New Product Launch

New Product Launch Session

With the rapid development of technology, the semiconductor industry continues to produce innovative achievements, bringing revolutionary changes to various fields. In order to showcase the latest semiconductor products and technologies and promote the development of the industry, we have specially planned this grand semiconductor new product launch event.
This event will bring together top semiconductor companies from around the world, who will bring their latest research and development products, covering the entire industry chain of chip design, manufacturing, packaging and testing. These new products will showcase the latest technological breakthroughs and innovation capabilities in the industry, leading the trend of industry development.
At the event, you will have the opportunity to watch a series of amazing new product releases, such as next-generation processors, sensors, memory, and more. These new products have significant improvements in performance, power consumption, integration, and will provide strong support for the development of artificial intelligence, the Internet of Things, cloud computing, intelligent driving, and other fields.

Meeting time 2023年8月9-10日
Meeting venue Hall A5, the Taihu Lake International Expo Center, Wuxi
Conference theme New product launch

Contact Us

黄先生

市场部

电话 13917571770(微信同号)
邮箱 hg@cseac.org.cn
地址 上海市东方路800号宝安大厦2108
下载联系方式
New product release on August 9th
Meeting time 2023年8月9日
Meeting address Hall A5, the Taihu Lake International Expo Center, Wuxi
  • Yu Wende, Senior Director of Technology at Suzhou Xinrui Technology Co., Ltd., released an introduction to 12 inch bonding and debonding equipment
  • Wang Chi, Chairman of Suzhou Aike Ruisi Intelligent Equipment Co., Ltd., Releases "High Precision Hybrid Bonding Equipment from Nanoscale Chips to Wafers"
  • Zhang Jichen, Product Manager of the Automatic Optical Testing Division of Shanghai Microelectronics Equipment (Group) Co., Ltd., released the "SOI800 Series Fully Automatic Optical Defect Detection Equipment"
  • Dr. Ye Guoguang, Deputy General Manager of Wuxi Yiwen Electronic Technology Co., Ltd., delivered a speech titled "Third Generation Semiconductor 8-inch Thin Film Etching Equipment"
  • Dr. Luo Jiwei, Vice President of Products at Yanwei (Jiangsu) Semiconductor Technology Co., Ltd., delivered a speech titled "(High Yield) High-K ALD Thin Film Deposition Equipment"
  • Sun Qianchao, Brand Leader of Wuxi Wenxian Microelectronics Co., Ltd., Releases "Automotive Grade High Edge Drive Switch and Energy Chain Semiconductor Solution"
  • Peng Chunyan, Director of Intelligent Engineering at Jiaxing Jingyan Intelligent Equipment Technology Co., Ltd., delivered a speech titled "High density and ultra-thin chip stacking and solidification machine"
  • Jiaxing Qingfei Optoelectronics Co., Ltd. CEO Shi Rui delivers a speech titled "Wire Bond 3D AOI"
New product release on August 10th
Meeting time 2023年8月10日
Meeting address Hall A5, the Taihu Lake International Expo Center, Wuxi
  • Wang Xiaoliang, pre-sales manager of Shenyang Heyan Technology Co., Ltd., delivers a speech on "Wafer Grinding Machine"
  • Wang Yonggang, R&D Manager of Nippon Intelligent Equipment Technology (Shenzhen) Co., Ltd., delivered a speech titled "IC lamination machine WBD2200 Plus"
  • Xu Hui, General Manager of Intelligent Silicon Source Integrated Circuit Design (Wuxi) Co., Ltd., delivered a speech titled "Medium and High Voltage Power Supply and Driver Chip Project"
  • Wei Binru, Key Account Sales Manager of Jiangsu Leibo Microelectronics Equipment Co., Ltd., delivers a speech on "New Homemade Aligner Lithography Machine"
  • Wang Wenjun, Senior Process Director of Shengmei Semiconductor Equipment (Shanghai) Co., Ltd., delivered a speech on "Front Glue Development Track Equipment"
  • Dr. Li Weiming, Vice Chairman and Chief Technology Officer of Jiangsu Weidao Nano Technology Co., Ltd., and Nie Jiaxiang, Senior Sales Director of Jiangsu Weidao Nano Technology Co., Ltd. jointly released the iTomic ® "MW Series Batch Atomic Layer Deposit
  • Wu Guosheng, founder of Ruobe (Wuxi) Microelectronics Co., Ltd., delivered a speech titled "Autonomous Controllable High Performance Universal Computing Chips"
Special Guests of the Conference