunities for attendees. Through this forum, we hope to build an exchange platform for the semiconductor packaging and testing specialized equipment and materials industry ecosystem, promoting deep cooperation and resource sharing among enterprises. We will jointly explore how to strengthen technological innovation, optimize industrial ecology, and expand market applications to drive the sustainable development of the semiconductor packaging and testing industry.
| Meeting time | 2023年8月9日 09:00-12:10 |
|---|---|
| Meeting venue | Hall A1, the Taihu Lake International Expo Center, Wuxi |
| Conference theme |
Semiconductor packaging and testing specialized equipment, material ecological innovation, exploring the challenges and opportunities faced by the industry, and sharing experiences |
sponsor
